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Contents

README

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TM2313

TM Shenzhen Titan Micro Elec · Audio Interface ICs · SOIC-28-300mil

TM2313 from TM Shenzhen Titan Micro Elec, in a SOIC-28-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 REF power_out Reference voltage output at 1/2VDD for input biasing networks.
2 VDD power_in Positive supply voltage input, 6V to 10V operating range.
3 AGND power_in Analog ground.
4 TREB_L input Treble control input for left audio channel.
5 TREB_R input Treble control input for right audio channel.
6 RIN input Right channel audio processor input pin.
7 ROUT output Right channel audio output after gain selection and amplification.
8 LOUD_R input Right channel loudness control input.
9 RIN3 input Right channel stereo input 3 (third audio source).
10 RIN2 input Right channel stereo input 2 (second audio source).
11 RIN1 input Right channel stereo input 1 (first audio source).
12 LOUD_L input Left channel loudness control input.
13 LIN3 input Left channel stereo input 3 (third audio source).
14 LIN2 input Left channel stereo input 2 (second audio source).
15 LIN1 input Left channel stereo input 1 (first audio source).
16 LIN input Left channel audio processor input pin.
17 LOUT output Left channel audio output after gain selection and amplification.
18 BIN_L input Left channel bass processing input pin.
19 BOUT_L output Left channel bass processing output pin.
20 BIN_R input Right channel bass processing input pin.
21 BOUT_R output Right channel bass processing output pin.
22 RROUT output Rear speaker right channel output.
23 LROUT output Rear speaker left channel output.
24 RFOUT output Front speaker right channel output.
25 LFOUT output Front speaker left channel output.
26 DGND power_in Digital ground.
27 DATA input I2C data line input (SDA), requires pull-up resistor to VDD.
28 CLK input I2C clock line input (SCL), requires pull-up resistor to VDD.

Key specifications

Parameter Value
Manufacturer TM Shenzhen Titan Micro Elec
Package SOIC-28-300mil
Category Interface
Pins 28

CAD (KiCad official)

  • Symbol: TM2313
  • Footprint: Package_SO:SOIC-28W_7.5x17.9mm_P1.27mm
  • 3D model: SOIC-28-300mil (KiCad packages3D, STEP)
  • 3D model files: tm2313-etched.step / tm2313-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tm2313.step / tm2313.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: TM Shenzhen Titan Micro Elec datasheet (14 pp, sha256 5b3689f7c5a07d81, retrieved 2026-09-21, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.2, primary claude-haiku-4-5-20251001 (text), consensus claude-sonnet-4-6 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF