component
TLV5617ACDR
Public Made by Adomby adom
Texas Instruments Digital To Analog Converters (DAC), SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownTLV5617ACDR
Texas Instruments · Digital To Analog Converters (DAC) · SOIC-8
TLV5617ACDR from Texas Instruments, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | DIN | input | Digital serial data input; data is shifted in MSB first on the falling edges of SCLK, with 16 bits per write word. |
| 2 | SCLK | input | Digital serial clock input; the maximum serial clock frequency is 20 MHz. |
| 3 | CS | input | Chip select, digital input active low, used to enable and disable the serial inputs; setup time is 10 ns (VDD = 2.7 V to 3.3 V) or 5 ns (VDD = 4.5 V to 5.5 V) before the first negative SCLK edge. |
| 4 | OUTA | output | DAC A analog voltage output from a rail-to-rail x2 buffer, driving a minimum load of 2 kΩ and maximum load capacitance of 100 pF. |
| 5 | AGND | power_in | Analog ground reference for the device. |
| 6 | REF | input | Analog reference voltage input; the reference input voltage range is 0 to VDD - 1.5 V, and a reference of (VDD - 0.4 V)/2 or higher causes clipping of the transfer function. |
| 7 | OUTB | output | DAC B analog voltage output from a rail-to-rail x2 buffer, driving a minimum load of 2 kΩ and maximum load capacitance of 100 pF. |
| 8 | VDD | power_in | Positive power supply; 2.7 V to 3.3 V at VDD = 3 V nominal and 4.5 V to 5.5 V at VDD = 5 V nominal, absolute maximum 7 V. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SOIC-8 |
| Category | Data Acquisition |
| Pins | 8 |
CAD (KiCad official)
- Symbol:
TLV5617ACDR - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files:
tlv5617acdr-etched.step/tlv5617acdr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);tlv5617acdr.step/tlv5617acdr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (22 pp, sha256
da1fd4a026e2fb35, retrieved 2026-10-08, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).