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TMI8420

TMI · Stepper Motor Driver · HTSSOP-28

TMI8420 from TMI, in a HTSSOP-28. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 CP1 bidirectional Charge-pump flying-capacitor node; a 0.01 µF ceramic capacitor is connected between CP1 and CP2.
2 CP2 bidirectional Charge-pump flying-capacitor node; a 0.01 µF ceramic capacitor is connected between CP2 and CP1.
3 VCP bidirectional Charge-pump output; a 0.1 µF ceramic capacitor is connected between VCP and VM.
4 VMA power_in Motor supply for H-bridges A and B; recommended operating range 8.0 V to 45 V, with a 0.1 µF capacitor to GND plus bulk capacitance, and both VM pins must be on the same supply.
5 AOUT1 output Output pin 1 of H-bridge A, with each H-bridge output rated for up to 2.5 A.
6 ISENA bidirectional Bridge A ground/current-sense terminal, to be connected to ground or to the bridge A current-sense resistor to ground.
7 AOUT2 output Output pin 2 of H-bridge A, with each H-bridge output rated for up to 2.5 A.
8 BOUT2 output Output pin 2 of H-bridge B, with each H-bridge output rated for up to 2.5 A.
9 ISENB bidirectional Bridge B ground/current-sense terminal, to be connected to ground or to the bridge B current-sense resistor to ground.
10 BOUT1 output Output pin 1 of H-bridge B, with each H-bridge output rated for up to 2.5 A.
11 VMB power_in Motor supply for H-bridges A and B; recommended operating range 8.0 V to 45 V, and must be connected to the same supply as VMA.
12 AVREF input External reference setting bridge A winding current; normally tied to BVREF and may connect to V3P3OUT, with recommended range 1 V to 3.5 V.
13 BVREF input External reference setting bridge B winding current; normally tied to AVREF and may connect to V3P3OUT, with recommended range 1 V to 3.5 V.
14 GND power_in Ground pin of the device.
15 V3P3OUT power_out 3.3 V LDO output with a load capability of 10 mA per the recommended operating conditions.
16 nRESET input Active-low reset input that initializes the indexer logic and disables the H-bridge outputs, with an internal pull-down.
17 nSLEEP input Logic high enables the device and logic low puts it into low-power sleep mode, with an internal pull-down.
18 nFAULT output Open-drain output that is pulled low when a fault occurs.
19 DECAY input Decay-mode select: low selects slow decay, open selects mixed decay, and high selects fast decay.
20 DIR input Logic input whose voltage level sets the step direction, with an internal pull-down.
21 nENBL input Logic high disables device outputs and indexer operation, logic low enables them, with an internal pull-down.
22 STEP input A rising edge advances the indexer to the next step, with an internal pull-down.
23 NC unconnected No connection.
24 MODE0 input Step-mode select bit 0 (with MODE1 and MODE2) for full, 1/2, 1/4, 1/8, 1/16 or 1/32 step, with an internal pull-down.
25 MODE1 input Step-mode select bit 1 (with MODE0 and MODE2) for full, 1/2, 1/4, 1/8, 1/16 or 1/32 step, with an internal pull-down.
26 MODE2 input Step-mode select bit 2 (with MODE0 and MODE1) for full, 1/2, 1/4, 1/8, 1/16 or 1/32 step, with an internal pull-down.
27 nHOME output Open-drain output that is pulled low when the motor reaches the home position.
28 GND power_in Ground pin of the device.
29 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer TMI
Package HTSSOP-28
Category Motor Driver ICs
Pins 29

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage VM -0.3 48 V 2
Logic input voltage VIN -0.3 7 V 2
Reference input voltage VVREF -0.3 4 V 2
Output continuous current IOUT 0 2.5 A 2
Operating ambient temperature TOP -40 85 °C 2
Junction temperature TJ -40 150 °C 2
Storage temperature Tstg -60 150 °C 2
ESD human body model VESD -2000 2000 V Human body model, JEDEC JS-001 2
ESD charged device model VESD -750 750 V Charged device model, JEDEC JS-001 2
Operating supply voltage range VM 8 45 V All VM pins connected to the same supply 4
Reference input voltage VVREF 1 3.5 V 4
V3P3OUT load capability IV3P3 10 mA 4
Logic operating frequency fPWM 0 100 kHz 4
VM static current IVM 2 5 mA VM = 24 V, fPWM < 50 kHz 5
VM sleep current IVMQ 1 10 µA VM = 24V 5
VM undervoltage lockout voltage VUVLO 6 8 V VM rising 5
V3P3OUT output voltage V3P3 3.18 3.3 3.4 V IOUT = 0 to 1mA, VM = 24 V, TJ = 25°C 5
V3P3OUT output voltage V3P3 3.1 3.3 3.5 V IOUT = 0 to 1mA 5
Logic low input voltage VIL 0.7 0.8 V 5
Logic high input voltage VIH 1.8 5.25 V 5
Logic low input current IIL -20 20 μA VIN = 0V 5
Logic high input current IIH 35 50 μA VIN = 3.3V 5
Open-drain output low voltage (nFAULT, nHOME) VOL 0.5 V IO = 5mA 5
Open-drain output high leakage current (nFAULT, nHOME) IOH 1 μA VO = 3.3 V 5
DECAY input low threshold voltage VIL 0 1.2 V 慢速衰减模式 5
DECAY input high threshold voltage VIH 1.8 V 快速衰减模式 5
DECAY input current IDECAY -70 70 μA Decay = 5V 5
High-side on-resistance RDS(ON) 0.2 Ω VM = 24 V, IO = 1 A 5
Low-side on-resistance RDS(ON) 0.2 Ω VM = 24 V, IO = 1 A 5
Off-state leakage current IOFF -10 10 μA 5
Rise time tR 20 200 ns VM = 24 V 5
Fall time tF 20 200 ns VM = 24 V 5
Input anti-glitch time tDEG 1.7 2.5 μs 5
xVREF input current IREF -3 3 μA xVREF = 3.3 V 6
xISENSE chopping threshold voltage VTRIP 635 660 685 mV V(xVREF) = 3.3 V, 100% current ratio 6
xISENSE chopping accuracy VTRIP -25 25 % xVREF = 3.3V, 5% current ratio 6
xISENSE chopping accuracy VTRIP -15 15 % xVREF = 3.3V, 10%-34% current ratio 6
xISENSE chopping accuracy VTRIP -10 10 % xVREF = 3.3V, 38%-67% current ratio 6
xISENSE chopping accuracy VTRIP -5 5 % xVREF = 3.3V, 71%-100% current ratio 6
Overcurrent protection level IOCP 4 4.5 5 A 6
Thermal shutdown temperature TSD 150 170 180 °C Designed guarantee per footnote (1) 6

CAD (KiCad official)

  • Symbol: TMI8420
  • Footprint: Package_SO:TSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP2.85x6.7mm
  • 3D model: HTSSOP-28 (KiCad packages3D, STEP)
  • 3D model files: tmi8420-etched.step / tmi8420-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tmi8420.step / tmi8420.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: TMI datasheet (20 pp, sha256 0b8e8cbabaf3877f, retrieved 2026-10-18, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF