TMCS1123B1AQDVGR - Isolated Hall-Effect Current Sensor

{
 "schema": "adom/3d-model-provenance@1",
 "mpn": "TMCS1123B1AQDVGR",
 "date": "2026-10-21",
 "classification": "Datasheet-built: a CadQuery model generated from TI's printed DVG0010A package values (SBOSA24D p.45), produced by Claude (AI) for Adom. Not manufacturer CAD and not a TI certification.",
 "method_chosen": "3 (build from the drawing): TI's STEP is behind Ultra Librarian's reCAPTCHA and terms form, and no KiCad library model exists for DVG0010A",
 "manufacturer_step": {
  "tried": [
   "https://www.ti.com/product/TMCS1123 (CAD/CAE link)",
   "https://vendor.ultralibrarian.com/TI/embedded/?gpn=TMCS1123&package=DVG&pin=10"
  ],
  "result": "The Ultra Librarian page lists a STEP export (PartUniqueId 1632f2be-2a1e-11ee-9288-0ae0a3b49db5) but the export form needs a reCAPTCHA and a terms checkbox; a plain HTTP request cannot fetch it (checked 2026-10-21)",
  "status": "not reachable by plain HTTP"
 },
 "existing_wiki_model": {
  "page": "adom/tmcs1123a2aqdvgr (the A2A variant, same DVG package)",
  "checked": "2026-10-21",
  "verdict": "not reused: its footprint and STEP are KiCad's SOIC-10_3.9x4.9mm_P1mm (narrow 3.9 x 4.9 mm body, 1 mm pitch, five pins per side, pads at x = +-2.66), which is a different package from TI's DVG0010A (7.5 x 10.3 mm body, two 4.22 mm current leads on one side and eight 1.27 mm-pitch leads on the other). The page was not modified."
 },
 "datasheet": {
  "doc": "TI SBOSA24D, TMCS1123 (July 2023, revised May 2026)",
  "file": "docs/tmcs1123b1aqdvgr-datasheet.pdf",
  "url": "https://www.ti.com/lit/ds/symlink/tmcs1123.pdf",
  "sha256": "66bab03ec907cb658ebf1b379dff4bdc75dffe13ffab3acd8247fc3faee70cce",
  "drawing_pages": "p.45 package outline DVG0010A (4226847/C 10/2022), p.46 example board layout, p.47 stencil",
  "marking_page": "p.40"
 },
 "model": {
  "file": "tmcs1123b1aqdvgr.step",
  "sha256": "0a853e2f4e75a9e6cbad36f5019d39ee4dcb53a4c9cc39f4c3ad37d4c9274672",
  "builder": "provenance/tools/build_dvg10.py (CadQuery 2.8, OpenCascade); lead construction from build_soic8.py on adom/mcp2562fd-e-sn",
  "how": "drafted two-part body loft (parting line 1.10 mm), ten swept leads (rectangle b x c along a centreline with two 0.2375 mm centreline-radius bends, 8 deg off vertical): two 4.22 mm current leads at y = +-2.54 on -x, eight 0.41 mm leads at 1.27 mm pitch on +x; pin-1 dimple 0.90 mm diameter, 0.05 mm deep inside the drawing's PIN 1 ID AREA; flat foot 0.50 mm so the gauge-plane L is 0.854 mm",
  "chosen_values": "Where the drawing gives a range, the mid value; A (2.65 MAX, no nominal) modelled as 2.55. Not dimensioned by TI and chosen: parting line height 1.10 mm (read off the side view), draft insets 0.10 / 0.15 mm, inner bend radius 0.10 mm, lead angle 8 deg.",
  "frame": "Z up, seated on z = 0, centred on the KiCad footprint origin, pin 1 at (-x, +y) = footprint pad 1 at (-4.875, -2.54) in KiCad's Y-down footprint frame; binds with zero offset and rotation",
  "parts": {
   "body": "black epoxy",
   "pins": "matte tin"
  },
  "dimensions_mm": [
   {
    "item": "E overall lead span",
    "datasheet_min_typ_max": "9.97 / - / 10.63 (TYP)",
    "model": "10.300"
   },
   {
    "item": "E1 molded width",
    "datasheet_min_typ_max": "7.4 / - / 7.6",
    "model": "7.500"
   },
   {
    "item": "D molded length",
    "datasheet_min_typ_max": "10.1 / - / 10.5",
    "model": "10.300"
   },
   {
    "item": "A overall height",
    "datasheet_min_typ_max": "max 2.65",
    "model": "2.550"
   },
   {
    "item": "A1 standoff",
    "datasheet_min_typ_max": "0.1 / - / 0.3",
    "model": "0.200"
   },
   {
    "item": "c lead thickness",
    "datasheet_min_typ_max": "0.23 / - / 0.32 (TYP)",
    "model": "0.275"
   },
   {
    "item": "b signal lead width (pins 3 to 10)",
    "datasheet_min_typ_max": "0.31 / - / 0.51",
    "model": "0.410"
   },
   {
    "item": "e signal pitch",
    "datasheet_min_typ_max": "1.27 (7X)",
    "model": "1.270"
   },
   {
    "item": "current lead width (pins 1, 2)",
    "datasheet_min_typ_max": "4.12 / - / 4.32",
    "model": "4.220"
   },
   {
    "item": "current lead centre from centre line",
    "datasheet_min_typ_max": "2.44 / - / 2.64",
    "model": "2.540"
   },
   {
    "item": "gap between current leads",
    "datasheet_min_typ_max": "(0.86) REF",
    "model": "0.860"
   },
   {
    "item": "L foot length (gauge plane 0.25 mm)",
    "datasheet_min_typ_max": "0.40 / - / 1.27",
    "model": "0.854"
   },
   {
    "item": "(1.4) lead length, body edge to tip",
    "datasheet_min_typ_max": "(1.4) REF",
    "model": "1.400"
   },
   {
    "item": "lead angle at foot",
    "datasheet_min_typ_max": "0 to 8 deg",
    "model": "0 (flat foot on the seating plane)"
   }
  ],
  "measurements": [
   "provenance/dims-model.json (section at y = +2.54, pin 1)",
   "provenance/dims-model-signal.json (section at y = +4.445, pin 10; foot section of the +x row)"
  ],
  "overlay_proof": {
   "image": "docs/proof/tmcs1123b1aqdvgr-overlay.png",
   "report": "provenance/overlay-proof.json",
   "px_per_mm": 71.117,
   "result": "top, front and end silhouettes blended over the p.45 drawing at the drawing's own scale (calibrated on the printed E and D spans, kx and ky agree within 0.4 %); the leads, the current-lead gap and the body outline coincide with the drawing lines"
  },
  "pin1_mark": "0.90 mm dimple at (-2.60, +4.00) on the top face, inside TI's hatched PIN 1 ID AREA (p.45); TI does not dimension the feature",
  "not_modelled": "mold flash and interlead flash (notes 3, 4), the exact pin-1 feature shape"
 },
 "etched": {
  "file": "tmcs1123b1aqdvgr-etched.step",
  "sha256": "dbec99f3125d7ef551b04a3802e49a5ef6b22ebbba2e7978b2e8f2f85a8b5008",
  "tool": "adom-chip-laser 0.2.0 service (service-occt /laser-etch, flat light mark 5 um above the face, Adom.LaserEtch group), placed by adom-aiflow-etch's planner with the page footprint",
  "lines": [
   "TMCS1123",
   "B1AQDVGR"
  ],
  "capMm": 0.98,
  "virtual": true,
  "gate": "adom-aiflow-etch check: PASS",
  "check_image": "docs/proof/tmcs1123b1aqdvgr-etched.check.png",
  "plan": "docs/proof/tmcs1123b1aqdvgr-etched.mark-plan.json",
  "real_marking": "TI marks this part 1123B1A (SBOSA24D p.40, Part marking); the etch is the orderable MPN instead, as a virtual identification aid"
 },
 "glb": {
  "tmcs1123b1aqdvgr.glb": "6845226553b3cfc2fac73abbe47483cf94ccc6f9ff476c4c72250a0721f352b5",
  "tmcs1123b1aqdvgr-etched.glb": "70ac2e320cf662c6f7b24d163eee14148fd0f474d429a1aab3c05f81bf0afa56",
  "tmcs1123b1aqdvgr-hero.glb": "bf51329a5a46cd522589b2e604a47acd88117b42e3e8ad0f20e2daf671f85fc3"
 },
 "hero": {
  "file": "tmcs1123b1aqdvgr-hero.glb",
  "generator": "adom/component-hero skills/component-hero/scripts/hero_glb.py (adom-hero 1.4) then provenance/tools/hero_post_keepout.py",
  "sidecar": "tmcs1123b1aqdvgr-hero.overlay.json",
  "align": "OK, centre offset 0.0 mm",
  "pin1": "added dot (AI) beside pad 1: the footprint's pin-1 silkscreen bar is a line, which the generator does not count as a mark"
 },
 "outline": {
  "file": "artwork/TMCS1123B1AQDVGR-3d-outline-dark-named.svg",
  "sha256": "e25e153f2ef6984f426e1aaaa5d8b7d1db31c0c99ee94fe6beb42073bb1c2314",
  "tool": "adom-aiflow-etch outline (service body outline + single-stroke name on the planned band)",
  "gate": "PASS"
 },
 "tools": {
  "adom-chip-laser": "0.2.0",
  "adom-aiflow-etch": "adom-aiflow 0.2.17",
  "step2glb": "0.13.2 (service)",
  "adom-symbol": "1.2.6",
  "adom-footprint": "1.0.26",
  "adom-lbr": "2.47.6",
  "cadquery": "2.8.0 (local venv)"
 },
 "license": "Model, etch and artwork authored by Adom: CC-BY-4.0. The TI datasheet keeps TI's terms."
}