component
TLV76133KVUR
Public Made by Adomby adom
TI(德州仪器) , TO-252. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
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TLV76133KVUR
TI(德州仪器) · IC · TO-252
TLV76133KVUR from TI(德州仪器), in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GND | power_in | Ground pin. |
| 2 | OUT | power_out | Regulated output pin (also connected to the tab); use the recommended output capacitor (1µF min, 2.2µF nominal, 220µF max, ESR 2 to 500mΩ) placed as close to OUT and GND as possible. |
| 3 | IN | power_in | Input supply pin, 2.5V to 18V recommended (20V abs max); place the input capacitor (1µF recommended) as close to IN and GND as possible. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | TI(德州仪器) |
| Package | TO-252 |
| Category | |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Nominal output accuracy | VOUT | -1 | 1 | % | TJ = 25°C | 5 | |
| Output accuracy over temperature | VOUT | -1.75 | 1.75 | % | VIN ≥ 3.0V, VOUT(NOM) ≤ 9.0V, 1mA ≤ IOUT ≤ 1A | 5 | |
| Load regulation | ΔVOUT(ΔIOUT) | 0.1 | 0.75 | %/A | 1mA ≤ IOUT ≤ 1A, VIN ≥ 3.0V | 5 | |
| Dropout voltage | VDO | 0.9 | 1.6 | V | VIN ≥ 3.0V, IOUT = 1A | 5 | |
| Output current limit | ICL | 1.1 | 1.6 | A | VOUT = 0.9 x VOUT(NOM), VIN ≥ 3.0V | 5 | |
| Short-circuit current limit | ISC | 150 | 250 | 350 | mA | VOUT = 0V | 5 |
| Quiescent current | IQ | 65 | 100 | µA | IOUT = 0mA | 5 | |
| Output pulldown current | IPULLDOWN | 0.7 | 1.1 | mA | VIN = 1.8V, VOUT = 2.5V | 5 | |
| UVLO threshold rising | VUVLO+ | 2.2 | 2.4 | V | VIN rising | 5 | |
| Line regulation | ΔVOUT(ΔVIN) | 0.02 | %/V | VOUT(NOM) ≤ 9.0V, VOUT(NOM) + 1.5V ≤ VIN ≤ 18V, IOUT = 10mA | 5 | ||
| Power-supply rejection ratio | PSRR | 70 | dB | VIN = 3.3V, VOUT = 1.8V, IOUT = 300mA, f = 120Hz | 5 | ||
| Output noise voltage | Vn | 60 | µVRMS | BW = 10Hz to 100kHz, VIN = 3.3V, VOUT = 0.8V, IOUT = 100mA | 5 | ||
| UVLO hysteresis | VUVLO(HYS) | 130 | mV | 5 | |||
| UVLO threshold falling | VUVLO- | 1.9 | V | VIN falling | 5 | ||
| Thermal shutdown temperature | TSD(shutdown) | 180 | ºC | Temperature increasing | 5 | ||
| Thermal shutdown reset temperature | TSD(reset) | 160 | ºC | Temperature falling | 5 | ||
| Input voltage (abs max) | VIN | -0.3 | 20 | V | All voltages with respect to GND | 4 | |
| Output voltage (abs max) | VOUT | -0.3 | V | max VIN + 0.3 (or 18 V, whichever is smaller) | 4 | ||
| Operating junction temperature (abs max) | TJ | -50 | 150 | °C | 4 | ||
| Storage temperature | TSTG | -65 | 150 | °C | 4 | ||
| ESD HBM | V(ESD) | -3000 | 3000 | V | Human body model, ANSI/ESDA/JEDEC JS-001, all pins | 4 | |
| ESD CDM | V(ESD) | -1000 | 1000 | V | Charged device model, JESD22-C101, all pins | 4 | |
| Input voltage | VIN | 2.5 | 18 | V | 4 | ||
| Output voltage | VOUT | 0.8 | 13.5 | V | 4 | ||
| Output current | IOUT | 0 | 0.8 | A | 2.5 V ≤ VIN < 3 V | 4 | |
| Output current | IOUT | 0 | 1 | A | VIN ≥ 3 V | 4 | |
| Output capacitor ESR | COUT ESR | 2 | 500 | mΩ | 4 | ||
| Output capacitor | COUT | 1 | 2.2 | 220 | µF | Effective output capacitance of 0.47 µF minimum required for stability | 4 |
| Input capacitor | CIN | 1 | µF | 4 | |||
| Junction temperature | TJ | -40 | 125 | °C | 4 | ||
| Junction-to-ambient thermal resistance | RθJA | 67.2 | °C/W | KVU (TO-252) | 5 | ||
| Junction-to-case (top) thermal resistance | RθJC(top) | 71.8 | °C/W | KVU (TO-252) | 5 | ||
| Junction-to-board thermal resistance | RθJB | 45.5 | °C/W | KVU (TO-252) | 5 | ||
| Junction-to-top characterization parameter | ΨJT | 31.6 | °C/W | KVU (TO-252) | 5 | ||
| Junction-to-board characterization parameter | ΨJB | 45.4 | °C/W | KVU (TO-252) | 5 | ||
| Junction-to-case (bottom) thermal resistance | RθJC(bot) | 40.5 | °C/W | KVU (TO-252) | 5 |
CAD (KiCad official)
- Symbol:
TLV76133KVUR - Footprint:
Package_TO_SOT_SMD:TO-252-2 - 3D model: TO-252 (KiCad packages3D, STEP)
- 3D model files:
tlv76133kvur-etched.step/tlv76133kvur-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);tlv76133kvur.step/tlv76133kvur.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: TI(德州仪器) datasheet (32 pp, sha256
fb909a9169d6d479, retrieved 2026-10-22, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).