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TMI6050-12

TMI · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · SOT-23-5

TMI6050-12 from TMI, in a SOT-23-5. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VIN power_in Input supply of the LDO, operating over 2.5V to 5.5V.
2 GND power_in Signal ground.
3 EN input Enable pin: connect to ground or below 0.4V to disable the device, connect to 1.05V or above to enable it; this pin must not be floated.
4 NC unconnected No connection on the fixed output version (this pin is the FB feedback input only on the adjustable version).
5 VOUT power_out Output of the LDO regulator; in shutdown it is discharged to GND through an internal 130Ω resistor.

Key specifications

Parameter Value
Manufacturer TMI
Package SOT-23-5
Category Power Management (PMIC)
Pins 5

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input Voltage Range VIN 2.5 5.5 V 5
Quiescent Current IQ 75 90 μA VEN=2.5V, IOUT=0mA 5
Shutdown Current ISHDN 0.1 1 μA VEN=0V 5
EN Rising Threshold VENH 0.7 0.9 1.15 V All temperature range 5
EN Falling Threshold VENL 0.45 0.6 0.85 V All temperature range 5
EN Input Current IEN -1 0.2 1 μA VIN=3.5V, VEN=3.5V or 0V 5
Output Voltage Accuracy VOUT -2 2 % VIN=VOUT+1V, IOUT=10mA 5
Output Voltage Accuracy over temperature VOUT -3 3 % VIN=VOUT+1V, IOUT=10mA, TA=-40°C to +85°C 5
Output Line Regulation VLNR 0.01 0.1 %/V VOUT+0.5V<VIN<5.5V, IOUT=10mA 5
Dropout Voltage VDROP 600 700 mV IOUT=600mA 5
Current Limit Ilimit 650 800 mA 5
Input Voltage (VIN, EN pins) VIN, EN -0.3 6 V 2
Voltage on all other pins -0.3 V Printed maximum is (VIN+0.3) V 2
Junction Temperature TJ 160 °C 2
Storage Temperature Range TSTG -65 150 °C 2
Lead Temperature Soldering 260 °C 10 sec 2
Power Dissipation PD 1.1 W Note 1: 3cm x 5cm 2-layer FR-4 board, 1oz copper 2
Power Dissipation PD 0.6 W Note 2: 2cm x 2cm 2-layer small FR-4 board, 1oz copper, no via holes on GND copper 2
ESD Human Body Model, all pins VESD_HBM -2000 2000 V JS-002 (printed ±2000 V) 2
ESD Charged Device Model, all pins VESD_CDM -2000 2000 V JS-002 (printed ±2000 V) 2
Voltage Range IN VIN 2.5 5.5 V 2
Operation Junction Temperature TJ -40 125 °C 2
Junction-to-ambient Thermal Resistance θJA 120 °C/W Note 1: 3cm x 5cm 2-layer FR-4 board, 1oz copper 2
Junction-to-ambient Thermal Resistance θJA 220 °C/W Note 2: 2cm x 2cm 2-layer small FR-4 board, 1oz copper 2
Junction-to-board Thermal Resistance θJB 36 °C/W Note 1 2
Junction-to-case (top) Thermal Resistance θJC(top) 62 °C/W Note 1 2
Junction-to-top characterization parameter ΨJT 11 °C/W Note 1 2
Junction-to-board characterization parameter ΨJB 39.5 °C/W Note 1 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts copper Lead Temperature Soldering, 10sec 260 °C Note 1: Measured on 3cm x 5cm 2-layers FR-4 Board, 1oz copper. 2

CAD (KiCad official)

  • Symbol: TMI6050-12
  • Footprint: Package_TO_SOT_SMD:SOT-23-5
  • 3D model: SOT-23-5 (KiCad packages3D, STEP)
  • 3D model files: tmi6050-12-etched.step / tmi6050-12-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tmi6050-12.step / tmi6050-12.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: TMI datasheet (12 pp, sha256 27c3f99ed549b2f6, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF