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TLV5623IDR

Public Made by Adom

by adom

Texas Instruments Digital To Analog Converters (DAC), SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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Generated by kicad-footprint-generator · KiCad file format 20260206
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tlv5623idr-hero.glb tlv5623idr: hero GLB from the etched model (keeps the MPN mark) · Ray 18d ago
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TLV5623IDR

Texas Instruments · Digital To Analog Converters (DAC) · SOIC-8

TLV5623IDR from Texas Instruments, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 DIN input Serial digital data input; the 16-bit word is shifted in MSB first on the falling edges of SCLK while CS is low and FS is low.
2 SCLK input Serial digital clock input; the maximum clock frequency is 20 MHz per the recommended operating conditions.
3 CS input Chip select, digital input, active low; it enables the serial interface when low and can be tied low in three-wire operation.
4 FS input Frame sync digital input used for 4-wire serial interfaces such as the TMS320 DSP interface; a falling edge starts the data shift and the DAC updates after 16 bits or on the FS rising edge.
5 AGND power_in Analog ground; the datasheet recommends connecting it to the system analog ground plane, with a 0.1 µF bypass between VDD and AGND.
6 REFIN input Reference analog input voltage to a high-impedance buffer; the range is AGND to VDD−1.5 V, and a reference at or above VDD/2 clips the transfer function because of the x2 output buffer.
7 OUT output DAC analog output from the rail-to-rail x2 output buffer; the recommended load is 2 kΩ to 10 kΩ with load capacitance up to 100 pF.
8 VDD power_in Positive power supply; the device operates from 2.7 V to 5.5 V, with VDD to AGND rated at 7 V maximum.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package SOIC-8
Category Data Acquisition
Pins 8

CAD (KiCad official)

  • Symbol: TLV5623IDR
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: tlv5623idr-etched.step / tlv5623idr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tlv5623idr.step / tlv5623idr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (27 pp, sha256 2f53a7eb1371df7b, retrieved 2026-10-07, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF