# TMI8837S

**TMI** · Brushed DC Motor Drivers · SOP-8

TMI8837S from TMI, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VM | power_in | Power supply for the driver: connect a 0.1μF ceramic bypass capacitor to GND, and a bulk capacitor of at least 22μF on VM to GND is needed to stabilize VM during motor operation; VM range is 1.8V to 11V. |
| 2 | OUT1 | output | Motor driver output 1 (H-bridge output); voltage is limited to -0.3V to Vin+0.3V per the absolute maximum ratings. |
| 3 | OUT2 | output | Motor driver output 2 (H-bridge output); voltage is limited to -0.3V to Vin+0.3V per the absolute maximum ratings. |
| 4 | GND | power_in | Ground pin. |
| 5 | IN2 | input | PWM input 2 controlling the H-bridge; logic inputs are rated -0.3V to 7V absolute maximum, with thresholds referenced to VCC. |
| 6 | IN1 | input | PWM input 1 controlling the H-bridge; logic inputs are rated -0.3V to 7V absolute maximum, with thresholds referenced to VCC. |
| 7 | EN | input | Chip enable input: logic low puts the device into low-power sleep mode and logic high enables normal operation; it has an internal 100kΩ pull-down to GND and is rated -0.3V to 7V. |
| 8 | VCC | power_in | Power supply for logic inputs, 1.8V to 7V; connect a 0.1μF ceramic bypass capacitor to GND. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | TMI |
| Package | SOP-8 |
| Category | Motor Driver ICs |
| Pins | 8 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Recommended Voltage Range VM | VM | 1.8 |  | 11 | V |  | 3 |
| Operating Junction Temperature Range | TJ | -40 |  | 125 | °C |  | 3 |
| VM Voltage Range |  | -0.3 |  | 11 | V |  | 2 |
| VCC, IN1, IN2, EN Voltages Range |  | -0.3 |  | 7 | V |  | 2 |
| OUT1, OUT2 Voltage Range |  | -0.3 |  |  | V |  | 2 |
| Storage Temperature Range |  | -50 |  | 150 | °C |  | 2 |
| Junction Temperature |  | -40 |  | 150 | °C |  | 2 |
| VM Voltage Range | VVM | 1.8 |  | 11 | V |  | 4 |
| VCC Voltage Range | VVCC | 1.8 |  | 7 | V |  | 4 |
| VM sleep mode supply current | IVMQ |  | 45 | 95 | nA | VM=5V, VCC=3V, Sleep Mode | 4 |
| VCC sleep mode supply current | IVCCQ |  | 17 | 35 | nA | VM=5V, VCC=3V, Sleep Mode | 4 |
| Input Logic Low Voltage Falling Threshold | VIL_F | 0.25 |  | 0.4 | x VCC |  | 4 |
| Input Logic High Voltage Rising Threshold | VIH_R | 0.5 |  | 0.6 | x VCC |  | 4 |
| Input Logic Low Current | IIL | -5 |  | 5 | μA |  | 4 |
| Output Switch Leakage Current | ILEAK | -200 |  | 200 | nA |  | 4 |
| Over Current Protection | IOCP | 1.6 |  | 1.75 | A |  | 4 |
| Output Enable time | T1 |  | 180 | 265 | ns | VIN=5V, TA = 25°C | 5 |
| Output Disable time | T2 |  | 70 | 100 | ns | VIN=5V, TA = 25°C | 5 |
| Delay Time IN1 low to OUT2 high / IN2 low to OUT1 high | T3 |  | 140 | 215 | ns | VIN=5V, TA = 25°C | 5 |
| Delay Time IN2 high to OUT1 low / IN1 high to OUT2 low | T4 |  | 160 | 240 | ns | VIN=5V, TA = 25°C | 5 |
| Output rise time | T5 |  | 60 | 120 | ns | VIN=5V, TA = 25°C | 5 |
| Output fall time | T6 |  | 38 | 100 | ns | VIN=5V, TA = 25°C | 5 |
| VM Supply Current | IVM |  | 124 |  | μA | VM=5V, VCC=3V, No PWM | 4 |
| VCC Supply Current | IVCC |  | 180 |  | μA | VM=5V, VCC=3V, No PWM | 4 |
| Input logic Hysteresis | VHYS |  | 0.1 |  | x VCC |  | 4 |
| Input Logic High Current | IIH |  | 40 |  | μA |  | 4 |
| Input Pull Down Resistor | RIN |  | 100 |  | kΩ |  | 4 |
| Output Switch On-Resistance (HS+LS) | RON |  | 0.65 |  | Ω | VM=5V, VCC=3V, Iload=800mA | 4 |
| VCC UVLO Voltage | VUVLO |  | 1.7 |  | V |  | 4 |
| UVLO Hysteresis | VUVLO_HY |  | 100 |  | mV |  | 4 |
| Over Current Retry Time | TOCP_RT |  | 1 |  | ms |  | 4 |
| Thermal Shutdown Threshold | TSDN |  | 160 |  | °C |  | 4 |
| Thermal Shutdown Hysteresis | TSDN_HY |  | 20 |  | °C |  | 4 |
| Package Thermal Resistance θJA of SOP8 | θJA |  | 90 |  | °C/W | SOP8 package | 2 |

## CAD (KiCad official)

- Symbol: `TMI8837S`
- Footprint: `Package_SO:SOIC-8_3.9x4.9mm_P1.27mm`
- 3D model: SOP-8 (KiCad packages3D, STEP)
- 3D model files: `tmi8837s-etched.step` / `tmi8837s-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `tmi8837s.step` / `tmi8837s.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [TMI datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588894520373358592) (10 pp, sha256 `8ec751b87f560bb8`, retrieved 2026-10-19, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/tmi8837s-datasheet.pdf)