component
TLV5623IDR
Public Made by Adomby adom
Texas Instruments Digital To Analog Converters (DAC), SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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README.mdadded+44@@ -0,0 +1,44 @@+# TLV5623IDR++**Texas Instruments** · Digital To Analog Converters (DAC) · SOIC-8++TLV5623IDR from Texas Instruments, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.++## Pinout++| Pin | Name | Type | Function |+|---|---|---|---|+| 1 | DIN | input | Serial digital data input; the 16-bit word is shifted in MSB first on the falling edges of SCLK while CS is low and FS is low. |+| 2 | SCLK | input | Serial digital clock input; the maximum clock frequency is 20 MHz per the recommended operating conditions. |+| 3 | CS | input | Chip select, digital input, active low; it enables the serial interface when low and can be tied low in three-wire operation. |+| 4 | FS | input | Frame sync digital input used for 4-wire serial interfaces such as the TMS320 DSP interface; a falling edge starts the data shift and the DAC updates after 16 bits or on the FS rising edge. |+| 5 | AGND | power_in | Analog ground; the datasheet recommends connecting it to the system analog ground plane, with a 0.1 µF bypass between VDD and AGND. |+| 6 | REFIN | input | Reference analog input voltage to a high-impedance buffer; the range is AGND to VDD−1.5 V, and a reference at or above VDD/2 clips the transfer function because of the x2 output buffer. |+| 7 | OUT | output | DAC analog output from the rail-to-rail x2 output buffer; the recommended load is 2 kΩ to 10 kΩ with load capacitance up to 100 pF. |+| 8 | VDD | power_in | Positive power supply; the device operates from 2.7 V to 5.5 V, with VDD to AGND rated at 7 V maximum. |++## Key specifications++| Parameter | Value |+|---|---|+| Manufacturer | Texas Instruments |+| Package | SOIC-8 |+| Category | Data Acquisition |+| Pins | 8 |++## CAD (KiCad official)++- Symbol: `TLV5623IDR`+- Footprint: `Package_SO:SOIC-8_3.9x4.9mm_P1.27mm`+- 3D model: SOIC-8 (KiCad packages3D, STEP)+- 3D model files: `tlv5623idr-etched.step` / `tlv5623idr-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `tlv5623idr.step` / `tlv5623idr.glb` are the bare package body.++## Provenance++Data extracted from the manufacturer datasheet, not a distributor listing:++- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/lit/ds/symlink/tlv5623.pdf) (27 pp, sha256 `2f53a7eb1371df7b`, retrieved 2026-10-07, tier: manufacturer)+- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.+- **CAD:** KiCad official libraries (CC-BY-SA 4.0).++[Datasheet PDF](docs/tlv5623idr-datasheet.pdf)
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