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TMP126NDCKR

Public Made by Adom

by adom

TEXAS INSTRUMENTS Global Sourcing Parts, SC-70-6. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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Datasheet

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Contents

README

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TMP126NDCKR

TEXAS INSTRUMENTS · Global Sourcing Parts · SC-70-6

TMP126NDCKR from TEXAS INSTRUMENTS, in a SC-70-6. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 CS input Chip select signal to activate the SPI interface; input tolerates -0.3 V to 6 V.
2 GND power_in Ground.
3 SIO bidirectional System data input/output for the 3-wire SPI interface; voltage range -0.3 V to VDD + 0.2 V.
4 SCLK input System clock input for the SPI interface; input tolerates -0.3 V to 6 V.
5 ALERT bidirectional Alert open-drain output that can be left floating or grounded when not used; voltage range -0.3 V to 6 V.
6 VDD power_in Supply voltage, 1.62 V to 5.5 V recommended operating range.

Key specifications

Parameter Value
Manufacturer TEXAS INSTRUMENTS
Package SC-70-6
Category Global Sourcing Parts
Pins 6

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Temperature accuracy TMP126N TERR -0.8 0.8 °C -40 °C to 150 °C, 1-Hz conversion cycle 5
Active conversion time tCONV 4.5 6 7.5 ms 5
Timing variation tVAR -15 15 % Conversion Period, Slew Rate Result, Slew Rate Limit 5
Input logic high level VIH 0.7 V SCLK, SIO, CS; min 0.7 * VDD, max VDD 5
Input logic low level VIL 0 0.3 V SCLK, SIO, CS; max 0.3 * VDD 5
Input leakage current IIN -0.5 0.5 μA SCLK, SIO, CS 5
SIO output low level VOL 0 0.4 V IOL = -3 mA 5
ALERT output logic low level VOL 0 0.4 V IOL = -3 mA 5
Supply current during active conversion IDD_ACTIVE 77 135 μA CS = VDD, TA = -55 °C to 150 °C (max); typ 77 at TA = 25 °C 6
Average current consumption IDD 1 16 μA CS = VDD, conversion cycle time: 1 Hz, TA = -55 °C to 150 °C (max) 6
Standby current ISB 0.5 15 μA CS = VDD, TA = -55 °C to 150 °C (max) 6
Shutdown current ISD 0.35 15 μA CS = VDD, TA = -55 °C to 150 °C (max) 6
SCLK frequency fCLK 10 MHz 7
SCLK Period tCLK 100 ns 7
CS falling to SCLK rising setup tLEAD 100 ns 7
SCLK rising to CS rising setup tLAG 20 ns 7
SIO to SCLK rising edge setup tSU 10 ns 7
SIO hold time after SCLK rising edge tHOLD 20 ns 7
SCLK falling to valid SIO data tVALID 35 ns 7
CS rising to SIO high-impedance tSIO(DIS) 200 ns 7
SIO, SCLK, CS rise time tRISE 100 ns 7
SIO, SCLK, CS fall time tFALL 100 ns 7
Delay between SPI sequences (CS high) tINTERFRAME 100 ns 7
Delay between valid VDD and initial SPI communication tINITIATION 0.5 ms 7
Supply voltage VDD -0.3 6 V 4
I/O voltage SIO -0.3 0.2 V max VDD + 0.2 V 4
I/O voltage CS, ALERT, SCLK -0.3 6 V 4
Operating junction temperature TMP126N TJ -45 155 °C TMP126N 4
Storage temperature Tstg -65 180 °C 4
ESD HBM V(ESD) -2000 2000 V Human-body model per JESD22-A114 4
ESD CDM V(ESD) -750 750 V Charged-device model per JESD22-C101 4
Supply voltage VDD 1.62 3.3 5.5 V 4
I/O voltage SIO VI/O 0 V max VDD 4
I/O voltage CS, ALERT, SCLK VI/O 0 5.5 V 4
Operating ambient temperature TMP126N TA -40 150 °C TMP126N 4
Junction-to-ambient thermal resistance RθJA 183.4 °C/W DCK (SC70) 6 pins 4
Junction-to-case (top) thermal resistance RθJC(top) 136.4 °C/W DCK (SC70) 6 pins 4
Junction-to-board thermal resistance RθJB 74.2 °C/W DCK (SC70) 6 pins 4
Junction-to-top characterization parameter ψJT 57.9 °C/W DCK (SC70) 6 pins 4
Junction-to-board characterization parameter ψJB 74 °C/W DCK (SC70) 6 pins 4
DC power supply rejection PSR 12.7 m°C/V One-shot mode 5
Temperature resolution LSB TRES 31.25 m°C LSB 5
Long-term stability and drift TLTD 0.07 °C 1000 hours at 175 °C 5
Power-on reset threshold voltage VPOR 1.3 V Supply rising 6

CAD (KiCad official)

  • Symbol: TMP126NDCKR
  • Footprint: Package_TO_SOT_SMD:SOT-363_SC-70-6
  • 3D model: SC-70-6 (KiCad packages3D, STEP)
  • 3D model files: tmp126ndckr-etched.step / tmp126ndckr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tmp126ndckr.step / tmp126ndckr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: TEXAS INSTRUMENTS datasheet (49 pp, sha256 6d9bab59b2814422, retrieved 2026-10-27, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF