component

TLV9001

Public Made by Adom

by adom

TI single rail-to-rail op-amp, SC70-5. 1 MHz, single 1.8-5.5 V supply, low cost, tiny. Datasheet-verified.

componentamplifierop-amprail-to-railsingle-supplysc70-5texas-instruments
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Contents

README

markdown

TLV9001

Texas Instruments · Operational amplifier · SC70-5

General-purpose single op-amp with rail-to-rail input and output on a single 1.8 to 5.5 V supply, in a tiny SC70-5. It offers 1 MHz of bandwidth and EMI-hardened inputs at low cost and low quiescent current, which suits it to buffering, filtering, and level-shifting on space- and power-limited boards. It drives light loads close to both rails. A cheap, small workhorse single for 3.3 and 5 V systems, the single of the TLV900x family.

Pinout

Pin Name Type Function
1 OUT output Amplifier output. Rail-to-rail output stage; drives capacitive loads up to 500 pF and swings to within millivolts of V+ and V-.
2 V- power_in Negative (low) supply or ground for single-supply operation. Total supply (V+) - (V-) rated 1.8 V to 5.5 V (7 V absolute maximum).
3 IN+ input Noninverting input. Rail-to-rail input common-mode range (V-) to (V+); low input bias current of 5 pA typical.
4 IN- input Inverting input. Rail-to-rail input common-mode range (V-) to (V+); low input bias current of 5 pA typical.
5 V+ power_in Positive (high) supply. Total supply (V+) - (V-) operates 1.8 V to 5.5 V (7 V absolute maximum). Bypass to V- with a low-ESR capacitor near the pin.

Key specifications

Parameter Value
Type Single rail-to-rail op-amp
Gain-bandwidth 1 MHz
Supply 1.8-5.5 V (single)
Output Rail-to-rail
Quiescent current 60 uA (typ)
EMI Hardened inputs
Package SC70-5

Ordering variants

Same part, different packaging or reel option.

  • TLV9001IDCKR (SC70-5)
  • TLV9001IDBVR (SOT-23-5)
  • TLV9002IDCKR (dual)

CAD (KiCad official)

  • Symbol: Amplifier_Operational:TLV9001IDCK (KiCad official)
  • Footprint: Package_TO_SOT_SMD:SOT-353_SC-70-5
  • 3D model: SC70-5 (KiCad packages3D, STEP)
  • 3D model files: tlv9001-etched.step / tlv9001-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tlv9001.step / tlv9001.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (110 pp, sha256 5498217833a3178f, retrieved 2026-08-17, tier: manufacturer)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF