component
TMI3252T
Public Made by Adomby adom
TMI DC-DC Converters, SOT-23-6. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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TMI3252T
TMI · DC-DC Converters · SOT-23-6
TMI3252T from TMI, in a SOT-23-6. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GND | power_in | Ground pin; the datasheet recommends connecting GND to a large copper area to cool the chip and improve thermal performance. |
| 2 | LX | output | Switching pin connecting the inductor to the internal high-side and low-side power MOSFETs; keep LX away from sensitive analog areas such as FB. |
| 3 | IN | power_in | Power supply pin with a recommended input voltage range of 4.5 V to 18 V; place bypass ceramic capacitors close to this pin. |
| 4 | FB | input | Output voltage feedback input that connects to the center point of the external resistor divider; the TMI3252T regulated feedback voltage is 0.750 V min, 0.765 V typ, 0.780 V max. |
| 5 | EN | input | Enable input: drive to logic-high (at least 1.5 V) to enable the IC, drive to logic-low (at most 0.3 V) to enter micro-power shutdown, and do not leave floating. |
| 6 | BS | passive | Bootstrap pin; a capacitor connected between LX and BST is required to form a floating supply across the high-side switch driver. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | TMI |
| Package | SOT-23-6 |
| Category | Power Management (PMIC) |
| Pins | 6 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Input Supply Voltage, EN | -0.3 | 20 | V | 2 | |||
| LX Voltages | -0.3 | 20 | V | 2 | |||
| FB Voltage | -0.3 | 6 | V | 2 | |||
| BS Voltage | -0.3 | 23 | V | 2 | |||
| Storage Temperature Range | -65 | 150 | °C | 2 | |||
| Junction Temperature | 160 | °C | Note 2 | 2 | |||
| Power Dissipation | 1000 | mW | 2 | ||||
| Lead Temperature (Soldering, 10s) | 260 | °C | Soldering, 10s | 2 | |||
| Voltage Range IN | 4.5 | 18 | V | 3 | |||
| TJ Operating Junction Temperature | TJ | -40 | 125 | °C | 3 | ||
| Input Voltage Range | 4.5 | 18 | V | 4 | |||
| Regulated Feedback Voltage (3253T) | 0.75 | 0.765 | 0.78 | V | TA=25°C,4.5V≤VIN≤18V | 4 | |
| On Time | 132 | 166 | 200 | ns | VIN=12V, VOUT=1.2V, IOUT=1A | 4 | |
| Shutdown Current | 5 | 10 | μA | VIN=12V, EN=0V | 4 | ||
| High-Side Switch Leakage Current | 1 | 10 | μA | VEN=0V, VLX=0V | 4 | ||
| OVP Threshold | 19.3 | V | 4 | ||||
| UVLO Rising Threshold | 4 | V | 4 | ||||
| UVLO Hysteresis | 0.45 | V | 4 | ||||
| Quiescent Current | 300 | μA | VEN=2V, VFB=VREF x 105% | 4 | |||
| High-Side Switch On-Resistance | 140 | mΩ | 4 | ||||
| Low-Side Switch On-Resistance | 70 | mΩ | 4 | ||||
| Switch Valley Current Limit | 3 | A | Minimum Duty Cycle | 4 | |||
| Oscillation Frequency | 600 | kHz | 4 | ||||
| Maximum Duty Cycle | 65 | % | 4 | ||||
| Minimum On-Time | 80 | ns | 4 | ||||
| Soft Start Time | 1 | ms | 4 | ||||
| Hiccup on Time | 1.4 | ms | 4 | ||||
| Hiccup Time Before Restart | 4 | ms | 4 | ||||
| EN High-Level Input Voltage | 1.5 | V | 4 | ||||
| EN Low-Level Input Voltage | 0.3 | V | 4 | ||||
| Thermal Shutdown Hysteresis (Note 4) | 165 | °C | Note 4 | 4 | |||
| Thermal Shutdown Hysteresis (Note 4) | 30 | °C | Note 4 | 4 | |||
| Junction-to-ambient thermal resistance | θJA | 100 | °C/W | Measured on JESD51-7, 4-layer PCB (Note 3) | 3 |
CAD (KiCad official)
- Symbol:
TMI3252T - Footprint:
Package_TO_SOT_SMD:SOT-23-6 - 3D model: SOT-23-6 (KiCad packages3D, STEP)
- 3D model files:
tmi3252t-etched.step/tmi3252t-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);tmi3252t.step/tmi3252t.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: TMI datasheet (15 pp, sha256
30927acc2ca98daa, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# TMI3252T
**TMI** · DC-DC Converters · SOT-23-6
TMI3252T from TMI, in a SOT-23-6. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GND | power_in | Ground pin; the datasheet recommends connecting GND to a large copper area to cool the chip and improve thermal performance. |
| 2 | LX | output | Switching pin connecting the inductor to the internal high-side and low-side power MOSFETs; keep LX away from sensitive analog areas such as FB. |
| 3 | IN | power_in | Power supply pin with a recommended input voltage range of 4.5 V to 18 V; place bypass ceramic capacitors close to this pin. |
| 4 | FB | input | Output voltage feedback input that connects to the center point of the external resistor divider; the TMI3252T regulated feedback voltage is 0.750 V min, 0.765 V typ, 0.780 V max. |
| 5 | EN | input | Enable input: drive to logic-high (at least 1.5 V) to enable the IC, drive to logic-low (at most 0.3 V) to enter micro-power shutdown, and do not leave floating. |
| 6 | BS | passive | Bootstrap pin; a capacitor connected between LX and BST is required to form a floating supply across the high-side switch driver. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | TMI |
| Package | SOT-23-6 |
| Category | Power Management (PMIC) |
| Pins | 6 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Input Supply Voltage, EN | | -0.3 | | 20 | V | | 2 |
| LX Voltages | | -0.3 | | 20 | V | | 2 |
| FB Voltage | | -0.3 | | 6 | V | | 2 |
| BS Voltage | | -0.3 | | 23 | V | | 2 |
| Storage Temperature Range | | -65 | | 150 | °C | | 2 |
| Junction Temperature | | | | 160 | °C | Note 2 | 2 |
| Power Dissipation | | | | 1000 | mW | | 2 |
| Lead Temperature (Soldering, 10s) | | | | 260 | °C | Soldering, 10s | 2 |
| Voltage Range IN | | 4.5 | | 18 | V | | 3 |
| TJ Operating Junction Temperature | TJ | -40 | | 125 | °C | | 3 |
| Input Voltage Range | | 4.5 | | 18 | V | | 4 |
| Regulated Feedback Voltage (3253T) | | 0.75 | 0.765 | 0.78 | V | TA=25°C,4.5V≤VIN≤18V | 4 |
| On Time | | 132 | 166 | 200 | ns | VIN=12V, VOUT=1.2V, IOUT=1A | 4 |
| Shutdown Current | | | 5 | 10 | μA | VIN=12V, EN=0V | 4 |
| High-Side Switch Leakage Current | | | 1 | 10 | μA | VEN=0V, VLX=0V | 4 |
| OVP Threshold | | | 19.3 | | V | | 4 |
| UVLO Rising Threshold | | | 4 | | V | | 4 |
| UVLO Hysteresis | | | 0.45 | | V | | 4 |
| Quiescent Current | | | 300 | | μA | VEN=2V, VFB=VREF x 105% | 4 |
| High-Side Switch On-Resistance | | | 140 | | mΩ | | 4 |
| Low-Side Switch On-Resistance | | | 70 | | mΩ | | 4 |
| Switch Valley Current Limit | | | 3 | | A | Minimum Duty Cycle | 4 |
| Oscillation Frequency | | | 600 | | kHz | | 4 |
| Maximum Duty Cycle | | | 65 | | % | | 4 |
| Minimum On-Time | | | 80 | | ns | | 4 |
| Soft Start Time | | | 1 | | ms | | 4 |
| Hiccup on Time | | | 1.4 | | ms | | 4 |
| Hiccup Time Before Restart | | | 4 | | ms | | 4 |
| EN High-Level Input Voltage | | | 1.5 | | V | | 4 |
| EN Low-Level Input Voltage | | | 0.3 | | V | | 4 |
| Thermal Shutdown Hysteresis (Note 4) | | | 165 | | °C | Note 4 | 4 |
| Thermal Shutdown Hysteresis (Note 4) | | | 30 | | °C | Note 4 | 4 |
| Junction-to-ambient thermal resistance | θJA | | 100 | | °C/W | Measured on JESD51-7, 4-layer PCB (Note 3) | 3 |
## CAD (KiCad official)
- Symbol: `TMI3252T`
- Footprint: `Package_TO_SOT_SMD:SOT-23-6`
- 3D model: SOT-23-6 (KiCad packages3D, STEP)
- 3D model files: `tmi3252t-etched.step` / `tmi3252t-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `tmi3252t.step` / `tmi3252t.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [TMI datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588904524837244928) (15 pp, sha256 `30927acc2ca98daa`, retrieved 2026-10-18, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/tmi3252t-datasheet.pdf)