tmp75: white body in tscircuit (pre-1.8 etch structure under an assembly instance); Ray 2026-10-19: black IC body with…
tmp75: component.models_3d pose record per STEP (Z-up, seated z=0, pad-centre origin, identity binding)
tmp75: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero
tmp75: laser-etched CAD + chip hero (factory 2.0.0 backfill)
tmp75: laser-etched CAD + chip hero (factory 2.0.0 backfill)
tmp75: backfill missing artifacts (etch, variants)
add validated EAGLE .lbr (Fusion library)
TMP75: validated Fusion/EAGLE library + adom-lbr hub, generated from this page's KiCad sources
add .step (Fusion 3D source)
viewers: adom-lbr per-slot symbol + footprint
component: full datasheet-first definition
Initial commit: component/tmp75