TMI33431E

@@ -0,0 +1,50 @@+# TMI33431E++**TMI** · DC-DC Converters · ESOP-8++TMI33431E from TMI, in a ESOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.++## Pinout++| Pin | Name | Type | Function |+|---|---|---|---|+| 1 | BS | passive | High-side gate driver bootstrap pin. Provides supply to the high-side LDMOS gate driver; charged to VSW+5V when the low-side switch is on. Connect a 100nF ceramic capacitor between BS and SW. |+| 2 | IN | power_in | Power input pin. Recommended operating range 4.5V to 30V; absolute maximum 36V. Bypass with local ceramic decoupling to GND. |+| 3 | EN | input | Enable input with an internal 5V Zener clamp. Drive to logic high (rising threshold ~1.15V) to enable the converter; drive low to enter micro-power shutdown. Must not be left floating; if pulled up to VIN via a resistor, keep EN sink current below 1mA. |+| 4 | SS | passive | Soft-start and tracking pin. An external capacitor to GND, charged by an internal 2.6µA current source, sets the internal 0.8V reference rise time (tSS = CSS·VREF/ISS). The SS pin voltage overrides the internal reference during startup. |+| 5 | FB | input | Feedback pin for the error amplifier. Connect to the mid-point of an external R1/R2 divider from VOUT to GND; the loop regulates FB to the internal 0.8V reference (VFBTH typ 800mV, ±2%). FB pin bias current is ±50nA max. |+| 6 | COMP | output | External loop compensation node; error-amplifier output. Connect an R-C network to GND to set the control-loop bandwidth and phase margin for peak current-mode operation. |+| 7 | GND | power_in | Ground reference and return for the controller. Tie to the exposed thermal pad and the system power ground plane. |+| 8 | SW | power_out | Switch node; common source of the internal high-side and low-side power MOSFETs. Connect to the external power inductor. Absolute-max range −0.3V to 36V (−5V to 38V for <10ns transients). |+| EP | EP | power_in | Exposed thermal pad, internally connected to Power GND. Solder to a large PCB ground copper area for thermal dissipation and low-impedance power return. |++## Key specifications++| Parameter | Value |+|---|---|+| Manufacturer | TMI |+| Package | ESOP-8 |+| Category | PMIC |+| Pins | 9 |++## Ordering variants++Same part, different packaging or reel option.++- `TMI33431E`++## CAD (KiCad official)++- Symbol: `TMI33431E`+- Footprint: `Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.29x3mm`+- 3D model: ESOP-8 (KiCad packages3D, STEP)++## Provenance++Data extracted from the manufacturer datasheet, not a distributor listing:++- **Datasheet:** [TMI datasheet](docs/tmi33431e-datasheet.pdf) (15 pp, sha256 `a7aa4912dfad3f7f`, retrieved 2026-08-17, tier: lcsc)+- **Extractor:** `ds2sf` (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.+- **CAD:** KiCad official libraries (CC-BY-SA 4.0).++[Datasheet PDF](docs/tmi33431e-datasheet.pdf)

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