Loads when you scroll to it. Unloads after 5 minutes in the background.

Symbol & Footprint

Schematic Symbol

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.

PCB Footprint

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Loads when you scroll to it. Unloads after 5 minutes in the background.
Download PDF
Contents

README

markdown

TMI3331

TMI · DC-DC Converters · ESOP-8

TMI3331 from TMI, in a ESOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 BS power_in High-side gate driver bias pin that supplies the high-side LDMOS gate driver, requiring a 100nF capacitor between BS and SW (absolute maximum BS-to-SW voltage is -0.3 to 6 V).
2 IN power_in Power input pin, with a recommended operating voltage range of 8 V to 30 V and an absolute maximum of 36 V for surge conditions.
3 SW output Switch pin that connects to the external inductor; the absolute maximum SW voltage is -0.3 to 36 V.
4 GND power_in Power ground pin for the converter.
5 FB input Output voltage feedback pin that regulates to an internal 0.8 V reference (784 mV to 816 mV), with input current limited to ±50 nA.
6 CS input Output current sense pin for constant current limit; the CC current is set by a resistor Rcs between CS and GND, giving ILIM = 61.7 mV / Rcs, and CS can be tied to GND to use the internal cycle-by-cycle peak current limit.
7 EN input Enable pin, with a logic high threshold of at least 1.5 V and a logic low threshold of at most 0.3 V.
8 FSW input Switching frequency set pin; a resistor sets the frequency from 130 kHz (floating) to 500 kHz (shorted to GND), with RFSW = 300 kΩ giving 310 kHz typical.
9 GND power_in Ground exposed pad that must be connected to the power ground copper area with copper and vias for heat dissipation and noise immunity.

Key specifications

Parameter Value
Manufacturer TMI
Package ESOP-8
Category Power Management (PMIC)
Pins 9

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input Voltage Range VIN 8 30 V 5
Shut-down Current ISD 6 10 uA EN=0V 5
Standby Supply Current of TMI3331 ISTBY 10 15 mA VOUT=5V, No Load 5
Feedback Threshold Voltage VFBTH 784 800 816 mV 5
FB Pin Input Current IFB -50 50 nA 5
Input OVP Voltage VINOVP 31.5 V 5
Output OVP Voltage VOUTOVP 10 20 % 5
Input Voltage Range VIN 8 30 V 4
Operating Junction Temperature Range TJ -40 125 °C 4
IN, SW and EN Voltages -0.3 36 V 3
BS to SW Voltages -0.3 6 V 3
All other pins Voltage -0.3 6 V 3
Junction Temperature TJ -40 150 °C Note 2 3
Storage Temperature -65 150 °C 3
Package Dissipation 2 W 3
Junction-to-ambient Thermal Resistance θJA 60 °C/W 3
Junction-to-case Thermal Resistance θJC 46 °C/W 3
Under Voltage Lockout VUVLO 7.2 V VIN rising 5
UVLO Hysteresis VUVLO_HY 0.6 V 5
Quiescent Supply Current ICCQ 1 mA no load, VFB > 0.83V 5
Soft start Time TSST 4 ms 5
CS Current Limit Voltage VLIM_CS 61.7 mV 5
SW leakage ISW_LEAK 10 uA 5
Maximum Duty Cycle DDUTY 90 % FS=300kHz 5
Switching Frequency FS 310 kHz RFSW=300kΩ 5
Switching Frequency FS 130 kHz FSW pin floating 5
Switching Frequency FS 500 kHz FSW short to GND 5
Switch On-Resistance (H side) RON_HS 80 mΩ By design 5
Switch On-Resistance (L side) RON_LS 60 mΩ By design 5
Short circuit Frequency FSC 35 kHz VFB=0V 5
Minimum Turn-on Time TON_MIN 200 ns 5
EN High Level Input Voltage VEN_H 1.5 V 5
EN Low Level Input Voltage VEN_L 0.3 V 5
Thermal Shutdown Threshold TSDN 155 °C Note 3 (guaranteed by design) 5
Thermal Shutdown Hysteresis TSDN_HY 20 °C Note 3 (guaranteed by design) 5

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts copper 3) Return FB to signal GND pin, and connect the signal GND to power GND at a single point for best noise immunity. Connect exposed pad to power ground copper area with copper and vias. 8

CAD (KiCad official)

  • Symbol: TMI3331
  • Footprint: Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm
  • 3D model: ESOP-8 (KiCad packages3D, STEP)
  • 3D model files: tmi3331-etched.step / tmi3331-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tmi3331.step / tmi3331.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: TMI datasheet (12 pp, sha256 2839d7b5e08d9017, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF