component

TLV62595DMQR

Public Made by Adom

by adom

Texas Instruments DC-DC Converters, VSON-6(1.5x1.5). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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TLV62595DMQR

Texas Instruments · DC-DC Converters · VSON-6(1.5x1.5)

TLV62595DMQR from Texas Instruments, in a VSON-6(1.5x1.5). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 EN input Device enable pin; must be pulled high to enable the device, pulling low disables it, and it must not be left floating.
2 PG output Power-good open-drain output; the pullup resistor can be connected to voltages up to 5.5 V, and the pin can be left floating if unused.
3 FB input Feedback pin; for fixed output voltage versions it must be connected to the output.
4 GND power_in Ground pin.
5 SW passive Switch pin of the power stage.
6 VIN power_in Input voltage pin, operating range 2.5 V to 5.5 V.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package VSON-6(1.5x1.5)
Category Power Supply Chip
Pins 6

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Feedback regulation voltage VFB 594 600 606 mV PWM mode, 2.5V ≤ VIN ≤ 5.5V, TJ = -40°C to 125°C 5
Undervoltage lockout threshold VUVLO 2.1 2.2 2.3 V VIN falling 5
High-side FET switch current limit, DC ILIM 4.8 5.6 A 5
EN high-level threshold voltage VIH 1 V VIN = 2.5 V to 5.5 V 5
EN low-level threshold voltage VIL 0.4 V VIN = 2.5 V to 5.5 V 5
PG low-level output voltage VPG,OL 0.4 V Isink = 1 mA 5
Quiescent current IQ 10 µA EN = high, no load, device not switching 5
Shutdown current ISD 0.05 µA EN = low, TJ = -40℃ to 85℃ 5
UVLO hysteresis 160 mV VIN rising 5
Thermal shutdown threshold TJSD 150 °C TJ rising 5
Thermal shutdown hysteresis 20 °C TJ falling 5
Soft-start time tSS 1.75 ms Time from EN high to 95% of VOUT nominal 5
Power good lower threshold, rising VPG 96 % VPG rising, VFB referenced to VFB nominal 5
Power good lower threshold, falling VPG 92 % VPG falling, VFB referenced to VFB nominal 5
Power good upper threshold, rising VPG 105 % VPG rising, VFB referenced to VFB nominal 5
Power good upper threshold, falling VPG 110 % VPG falling, VFB referenced to VFB nominal 5
PG input leakage current IPG,LKG 0.01 µA VPG = 5.0 V 5
PG deglitch delay, rising edge tPG,DLY 100 µs PG rising edge 5
PG deglitch delay, falling edge tPG,DLY 20 µs PG falling edge 5
Feedback input leakage current IFB,LKG 0.01 µA VFB = 0.6V 5
Output discharge current IDIS 400 mA VSW = 0.4V; EN = low 5
Load regulation 0.1 %/A IOUT = 0.5A to 3A, VOUT = 1.8V 5
High-side FET on-resistance RDS(on) 26 mΩ 5
Low-side FET on-resistance RDS(on) 25 mΩ 5
PWM switching frequency fSW 2.2 MHz IOUT = 1A, VOUT = 1.8V 5
Pin voltage VIN, FB, EN, PG -0.3 6 V 4
Pin voltage SW (DC) -0.3 0.3 V Max is VIN + 0.3 V 4
Pin voltage SW (DC, in current limit) -1 0.3 V Max is VIN + 0.3 V 4
Pin voltage SW (AC, less than 10ns) -2.5 10 V While switching 4
Operating junction temperature TJ -40 150 °C 4
Storage temperature TSTG -65 150 °C 4
ESD HBM V(ESD) -2000 2000 V Human body model, ANSI/ESDA/JEDEC JS-001 4
ESD CDM V(ESD) -500 500 V Charged device model, JS-002 4
Input voltage range VIN 2.5 5.5 V 4
Output voltage range VOUT 0.6 4 V 4
Output current range IOUT 0 4 A 4
PG pull-up resistor voltage VPG 5.5 V 4
Sink current at PG pin ISINK_PG 1 mA 4
Operating junction temperature TJ -40 125 °C 4
Junction-to-ambient thermal resistance RθJA 129.5 °C/W DMQ (JEDEC), 6 pins 4
Junction-to-case (top) thermal resistance RθJC(top) 103.9 °C/W DMQ (JEDEC) 4
Junction-to-board thermal resistance RθJB 33.1 °C/W DMQ (JEDEC) 4
Junction-to-top characterization parameter ΨJT 3.8 °C/W DMQ (JEDEC) 4
Junction-to-board characterization parameter YJB 33.1 °C/W DMQ (JEDEC) 4

CAD (KiCad official)

  • Symbol: TLV62595DMQR
  • Footprint: Package_SON:WSON-6_1.5x1.5mm_P0.5mm
  • 3D model: VSON-6(1.5x1.5) (KiCad packages3D, STEP)
  • 3D model files: tlv62595dmqr-etched.step / tlv62595dmqr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tlv62595dmqr.step / tlv62595dmqr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (27 pp, sha256 90b6097fafbdf9d5, retrieved 2026-10-22, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF