component
TLV76708DRVR
Public Made by Adomby adom
Texas Instruments Pre-ordered Chips, WSON-6(2x2). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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TLV76708DRVR
Texas Instruments · Pre-ordered Chips · WSON-6(2x2)
TLV76708DRVR from Texas Instruments, in a WSON-6(2x2). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | OUT | power_out | Regulated output pin; use the recommended output capacitor (1 µF minimum, effective 0.5 µF minimum for stability) placed as close to OUT and GND as possible. |
| 2 | SNS | input | Output sense pin for fixed-voltage versions; connect to OUT or to the load for remote sensing, and do not float this pin. |
| 3 | GND | power_in | Ground pin; all ground pins must be grounded. |
| 4 | EN | input | Enable pin; high enables the device and low disables it, with an internal pullup so it can be left floating or tied to IN. |
| 5 | GND | power_in | Ground pin; all ground pins must be grounded. |
| 6 | IN | power_in | Input supply pin (2.5 V to 16 V); use the recommended 1 µF input capacitor placed as close to IN and GND as possible. |
| 7 | Thermal pad | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | WSON-6(2x2) |
| Category | Interface ICs |
| Pins | 7 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Nominal output accuracy | VOUT | -0.5 | 0.5 | % | TJ = 25°C | 6 | |
| Output accuracy over temperature | VOUT | -1 | 1 | % | VIN ≥ 3.0 V, 1 mA ≤ IOUT ≤ 1 A | 6 | |
| Line regulation | ΔVOUT(ΔVIN) | 0.02 | %/V | VOUT(NOM) +1.5 V ≤ VIN ≤ 16 V, IOUT = 10 mA | 6 | ||
| Load regulation | ΔVOUT(ΔIOUT) | 0.1 | 0.5 | %/A | 1 mA ≤ IOUT ≤ 1 A, VIN ≥ 3.0 V | 6 | |
| Dropout voltage | VDO | 0.9 | 1.4 | V | VIN ≥ 3.0V, IOUT = 1 A, DRV package | 6 | |
| Dropout voltage | VDO | 0.8 | 1.3 | V | 2.5 V ≤ VIN < 3.0 V, IOUT = 800 mA | 6 | |
| Output current limit | ICL | 1.1 | 1.6 | A | VOUT = 0.9 x VOUT(NOM), VIN ≥ 3.0V | 6 | |
| Output current limit | ICL | 0.81 | 1.6 | A | VOUT = 0.9 x VOUT(NOM), 2.5 V ≤ VIN < 3.0 V | 6 | |
| Short-circuit current limit | ISC | 150 | 250 | 350 | mA | VOUT = 0 V, DRV package | 6 |
| Quiescent current (fixed output) | IQ | 60 | 95 | µA | Fixed output devices, IOUT = 0 mA | 6 | |
| Ground current | IGND | 1.5 | mA | IOUT = 1 A, VIN ≥ 3.0 V | 6 | ||
| Shutdown current | ISHUTDOWN | 1.5 | 3 | µA | VEN ≤ 0.4 V, VIN = 16 V | 6 | |
| Enable pin logic high | VEN(HIGH) | 1.2 | V | 2.5 V ≤ VIN ≤ 16 V | 6 | ||
| Enable pin logic low | VEN(LOW) | 0.4 | V | 2.5 V ≤ VIN ≤ 16 V | 6 | ||
| Enable pullup current | IEN | 400 | nA | VEN = 0 V | 6 | ||
| Output pulldown current | IPULLDOWN | 1.2 | mA | VIN = 16 V, VOUT = 2.5 V, VEN=0V | 6 | ||
| Power-supply rejection ratio | PSRR | 70 | dB | VIN = 3.3 V, VOUT = 1.8 V, IOUT = 300 mA, f = 120 Hz | 6 | ||
| Output noise voltage | Vn | 60 | µVRMS | BW = 10 Hz to 100 kHz, VIN = 3.3 V, VOUT = 0.8 V, IOUT = 100 mA | 6 | ||
| UVLO threshold rising | VUVLO+ | 2.2 | 2.4 | V | VIN rising | 6 | |
| UVLO hysteresis | VUVLO(HYS) | 130 | mV | 7 | |||
| UVLO threshold falling | VUVLO- | 1.9 | V | VIN falling | 7 | ||
| Thermal shutdown temperature | TSD(shutdown) | 180 | ºC | Temperature increasing | 7 | ||
| Thermal shutdown reset temperature | TSD(reset) | 160 | ºC | Temperature falling | 7 | ||
| Input voltage | VIN | 2.5 | 16 | V | 5 | ||
| Enable voltage | VEN | 0 | 16 | V | 5 | ||
| Output current | IOUT | 0 | 0.8 | A | 2.5 V ≤ VIN < 3 V | 5 | |
| Output current | IOUT | 0 | 1 | A | VIN ≥ 3 V | 5 | |
| Output capacitor | COUT | 1 | 2.2 | 220 | µF | Effective output capacitance of 0.5 µF minimum required for stability | 5 |
| Output capacitor ESR | COUT ESR | 2 | 500 | mΩ | 5 | ||
| Input capacitor | CIN | 1 | µF | 5 | |||
| Junction temperature | TJ | -40 | 125 | °C | 5 | ||
| Input voltage | VIN | -0.3 | 18 | V | 5 | ||
| Output voltage | VOUT | -0.3 | V | Max is VIN + 0.3 V or 18 V (whichever is smaller) | 5 | ||
| SNS voltage | VSNS | -0.3 | V | Max is VIN + 0.3 V or 18 V (whichever is smaller) | 5 | ||
| Enable voltage | VEN | -0.3 | 18 | V | 5 | ||
| Operating junction temperature | TJ | -50 | 150 | °C | 5 | ||
| Storage temperature | TSTG | -65 | 150 | °C | 5 | ||
| ESD HBM | V(ESD) | -3000 | 3000 | V | Human body model, all pins | 5 | |
| ESD CDM | V(ESD) | -1000 | 1000 | V | Charged device model, all pins | 5 | |
| Junction-to-ambient thermal resistance | RθJA | 77.7 | °C/W | DRV (WSON) 6 pins | 6 | ||
| Junction-to-case (top) thermal resistance | RθJC(top) | 92.3 | °C/W | DRV (WSON) 6 pins | 6 | ||
| Junction-to-board thermal resistance | RθJB | 40.8 | °C/W | DRV (WSON) 6 pins | 6 | ||
| Junction-to-top characterization parameter | ΨJT | 4.3 | °C/W | DRV (WSON) 6 pins | 6 | ||
| Junction-to-board characterization parameter | ΨJB | 40.8 | °C/W | DRV (WSON) 6 pins | 6 | ||
| Junction-to-case (bottom) thermal resistance | RθJC(bot) | 18.9 | °C/W | DRV (WSON) 6 pins | 6 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | copper | • Use copper planes for device connections to IN, OUT, and GND pins to optimize thermal performance | 24 |
CAD (KiCad official)
- Symbol:
TLV76708DRVR - Footprint:
Package_SON:WSON-6-1EP_2x2mm_P0.65mm_EP1x1.6mm - 3D model: WSON-6(2x2) (KiCad packages3D, STEP)
- 3D model files:
tlv76708drvr-etched.step/tlv76708drvr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);tlv76708drvr.step/tlv76708drvr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (43 pp, sha256
4b6c90cec1ba8e19, retrieved 2026-10-31, tier: manufacturer) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# TLV76708DRVR
**Texas Instruments** · Pre-ordered Chips · WSON-6(2x2)
TLV76708DRVR from Texas Instruments, in a WSON-6(2x2). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | OUT | power_out | Regulated output pin; use the recommended output capacitor (1 µF minimum, effective 0.5 µF minimum for stability) placed as close to OUT and GND as possible. |
| 2 | SNS | input | Output sense pin for fixed-voltage versions; connect to OUT or to the load for remote sensing, and do not float this pin. |
| 3 | GND | power_in | Ground pin; all ground pins must be grounded. |
| 4 | EN | input | Enable pin; high enables the device and low disables it, with an internal pullup so it can be left floating or tied to IN. |
| 5 | GND | power_in | Ground pin; all ground pins must be grounded. |
| 6 | IN | power_in | Input supply pin (2.5 V to 16 V); use the recommended 1 µF input capacitor placed as close to IN and GND as possible. |
| 7 | Thermal pad | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | WSON-6(2x2) |
| Category | Interface ICs |
| Pins | 7 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Nominal output accuracy | VOUT | -0.5 | | 0.5 | % | TJ = 25°C | 6 |
| Output accuracy over temperature | VOUT | -1 | | 1 | % | VIN ≥ 3.0 V, 1 mA ≤ IOUT ≤ 1 A | 6 |
| Line regulation | ΔVOUT(ΔVIN) | | 0.02 | | %/V | VOUT(NOM) +1.5 V ≤ VIN ≤ 16 V, IOUT = 10 mA | 6 |
| Load regulation | ΔVOUT(ΔIOUT) | | 0.1 | 0.5 | %/A | 1 mA ≤ IOUT ≤ 1 A, VIN ≥ 3.0 V | 6 |
| Dropout voltage | VDO | | 0.9 | 1.4 | V | VIN ≥ 3.0V, IOUT = 1 A, DRV package | 6 |
| Dropout voltage | VDO | | 0.8 | 1.3 | V | 2.5 V ≤ VIN < 3.0 V, IOUT = 800 mA | 6 |
| Output current limit | ICL | 1.1 | | 1.6 | A | VOUT = 0.9 x VOUT(NOM), VIN ≥ 3.0V | 6 |
| Output current limit | ICL | 0.81 | | 1.6 | A | VOUT = 0.9 x VOUT(NOM), 2.5 V ≤ VIN < 3.0 V | 6 |
| Short-circuit current limit | ISC | 150 | 250 | 350 | mA | VOUT = 0 V, DRV package | 6 |
| Quiescent current (fixed output) | IQ | | 60 | 95 | µA | Fixed output devices, IOUT = 0 mA | 6 |
| Ground current | IGND | | 1.5 | | mA | IOUT = 1 A, VIN ≥ 3.0 V | 6 |
| Shutdown current | ISHUTDOWN | | 1.5 | 3 | µA | VEN ≤ 0.4 V, VIN = 16 V | 6 |
| Enable pin logic high | VEN(HIGH) | | | 1.2 | V | 2.5 V ≤ VIN ≤ 16 V | 6 |
| Enable pin logic low | VEN(LOW) | 0.4 | | | V | 2.5 V ≤ VIN ≤ 16 V | 6 |
| Enable pullup current | IEN | | 400 | | nA | VEN = 0 V | 6 |
| Output pulldown current | IPULLDOWN | | 1.2 | | mA | VIN = 16 V, VOUT = 2.5 V, VEN=0V | 6 |
| Power-supply rejection ratio | PSRR | | 70 | | dB | VIN = 3.3 V, VOUT = 1.8 V, IOUT = 300 mA, f = 120 Hz | 6 |
| Output noise voltage | Vn | | 60 | | µVRMS | BW = 10 Hz to 100 kHz, VIN = 3.3 V, VOUT = 0.8 V, IOUT = 100 mA | 6 |
| UVLO threshold rising | VUVLO+ | | 2.2 | 2.4 | V | VIN rising | 6 |
| UVLO hysteresis | VUVLO(HYS) | | 130 | | mV | | 7 |
| UVLO threshold falling | VUVLO- | | 1.9 | | V | VIN falling | 7 |
| Thermal shutdown temperature | TSD(shutdown) | | 180 | | ºC | Temperature increasing | 7 |
| Thermal shutdown reset temperature | TSD(reset) | | 160 | | ºC | Temperature falling | 7 |
| Input voltage | VIN | 2.5 | | 16 | V | | 5 |
| Enable voltage | VEN | 0 | | 16 | V | | 5 |
| Output current | IOUT | 0 | | 0.8 | A | 2.5 V ≤ VIN < 3 V | 5 |
| Output current | IOUT | 0 | | 1 | A | VIN ≥ 3 V | 5 |
| Output capacitor | COUT | 1 | 2.2 | 220 | µF | Effective output capacitance of 0.5 µF minimum required for stability | 5 |
| Output capacitor ESR | COUT ESR | 2 | | 500 | mΩ | | 5 |
| Input capacitor | CIN | | 1 | | µF | | 5 |
| Junction temperature | TJ | -40 | | 125 | °C | | 5 |
| Input voltage | VIN | -0.3 | | 18 | V | | 5 |
| Output voltage | VOUT | -0.3 | | | V | Max is VIN + 0.3 V or 18 V (whichever is smaller) | 5 |
| SNS voltage | VSNS | -0.3 | | | V | Max is VIN + 0.3 V or 18 V (whichever is smaller) | 5 |
| Enable voltage | VEN | -0.3 | | 18 | V | | 5 |
| Operating junction temperature | TJ | -50 | | 150 | °C | | 5 |
| Storage temperature | TSTG | -65 | | 150 | °C | | 5 |
| ESD HBM | V(ESD) | -3000 | | 3000 | V | Human body model, all pins | 5 |
| ESD CDM | V(ESD) | -1000 | | 1000 | V | Charged device model, all pins | 5 |
| Junction-to-ambient thermal resistance | RθJA | | 77.7 | | °C/W | DRV (WSON) 6 pins | 6 |
| Junction-to-case (top) thermal resistance | RθJC(top) | | 92.3 | | °C/W | DRV (WSON) 6 pins | 6 |
| Junction-to-board thermal resistance | RθJB | | 40.8 | | °C/W | DRV (WSON) 6 pins | 6 |
| Junction-to-top characterization parameter | ΨJT | | 4.3 | | °C/W | DRV (WSON) 6 pins | 6 |
| Junction-to-board characterization parameter | ΨJB | | 40.8 | | °C/W | DRV (WSON) 6 pins | 6 |
| Junction-to-case (bottom) thermal resistance | RθJC(bot) | | 18.9 | | °C/W | DRV (WSON) 6 pins | 6 |
## Materials and finish
As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | copper | | • Use copper planes for device connections to IN, OUT, and GND pins to optimize thermal performance | 24 |
## CAD (KiCad official)
- Symbol: `TLV76708DRVR`
- Footprint: `Package_SON:WSON-6-1EP_2x2mm_P0.65mm_EP1x1.6mm`
- 3D model: WSON-6(2x2) (KiCad packages3D, STEP)
- 3D model files: `tlv76708drvr-etched.step` / `tlv76708drvr-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `tlv76708drvr.step` / `tlv76708drvr.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/lit/ds/symlink/tlv76708drvr.pdf) (43 pp, sha256 `4b6c90cec1ba8e19`, retrieved 2026-10-31, tier: manufacturer)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/tlv76708drvr-datasheet.pdf)