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Contents

README

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TLV5620IDR

Texas Instruments · Digital To Analog Converters (DAC) · SOP-14

TLV5620IDR from Texas Instruments, in a SOP-14. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground return and reference terminal for the device.
2 REFA input Reference voltage input to DAC A, which defines the output analog range.
3 REFB input Reference voltage input to DAC B, which defines the analog output range.
4 REFC input Reference voltage input to DAC C, which defines the analog output range.
5 REFD input Reference voltage input to DAC D, which defines the analog output range.
6 DATA input Serial interface digital data input, with each data bit clocked into the serial register on the falling edge of CLK.
7 CLK input Serial interface clock; input digital data is shifted into the serial interface register on the falling edge of CLK.
8 LOAD input Serial interface load control; when LDAC is low, the falling edge of LOAD latches the data into the output latch and immediately produces the analog output voltage.
9 DACD output DAC D analog output.
10 DACC output DAC C analog output.
11 DACB output DAC B analog output.
12 DACA output DAC A analog output.
13 LDAC input Load DAC; when high, no DAC output updates occur during serial input, and the DAC outputs update only when LDAC is taken from high to low.
14 VDD power_in Positive supply voltage; the recommended supply range is 2.7 V to 5.25 V.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package SOP-14
Category Data Acquisition
Pins 14

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage VDD 7 V VDD, GND 7
Storage temperature range Tstg -50 150 °C 7
Lead temperature 260 °C 1,6 mm (1/16 inch) from case for 10 seconds 7
Supply voltage VDD 2.7 3.3 5.25 V 7
Low-level input voltage VIL 0.8 V 7
Load resistance RL 10 kΩ 7
Setup time, data input tsu(DATA-CLK) 50 ns see Figures 1 and 2 7
Valid time, data input valid after CLK↓ tv(DATA-CLK) 50 ns see Figures 1 and 2 7
Setup time, CLK eleventh falling edge to LOAD tsu(CLK-LOAD) 50 ns see Figure 1 7
Setup time, LOAD↑ to CLK↓ tsu(LOAD-CLK) 50 ns see Figure 1 7
Pulse duration, LOAD tw(LOAD) 250 ns see Figure 1 7
Pulse duration, LDAC tw(LDAC) 250 ns see Figure 2 7
Setup time, LOAD↑ to LDAC↓ tsu(LOAD-LDAC) 0 ns see Figure 2 7
CLK frequency 1 MHz 7
Operating free-air temperature TLV5620I TA -40 85 °C TLV5620I 7
Operating free-air temperature range TLV5620I TA -40 85 °C TLV5620I 7
High-level input current IIH -10 10 µA VI = VDD 8
Low-level input current IIL -10 10 µA VI = 0 V 8
Output sink current IO(sink) 20 µA Each DAC output 8
Output source current IO(source) 1 mA Each DAC output 8
Input capacitance Ci 15 pF 8
Reference input capacitance Ci 15 pF 8
Supply current IDD 2 mA VDD = 3.3 V 8
Reference input current Iref -10 10 µA VDD = 3.3 V, Vref = 1.5 V 8
Linearity error (end point corrected) EL -1 1 LSB Vref = 1.25 V, × 2 gain, See Note 1 8
Differential linearity error ED -0.9 0.9 LSB Vref = 1.25 V, × 2 gain, See Note 2 8
Zero-scale error EZS 0 30 mV Vref = 1.25 V, × 2 gain, See Note 3 8
Zero-scale error temperature coefficient 10 µV/°C Vref = 1.25 V, × 2 gain, See Note 4 8
Full-scale error EFS -60 60 mV Vref = 1.25 V, × 2 gain, See Note 5 8
Full-scale error temperature coefficient -25 25 µV/°C Vref = 1.25 V, × 2 gain, See Note 6 8
Power-supply sensitivity PSRR 0.5 mV/V See Notes 7 and 8 8
Output slew rate 1 V/µs CL = 100 pF RL = 10 kΩ 8
Output settling time 10 µs To ±0.5 LSB, CL = 100 pF, RL = 10 kΩ, See Note 9 8
Large-signal bandwidth 100 kHz Measured at -3 dB point 8
Digital crosstalk -50 dB CLK = 1-MHz square wave measured at DACA-DACD 8
Reference feedthrough -60 dB See Note 10 8
Channel-to-channel isolation -60 dB See Note 11 8
Reference input bandwidth 100 kHz See Note 12 8

CAD (KiCad official)

  • Symbol: TLV5620IDR
  • Footprint: Package_SO:SOIC-14_3.9x8.7mm_P1.27mm
  • 3D model: SOP-14 (KiCad packages3D, STEP)
  • 3D model files: tlv5620idr-etched.step / tlv5620idr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tlv5620idr.step / tlv5620idr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (17 pp, sha256 7e1717b3cf48348b, retrieved 2026-11-05, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF