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Contents

README

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TMUX1308AQPWRQ1

Texas Instruments · Analog Switches, Multiplexers · TSSOP-16

TMUX1308AQPWRQ1 from Texas Instruments, in a TSSOP-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 S4 bidirectional Source pin 4 of the 8:1 mux; the signal path can be an input or output.
2 S6 bidirectional Source pin 6 of the 8:1 mux; the signal path can be an input or output.
3 D bidirectional Common drain pin of the 8:1 mux; the signal path can be an input or output.
4 S7 bidirectional Source pin 7 of the 8:1 mux; the signal path can be an input or output.
5 S5 bidirectional Source pin 5 of the 8:1 mux; the signal path can be an input or output.
6 EN input Active-low enable input: when high all switches are turned off, and when low the A[2:0] address inputs select the on switch.
7 N.C. unconnected Not internally connected.
8 GND power_in Ground (0 V) reference.
9 A2 input Address line 2, which sets the switch configuration as listed in Section 8.5.
10 A1 input Address line 1, which sets the switch configuration as listed in Section 8.5.
11 A0 input Address line 0, which sets the switch configuration as listed in Section 8.5.
12 S3 bidirectional Source pin 3 of the 8:1 mux; the signal path can be an input or output.
13 S0 bidirectional Source pin 0 of the 8:1 mux; the signal path can be an input or output.
14 S1 bidirectional Source pin 1 of the 8:1 mux; the signal path can be an input or output.
15 S2 bidirectional Source pin 2 of the 8:1 mux; the signal path can be an input or output.
16 VDD power_in Positive power supply, the most positive supply potential; for reliable operation connect a 0.1 µF to 10 µF decoupling capacitor between VDD and GND.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package TSSOP-16
Category Interface
Pins 16

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
On-state switch resistance (1.8V) RON 650 1700 Ω VS = 0V to VDD, ISD = 0.5mA, VDD = 1.8V; typ at 25°C, max at TA = -40°C to 125°C 10
On-state switch resistance (2.5V) RON 230 670 Ω VS = 0V to VDD, ISD = 0.5mA, VDD = 2.5V; typ at 25°C, max at TA = -40°C to 125°C 10
On-state switch resistance (3.3V) RON 120 370 Ω VS = 0V to VDD, ISD = 0.5mA, VDD = 3.3V; typ at 25°C, max at TA = -40°C to 125°C 10
On-state switch resistance (5V) RON 75 270 Ω VS = 0V to VDD, ISD = 0.5mA, VDD = 5V; typ at 25°C, max at TA = -40°C to 125°C 10
On-state switch resistance matching between inputs (1.8V) ΔRON 10 45 Ω VS = VDD/2, ISD = 0.5mA, VDD = 1.8V; typ at 25°C, max at TA = -40°C to 125°C 10
On-state switch resistance matching between inputs (2.5V) ΔRON 3 22 Ω VS = VDD/2, ISD = 0.5mA, VDD = 2.5V; typ at 25°C, max at TA = -40°C to 125°C 10
On-state switch resistance matching between inputs (3.3V) ΔRON 2 15 Ω VS = VDD/2, ISD = 0.5mA, VDD = 3.3V; typ at 25°C, max at TA = -40°C to 125°C 10
On-state switch resistance matching between inputs (5V) ΔRON 1 14 Ω VS = VDD/2, ISD = 0.5mA, VDD = 5V; typ at 25°C, max at TA = -40°C to 125°C 10
Source off-state leakage current (1.8V) IS(OFF) -800 800 nA Switch off, VD = 0.8 x VDD/ 0.2 x VDD, VS = 0.2 x VDD/ 0.8 x VDD, VDD = 1.8V; TA = -40°C to 125°C 10
Source off-state leakage current (2.5V) IS(OFF) -800 800 nA Switch off, VD = 0.8 x VDD/ 0.2 x VDD, VS = 0.2 x VDD/ 0.8 x VDD, VDD = 2.5V; TA = -40°C to 125°C 10
Source off-state leakage current (3.3V) IS(OFF) -800 800 nA Switch off, VD = 0.8 x VDD/ 0.2 x VDD, VS = 0.2 x VDD/ 0.8 x VDD, VDD = 3.3V; TA = -40°C to 125°C 10
Source off-state leakage current (5V) IS(OFF) -800 800 nA Switch off, VD = 0.8 x VDD/ 0.2 x VDD, VS = 0.2 x VDD/ 0.8 x VDD, VDD = 5V; TA = -40°C to 125°C 10
Drain off-state leakage current, common drain pin (1.8V) ID(OFF) -800 800 nA Switch off, VD = 0.8 x VDD/ 0.2 x VDD, VS = 0.2 x VDD/ 0.8 x VDD, VDD = 1.8V; TA = -40°C to 125°C 10
Drain off-state leakage current, common drain pin (2.5V) ID(OFF) -800 800 nA Switch off, VD = 0.8 x VDD/ 0.2 x VDD, VS = 0.2 x VDD/ 0.8 x VDD, VDD = 2.5V; TA = -40°C to 125°C 10
Drain off-state leakage current, common drain pin (3.3V) ID(OFF) -800 800 nA Switch off, VD = 0.8 x VDD/ 0.2 x VDD, VS = 0.2 x VDD/ 0.8 x VDD, VDD = 3.3V; TA = -40°C to 125°C 10
Drain off-state leakage current, common drain pin (5V) ID(OFF) -800 800 nA Switch off, VD = 0.8 x VDD/ 0.2 x VDD, VS = 0.2 x VDD/ 0.8 x VDD, VDD = 5V; TA = -40°C to 125°C 10
Source off capacitance (1.8V) CSOFF 2 14 pF VS = VDD/2, f = 1MHz, VDD = 1.8V 10
Source off capacitance (2.5V) CSOFF 2 14 pF VS = VDD/2, f = 1MHz, VDD = 2.5V 10
Source off capacitance (3.3V) CSOFF 2 14 pF VS = VDD/2, f = 1MHz, VDD = 3.3V 10
Source off capacitance (5V) CSOFF 2 14 pF VS = VDD/2, f = 1MHz, VDD = 5V 10
Drain off capacitance (1.8V) CDOFF 7 37 pF VS = VDD/2, f = 1MHz, VDD = 1.8V 10
Drain off capacitance (2.5V) CDOFF 7 37 pF VS = VDD/2, f = 1MHz, VDD = 2.5V 10
Drain off capacitance (3.3V) CDOFF 7 37 pF VS = VDD/2, f = 1MHz, VDD = 3.3V 10
Drain off capacitance (5V) CDOFF 7 37 pF VS = VDD/2, f = 1MHz, VDD = 5V 10
On capacitance (1.8V) CSON/CDON 11 40 pF VS = VDD/2, f = 1MHz, VDD = 1.8V 10
On capacitance (2.5V) CSON/CDON 11 40 pF VS = VDD/2, f = 1MHz, VDD = 2.5V 10
On capacitance (3.3V) CSON/CDON 11 40 pF VS = VDD/2, f = 1MHz, VDD = 3.3V 10
On capacitance (5V) CSON/CDON 11 40 pF VS = VDD/2, f = 1MHz, VDD = 5V 10
VDD supply current (1.8V) IDD 1 1.2 µA Logic inputs = 0V or VDD, VDD = 1.8V; max at TA = -40°C to 125°C 10
VDD supply current (2.5V) IDD 1 1.5 µA Logic inputs = 0V or VDD, VDD = 2.5V; max at TA = -40°C to 125°C 10
VDD supply current (3.3V) IDD 1 2 µA Logic inputs = 0V or VDD, VDD = 3.3V; max at TA = -40°C to 125°C 10
VDD supply current (5V) IDD 1 3 µA Logic inputs = 0V or VDD, VDD = 5V; max at TA = -40°C to 125°C 10
Input logic high (1.8V) VIH 0.95 5.5 V VDD = 1.8V; TA = -40°C to 125°C 11
Input logic high (2.5V) VIH 1.1 5.5 V VDD = 2.5V; TA = -40°C to 125°C 11
Input logic high (3.3V) VIH 1.15 5.5 V VDD = 3.3V; TA = -40°C to 125°C 11
Input logic high (5V) VIH 1.25 5.5 V VDD = 5V; TA = -40°C to 125°C 11
Input logic low (1.8V) VIL 0 0.6 V VDD = 1.8V; TA = -40°C to 125°C 11
Input logic low (2.5V) VIL 0 0.7 V VDD = 2.5V; TA = -40°C to 125°C 11
Input logic low (3.3V) VIL 0 0.8 V VDD = 3.3V; TA = -40°C to 125°C 11
Input logic low (5V) VIL 0 0.95 V VDD = 5V; TA = -40°C to 125°C 11
Logic high input leakage current IIH 1 uA VLOGIC = 1.8V or VDD; all supply voltages; TA = -40°C to 125°C 11
Logic low input leakage current IIL -1 uA VLOGIC = 0V; all supply voltages; TA = -40°C to 125°C 11
Logic input capacitance CIN 1 2 pF VLOGIC = 0V, 1.8V, VDD; f = 1MHz 11
Supply voltage (absolute maximum) VDD -0.5 6 V Over operating free-air temperature range; voltages with respect to GND 8
Logic control input pin voltage (absolute maximum) VSEL or VEN -0.5 6 V Logic control input pins EN, A0, A1, A2; over operating free-air temperature range 8
Source or drain voltage (absolute maximum) VS or VD -0.5 V Sx, D pins; printed maximum is VDD+1.0 V 8
Logic control input pin current ISEL or IEN -30 30 mA EN, A0, A1, A2 pins 8
Continuous current through switch (absolute maximum, -40°C to +85°C) IS or ID (CONT) -50 50 mA Sx, D pins; TA = -40°C to +85°C 8
Continuous current through switch (absolute maximum, -40°C to +125°C) IS or ID (CONT) -25 25 mA Sx, D pins; TA = -40°C to +125°C 8
Total power dissipation Ptot 500 mW TSSOP package; derates linearly above TA = 80°C by 7.2 mW/°C 8
Storage temperature Tstg -65 150 °C 8
Junction temperature TJ 150 °C 8
Supply voltage (recommended) VDD 1.62 5.5 V Over operating free-air temperature range 9
Logic control input pin voltage (recommended) VSEL or VEN 0 5.5 V EN, A0, A1, A2 pins; over operating free-air temperature range 9
Continuous current through switch (recommended, -40°C to +85°C) IS or ID (CONT) -50 50 mA Sx, D pins; TA = -40°C to +85°C 9
Continuous current through switch (recommended, -40°C to +125°C) IS or ID (CONT) -25 25 mA Sx, D pins; TA = -40°C to +125°C 9
Ambient temperature (recommended) TA -40 125 °C Operating free-air temperature 9
Junction-to-ambient thermal resistance (PW TSSOP) RθJA 139 °C/W TMUX1308-Q1, PW (TSSOP) package 9
Junction-to-case (top) thermal resistance (PW TSSOP) RθJC(top) 77.2 °C/W TMUX1308-Q1, PW (TSSOP) package 9
Junction-to-board thermal resistance (PW TSSOP) RθJB 84.2 °C/W TMUX1308-Q1, PW (TSSOP) package 9

CAD (KiCad official)

  • Symbol: TMUX1308AQPWRQ1
  • Footprint: Package_SO:TSSOP-16_4.4x5mm_P0.65mm
  • 3D model: TSSOP-16 (KiCad packages3D, STEP)
  • 3D model files: tmux1308aqpwrq1-etched.step / tmux1308aqpwrq1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tmux1308aqpwrq1.step / tmux1308aqpwrq1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (52 pp, sha256 6cff7c1303c44ba5, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF