component
TLV62065DSGR
Public Made by Adomby adom
Texas Instruments DC-DC Converters, WSON-8-EP(2x2). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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page.json+7−4@@ -44,7 +44,7 @@ "number": "2", "name": "SW", "type": "output",- "description": "Switch output pin connected to internal high-side and low-side MOSFET switches; connect 0.7-1.6 \u00b5H inductor between this terminal and output capacitor."+ "description": "Switch output pin connected to internal high-side and low-side MOSFET switches; connect 0.7-1.6 µH inductor between this terminal and output capacitor." }, { "number": "3",@@ -62,7 +62,7 @@ "number": "5", "name": "EN", "type": "input",- "description": "Active-high enable input control pin; pulling low forces device into shutdown mode with < 1 \u00b5A quiescent current and internal output capacitor discharge, pulling high enables device with 500 \u00b5s typical startup to 95% output voltage."+ "description": "Active-high enable input control pin; pulling low forces device into shutdown mode with < 1 µA quiescent current and internal output capacitor discharge, pulling high enables device with 500 µs typical startup to 95% output voltage." }, { "number": "6",@@ -86,7 +86,7 @@ "number": "9", "name": "Thermal Pad (Exposed)", "type": "power_in",- "description": "Exposed thermal pad for device ground and thermal dissipation; must be soldered to PCB ground plane with multiple vias to achieve 34.5 \u00b0C/W junction-to-board thermal resistance."+ "description": "Exposed thermal pad for device ground and thermal dissipation; must be soldered to PCB ground plane with multiple vias to achieve 34.5 °C/W junction-to-board thermal resistance." } ], "provenance": {@@ -164,5 +164,8 @@ "docs/tlv62065dsgr-datasheet.pdf", "viewers/symbol.html", "viewers/footprint.html"- ]+ ],+ "visibility": {+ "public": true+ } }