component
TMI3343
Public Made by Adomby adom
TMI DC-DC Converters, ESOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownTMI3343
TMI · DC-DC Converters · ESOP-8
TMI3343 from TMI, in a ESOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | BS | passive | High-side gate driver bootstrap pin supplying the high-side LDMOS gate driver; connect a 100nF capacitor between BS and SW. |
| 2 | IN | power_in | Power input pin, operating range 4.5V to 30V. |
| 3 | SW | power_out | Switch pin connected to the external inductor. |
| 4 | GND | power_in | Ground pin. |
| 5 | FB | input | Feedback pin with 0.8V reference threshold (784-816mV), used to set the output voltage through a resistor divider. |
| 6 | COMP | passive | External compensation pin for the peak current mode error amplifier output. |
| 7 | EN | input | Logic-high enables the IC and logic-low disables it into micro-power shutdown; must not be left floating and EN sink current must stay below 1mA. |
| 8 | SS | passive | Soft-start and tracking pin; an external capacitor sets the internal reference rise time and the pin voltage overrides the internal reference. |
| 9 | GND | power_in | Ground exposed pad; connect to the power ground copper area with copper and vias. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | TMI |
| Package | ESOP-8 |
| Category | Power Supply Chip |
| Pins | 9 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Input Supply Voltage, SW | -0.3 | 33 | V | 2 | |||
| LX to GND (20ns transient) | -5 | 35 | V | 20ns transient | 2 | ||
| BS to SW Voltage | -0.3 | 6 | V | 2 | |||
| All Other Pins (FB, EN, SS, COMP) Voltage | -0.3 | 6 | V | 2 | |||
| PG to GND | -0.3 | 14 | V | 2 | |||
| Junction Temperature | TJ | -40 | 150 | °C | 2 | ||
| Storage Temperature Range | -50 | 150 | °C | 2 | |||
| Lead Temperature (Soldering, 10s) | 260 | °C | Soldering, 10s | 2 | |||
| ESD Human Body Model | VESD | -2000 | 2000 | V | HBM for all pins, JEDEC JS-001 | 3 | |
| Voltage Range | VIN | 4.5 | 30 | V | 3 | ||
| Junction-to-ambient thermal resistance | θJA | 60 | °C/W | 3 | |||
| Input Voltage Range | VIN | 4.5 | 30 | V | VIN=12V, VOUT=5V, TA = 25°C | 4 | |
| Under Voltage Lockout | VUVLO | 4.3 | V | VIN rising | 4 | ||
| UVLO Hysteresis | VUVLO_HY | 0.35 | V | 4 | |||
| Input OVP Voltage | VINOVP | 32 | V | 4 | |||
| Input Quiescent Current | IQ | 0.38 | 0.48 | mA | VFB=1V | 4 | |
| Input Supply Current | IIN | 0.45 | mA | No load | 4 | ||
| Shutdown Current | ISD | 3 | 10 | μA | EN = 0V | 4 | |
| Feedback Threshold Voltage | VFBTH | 784 | 800 | 816 | mV | PWM operation | 4 |
| FB Pin input current | IFB | -50 | 50 | nA | 4 | ||
| EN Rising Threshold | 1 | 1.15 | 1.3 | V | 4 | ||
| EN Hysteresis | 100 | mV | 4 | ||||
| EN sink current | IEN_Sink | 1 | mA | 4 | |||
| Soft start Time | TSS | 1.2 | ms | CSS=NC | 4 | ||
| Soft start Time | TSS | 3.5 | ms | CSS=10nF | 4 | ||
| Current limit cycle-by-cycle | ILIM_MAX | 4.2 | A | 4 | |||
| SW leakage | ISW_LEAK | 10 | μA | 4 | |||
| Switch On-Resistance (high side) | RDSONH | 120 | mΩ | 4 | |||
| Switch On-Resistance (low side) | RDSONL | 80 | mΩ | 4 | |||
| Switching Frequency | FSW | 340 | kHz | 4 | |||
| Minimum Turn-on Time | TON_MIN | 200 | ns | Guaranteed by design | 4 | ||
| Hiccup on Time | 2 | ms | Guaranteed by design | 4 | |||
| Hiccup Time Before Restart | 64 | ms | 4 | ||||
| Maximum Duty-cycle | DMAX | 91 | % | 4 | |||
| Thermal Shutdown Threshold | TSDN | 160 | °C | Guaranteed by design | 4 | ||
| Thermal Shutdown Hysteresis | TSDN_HY | 10 | °C | Guaranteed by design | 4 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | copper | 3) Return FB, COMP and SS/RT to signal GND pin, and connect the signal GND to power GND at a single point for best noise immunity. Connect exposed pad to power ground copper area with copper and | 9 |
CAD (KiCad official)
- Symbol:
TMI3343 - Footprint:
Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm - 3D model: ESOP-8 (KiCad packages3D, STEP)
- 3D model files:
tmi3343-etched.step/tmi3343-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);tmi3343.step/tmi3343.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: TMI datasheet (15 pp, sha256
3bb21f4c0028d0af, retrieved 2026-10-22, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).