# TMI3286B

**TMI** · DC-DC Converters · ESOP-8

TMI3286B from TMI, in a ESOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | BS | passive | Bootstrap pin; a capacitor connected between LX and BS is required to form a floating supply across the high-side switch driver. |
| 2 | VIN | power_in | Power supply pin; recommended input voltage range is 4.5 V to 18 V. |
| 3 | LX | output | Switching pin; absolute maximum voltage is -0.3 V to 20 V, with transients under 10 ns limited to -4.5 V to 22 V. |
| 4 | GND | power_in | Ground pin. |
| 5 | FB | input | Output voltage feedback input; connect to the center point of the external resistor divider, with absolute maximum voltage of -0.3 V to 6 V. |
| 6 | NC | unconnected | No connection. |
| 7 | EN | input | Drive to logic-high to enable the IC and to logic-low to disable it into micro-power shutdown mode; do not leave EN floating. |
| 8 | NC | unconnected | No connection. |
| 9 | Thermal Pad | power_in | Exposed thermal pad; connect to ground with PCB vias for thermal dissipation. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | TMI |
| Package | ESOP-8 |
| Category | Power Management (PMIC) |
| Pins | 9 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Input Supply Voltage, EN |  | -0.3 |  | 20 | V |  | 2 |
| LX Voltages |  | -0.3 |  | 20 | V |  | 2 |
| LX Voltage (<10ns transient) |  | -4.5 |  | 22 | V | <10ns transient | 2 |
| FB Voltage |  | -0.3 |  | 6 | V |  | 2 |
| BS Voltage |  | -0.3 |  | 23 | V |  | 2 |
| Storage Temperature Range |  | -65 |  | 150 | °C |  | 2 |
| Junction Temperature |  |  |  | 160 | °C | Note 2 | 2 |
| Power Dissipation |  |  |  | 1500 | mW |  | 2 |
| Lead Temperature (Soldering) |  |  |  | 260 | °C | Soldering, 10s | 2 |
| ESD Human Body Model (all pins) | VESD_HBM | -2000 |  | 2000 | V | JEDEC JS-001 | 3 |
| ESD Charged Device Model (all pins) | VESD_CDM | -2000 |  | 2000 | V | JEDEC JS-001 | 3 |
| Voltage Range IN |  | 4.5 |  | 18 | V |  | 3 |
| Operating Junction Temperature | TJ | -40 |  | 125 | °C |  | 3 |
| Feedback Voltage of TMI3286B | VFB | 0.906 | 0.925 | 0.942 | V | TA=25°C | 4 |
| Shutdown Current |  |  | 5 | 10 | μA | VIN=12V, EN=0V | 4 |
| High-Side Switch Leakage Current |  |  | 1 | 10 | μA | VEN=0V, VLX=0V | 4 |
| Oscillation Frequency |  | 370 | 500 | 650 | kHz |  | 4 |
| On Time |  | 150 | 200 | 250 | ns | VIN=12V, VOUT=1.2V, IOUT=1A | 4 |
| Soft Start Time |  | 0.7 | 1 | 1.3 | ms |  | 4 |
| EN High-Level Input Voltage |  | 0.85 | 1.05 | 1.2 | V |  | 4 |
| Quiescent Current |  |  | 300 |  | μA | VEN=2V, VFB=VREF x 105% | 4 |
| UVLO Rising Threshold |  |  | 4 |  | V |  | 4 |
| UVLO Hysteresis |  |  | 0.45 |  | V |  | 4 |
| OVP Threshold |  |  | 19.3 |  | V |  | 4 |
| High-Side Switch On-Resistance |  |  | 60 |  | mΩ |  | 4 |
| Low-Side Switch On-Resistance |  |  | 35 |  | mΩ |  | 4 |
| Switch Valley Current Limit |  |  | 4.5 |  | A | Minimum Duty Cycle | 4 |
| Maximum Duty Cycle |  |  | 80 |  | % |  | 4 |
| Minimum On-Time |  |  | 80 |  | ns |  | 4 |
| Hiccup on Time |  |  | 1.6 |  | ms |  | 4 |
| Hiccup Time Before Restart |  |  | 6 |  | ms |  | 4 |
| EN Hysteresis |  |  | 100 |  | mV |  | 4 |
| Thermal Shutdown Threshold |  |  | 165 |  | °C | Guaranteed by design (Note 4) | 4 |
| Thermal Shutdown Hysteresis |  |  | 30 |  | °C | Guaranteed by design (Note 4) | 4 |
| Junction-to-ambient thermal resistance | θJA |  | 60 |  | °C/W | JESD51-7, 4-layer PCB (Note 3) | 3 |
| Junction-to-case (bottom) thermal resistance | θJC |  | 9 |  | °C/W |  | 3 |

## CAD (KiCad official)

- Symbol: `TMI3286B`
- Footprint: `Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm`
- 3D model: ESOP-8 (KiCad packages3D, STEP)
- 3D model files: `tmi3286b-etched.step` / `tmi3286b-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `tmi3286b.step` / `tmi3286b.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [TMI datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8589839618381283328) (17 pp, sha256 `d75092d658528c31`, retrieved 2026-10-17, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/tmi3286b-datasheet.pdf)