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Contents

README

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TMP423BIDCNR

Texas Instruments · Temperature and Humidity Sensor · SOT-23-8

TMP423BIDCNR from Texas Instruments, in a SOT-23-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 DXP1 input Channel 1 positive connection to remote temperature sensor diode/transistor. Sources a switched bias current (6-120µA) into the remote junction for BJT/diode temperature measurement.
2 DXP2 input Channel 2 positive connection to remote temperature sensor diode/transistor. Sources a switched bias current (6-120µA) into the remote junction for BJT/diode temperature measurement.
3 DXP3 input Channel 3 positive connection to remote temperature sensor diode/transistor. Sources a switched bias current (6-120µA) into the remote junction for BJT/diode temperature measurement.
4 DXN input Common negative connection shared by all three remote temperature sensor channels (Channel 1, 2, and 3). Tie to the emitter/cathode of each remote sense transistor/diode.
5 GND power_in Device ground reference.
6 SDA bidirectional SMBus serial data line, open-drain. Requires external pull-up resistor to V+. VOL = 0.15V typ at IOUT = 6mA; supports clock rates up to 3.4MHz.
7 SCL input SMBus serial clock line, open-drain. Requires external pull-up resistor to V+. Supports SMBus clock frequencies up to 3.4MHz.
8 V+ power_in Positive supply voltage, 2.7V to 5.5V. Quiescent current ~32µA typical at 0.0625 conv/s; ≤350µA during 3.4MHz SMBus activity.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package SOT-23-8
Category Sensor
Pins 8

Ordering variants

Same part, different packaging or reel option.

  • TMP423BIDCNR
  • TMP423BIDCNT

CAD (KiCad official)

  • Symbol: TMP423BIDCNR
  • Footprint: Package_TO_SOT_SMD:SOT-23-8
  • 3D model: SOT-23-8 (KiCad packages3D, STEP)
  • 3D model files: tmp423bidcnr-etched.step / tmp423bidcnr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tmp423bidcnr.step / tmp423bidcnr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (36 pp, sha256 b1463c54f57b513f, retrieved 2026-08-17, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF