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TLVH431NAMQDBZRVL
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Nexperia Voltage Reference, TO-236AB. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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TLVH431NAMQDBZRVL
Nexperia · Voltage Reference · TO-236AB
TLVH431NAMQDBZRVL from Nexperia, in a TO-236AB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode; the cathode-anode voltage VKA is specified up to 14 V and the cathode current IK from 0.08 mA to 70 mA. |
| 2 | REF | passive | Reference input; the reference voltage Vref is 1222 mV to 1258 mV for standard grade and 1228 mV to 1252 mV for A-grade at IK = 10 mA, and the reference current Iref is limited to 3 mA. |
| 3 | A | passive | Anode; the cathode-anode voltage VKA is referenced to this pin and the minimum cathode current IK(min) is 55 µA to 80 µA. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Nexperia |
| Package | TO-236AB |
| Category | Power Management (PMIC) |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Cathode-anode voltage | VKA | 14 | V | 4 | |||
| Cathode current | IK | -25 | 80 | mA | 4 | ||
| Reference current | Iref | 3 | mA | 4 | |||
| Total power dissipation | Ptot | 350 | mW | Tamb ≤ 25 °C; footnote [1] FR4 PCB, single-sided copper, tin-plated, standard footprint | 4 | ||
| Total power dissipation | Ptot | 580 | mW | Tamb ≤ 25 °C; footnote [2] FR4 PCB, mounting pad for anode 1 cm2 | 4 | ||
| Total power dissipation | Ptot | 950 | mW | Tamb ≤ 25 °C; footnote [3] ceramic PCB, Al2O3, standard footprint | 4 | ||
| Junction temperature | Tj | 150 | °C | 4 | |||
| Ambient temperature (TLVH431NXQDBZR grade, applies to TLVH431NAMQDBZR) | Tamb | -40 | 125 | °C | 4 | ||
| Storage temperature | Tstg | -65 | 150 | °C | 4 | ||
| Electrostatic discharge voltage (human body model) | VESD | 4 | kV | MIL-STD-883 (human body model) | 4 | ||
| Electrostatic discharge voltage (machine model) | VESD | 200 | V | Machine model | 4 | ||
| Cathode-anode voltage | VKA | 14 | V | Minimum printed as Vref (not numeric) | 5 | ||
| Cathode current | IK | 0.08 | 70 | mA | 5 | ||
| Thermal resistance from junction to ambient | Rth(j-a) | 360 | K/W | Footnote [1] FR4 PCB, single-sided copper, tin-plated, standard footprint | 5 | ||
| Thermal resistance from junction to ambient | Rth(j-a) | 216 | K/W | Footnote [2] FR4 PCB, single-sided copper, tin-plated, mounting pad for anode 1 cm2 | 5 | ||
| Thermal resistance from junction to ambient | Rth(j-a) | 132 | K/W | Footnote [3] ceramic PCB, Al2O3, standard footprint | 5 | ||
| Thermal resistance from junction to solder point | Rth(j-sp) | 50 | K/W | Footnote [4] soldering point of anode, in free air | 5 | ||
| Reference voltage | Vref | 1228 | 1240 | 1252 | mV | VKA = Vref; IK = 10 mA; Tamb = 25 °C | 6 |
| Reference voltage variation (Tamb -40 °C to 125 °C) | ΔVref | 2.2 | 10 | mV | VKA = Vref; IK = 10 mA; Tamb = -40 °C to 125 °C | 6 | |
| Reference voltage variation to cathode-anode voltage variation ratio | ΔVref/ΔVKA | -0.5 | -2.7 | mV/V | IK = 10 mA; ΔVKA = Vref to 14 V | 6 | |
| Reference current | Iref | 0.19 | 0.3 | μA | IK = 10 mA; R1 = 10 kΩ; R2 = open | 6 | |
| Reference current variation (Tamb -40 °C to 125 °C) | ΔIref | 0.07 | 0.24 | μA | IK = 10 mA; R1 = 10 kΩ; R2 = open; Tamb = -40 °C to 125 °C | 6 | |
| Minimum cathode current | IK(min) | 55 | 80 | μA | VKA = Vref | 6 | |
| Off-state current | Ioff | 0.01 | 0.05 | μA | VKA = 14 V; Vref = 0 | 6 | |
| Dynamic cathode-anode impedance | ZKA | 0.1 | 0.15 | Ω | IK = 0.1 mA to 70 mA; VKA = Vref; f < 1 kHz | 6 |
CAD (KiCad official)
- Symbol:
TLVH431NAMQDBZRVL - Footprint:
Package_TO_SOT_SMD:SOT-23 - 3D model: TO-236AB (KiCad packages3D, STEP)
- 3D model files:
tlvh431namqdbzrvl-etched.step/tlvh431namqdbzrvl-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);tlvh431namqdbzrvl.step/tlvh431namqdbzrvl.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Nexperia datasheet (17 pp, sha256
f697276a93043d84, retrieved 2026-10-16, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# TLVH431NAMQDBZRVL
**Nexperia** · Voltage Reference · TO-236AB
TLVH431NAMQDBZRVL from Nexperia, in a TO-236AB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode; the cathode-anode voltage VKA is specified up to 14 V and the cathode current IK from 0.08 mA to 70 mA. |
| 2 | REF | passive | Reference input; the reference voltage Vref is 1222 mV to 1258 mV for standard grade and 1228 mV to 1252 mV for A-grade at IK = 10 mA, and the reference current Iref is limited to 3 mA. |
| 3 | A | passive | Anode; the cathode-anode voltage VKA is referenced to this pin and the minimum cathode current IK(min) is 55 µA to 80 µA. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Nexperia |
| Package | TO-236AB |
| Category | Power Management (PMIC) |
| Pins | 3 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Cathode-anode voltage | VKA | | | 14 | V | | 4 |
| Cathode current | IK | -25 | | 80 | mA | | 4 |
| Reference current | Iref | | | 3 | mA | | 4 |
| Total power dissipation | Ptot | | | 350 | mW | Tamb ≤ 25 °C; footnote [1] FR4 PCB, single-sided copper, tin-plated, standard footprint | 4 |
| Total power dissipation | Ptot | | | 580 | mW | Tamb ≤ 25 °C; footnote [2] FR4 PCB, mounting pad for anode 1 cm2 | 4 |
| Total power dissipation | Ptot | | | 950 | mW | Tamb ≤ 25 °C; footnote [3] ceramic PCB, Al2O3, standard footprint | 4 |
| Junction temperature | Tj | | | 150 | °C | | 4 |
| Ambient temperature (TLVH431NXQDBZR grade, applies to TLVH431NAMQDBZR) | Tamb | -40 | | 125 | °C | | 4 |
| Storage temperature | Tstg | -65 | | 150 | °C | | 4 |
| Electrostatic discharge voltage (human body model) | VESD | | | 4 | kV | MIL-STD-883 (human body model) | 4 |
| Electrostatic discharge voltage (machine model) | VESD | | | 200 | V | Machine model | 4 |
| Cathode-anode voltage | VKA | | | 14 | V | Minimum printed as Vref (not numeric) | 5 |
| Cathode current | IK | 0.08 | | 70 | mA | | 5 |
| Thermal resistance from junction to ambient | Rth(j-a) | | | 360 | K/W | Footnote [1] FR4 PCB, single-sided copper, tin-plated, standard footprint | 5 |
| Thermal resistance from junction to ambient | Rth(j-a) | | | 216 | K/W | Footnote [2] FR4 PCB, single-sided copper, tin-plated, mounting pad for anode 1 cm2 | 5 |
| Thermal resistance from junction to ambient | Rth(j-a) | | | 132 | K/W | Footnote [3] ceramic PCB, Al2O3, standard footprint | 5 |
| Thermal resistance from junction to solder point | Rth(j-sp) | | | 50 | K/W | Footnote [4] soldering point of anode, in free air | 5 |
| Reference voltage | Vref | 1228 | 1240 | 1252 | mV | VKA = Vref; IK = 10 mA; Tamb = 25 °C | 6 |
| Reference voltage variation (Tamb -40 °C to 125 °C) | ΔVref | | 2.2 | 10 | mV | VKA = Vref; IK = 10 mA; Tamb = -40 °C to 125 °C | 6 |
| Reference voltage variation to cathode-anode voltage variation ratio | ΔVref/ΔVKA | | -0.5 | -2.7 | mV/V | IK = 10 mA; ΔVKA = Vref to 14 V | 6 |
| Reference current | Iref | | 0.19 | 0.3 | μA | IK = 10 mA; R1 = 10 kΩ; R2 = open | 6 |
| Reference current variation (Tamb -40 °C to 125 °C) | ΔIref | | 0.07 | 0.24 | μA | IK = 10 mA; R1 = 10 kΩ; R2 = open; Tamb = -40 °C to 125 °C | 6 |
| Minimum cathode current | IK(min) | | 55 | 80 | μA | VKA = Vref | 6 |
| Off-state current | Ioff | | 0.01 | 0.05 | μA | VKA = 14 V; Vref = 0 | 6 |
| Dynamic cathode-anode impedance | ZKA | | 0.1 | 0.15 | Ω | IK = 0.1 mA to 70 mA; VKA = Vref; f < 1 kHz | 6 |
## CAD (KiCad official)
- Symbol: `TLVH431NAMQDBZRVL`
- Footprint: `Package_TO_SOT_SMD:SOT-23`
- 3D model: TO-236AB (KiCad packages3D, STEP)
- 3D model files: `tlvh431namqdbzrvl-etched.step` / `tlvh431namqdbzrvl-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `tlvh431namqdbzrvl.step` / `tlvh431namqdbzrvl.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Nexperia datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8590438590448119808) (17 pp, sha256 `f697276a93043d84`, retrieved 2026-10-16, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/tlvh431namqdbzrvl-datasheet.pdf)