# TMP1075DSGR

Texas Instruments TMP1075 digital temperature sensor (I2C/SMBus, 1.7 to 5.5 V), in the 8-pin WSON 2 x 2 mm DSG package with an exposed thermal pad.

## Pins

| pin | name | |
|---|---|---|
| 1 | SDA | I2C data |
| 2 | SCL | I2C clock |
| 3 | ALERT | over-temperature alert output |
| 4 | GND | ground |
| 5 | A2 | address select |
| 6 | A1 | address select |
| 7 | A0 | address select |
| 8 | V+ | supply |
| 9 | EP | exposed thermal pad: solder it to the PCB thermal pad (datasheet "EXPOSED PAD 9") |

## Files

- Symbol `TMP1075DSGR.kicad_sym`, footprint `WSON-8-1EP_2x2mm_P0.5mm_EP0.9x1.6mm.kicad_mod` (KiCad's DSG land pattern) and the Fusion/EAGLE library `TMP1075DSGR.lbr`.
- 3D: KiCad's WSON-8 model (`TMP1075DSGR.step`), the same model with the part name etched on top (`TMP1075DSGR-etched.step` / `.glb`) and the annotated hero (`TMP1075DSGR-hero.glb`). Both STEPs pass the Z-up / seated / centred pose check.
- The TI datasheet, `TMP1075DSGR-datasheet.pdf`.

Built with the published Adom skills (adom-ds2sf, adom-symbol, service-kicad, adom-chip-laser, step2glb, adom-lbr, component-page-verify). The symbol carries a generic chip picture until a real outline is made.