component
TLV3702ID
Public Made by Adomby adom
Texas Instruments Comparators, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownTLV3702ID
Texas Instruments · Comparators · SOIC-8
TLV3702ID from Texas Instruments, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1OUT | output | Comparator output for channel 1 (push-pull output stage per the device features). |
| 2 | 1IN- | input | Inverting input for channel 1. |
| 3 | 1IN+ | input | Noninverting input for channel 1. |
| 4 | GND | power_in | Ground reference; all voltages are referenced to GND. |
| 5 | 2IN+ | input | Noninverting input for channel 2. |
| 6 | 2IN- | input | Inverting input for channel 2. |
| 7 | 2OUT | output | Comparator output for channel 2 (push-pull output stage per the device features). |
| 8 | VCC | power_in | Positive power supply; recommended single-supply range is 2.7 V to 16 V for the I-suffix version. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SOIC-8 |
| Category | Amplifiers/Comparators |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply voltage, VCC (absolute maximum) | VCC | 17 | V | 6 | |||
| Differential input voltage | VID | -20 | 20 | V | 6 | ||
| Input voltage | VI | 0 | V | Printed max is VCC + 5 V (non-numeric); limited to 20 V max or VCC + 5 V, whichever is smaller | 6 | ||
| Input current | II | -10 | 10 | mA | 6 | ||
| Output current | IO | -10 | 10 | mA | 6 | ||
| Maximum junction temperature | TJ | 150 | °C | 6 | |||
| Lead temperature | 260 | °C | 1,6 mm (1/16 inch) from case for 10 seconds | 6 | |||
| Storage temperature | Tstg | -65 | 150 | °C | 6 | ||
| Supply voltage, single supply (I-suffix) | VCC | 2.7 | 16 | V | Single supply, I-suffix | 6 | |
| Supply voltage, split supply (I-suffix) | VCC | 1.35 | 8 | V | Split supply, printed as ±1.35 to ±8 V, I-suffix | 6 | |
| Common-mode input voltage | VICR | -0.1 | V | Printed max is VCC + 5 V (non-numeric) | 6 | ||
| Operating free-air temperature (I-suffix) | TA | -40 | 125 | °C | I-suffix | 6 | |
| Input offset voltage | VIO | 250 | 5000 | µV | VIC = VCC/2, RS = 50Ω, TA = 25°C | 8 | |
| Input offset voltage | VIO | 7000 | µV | VIC = VCC/2, RS = 50Ω, full range (–40°C to 125°C for I suffix) | 8 | ||
| Input hysteresis voltage | VHYS | 1 | 2.8 | 5 | mV | VIC = VCC/2, RS = 50Ω, TA = 25°C | 8 |
| Low-level output voltage | VOL | 80 | 200 | mV | VIC = VCC/2, IOH = 50μA, VID = –1V, TA = 25°C | 8 | |
| Low-level output voltage | VOL | 300 | mV | VIC = VCC/2, IOH = 50μA, VID = –1V, full range | 8 | ||
| Supply current (per channel), output state high | ICC | 560 | 800 | nA | Output state high, TA = 25°C | 8 | |
| Supply current (per channel), output state high | ICC | 1000 | nA | Output state high, full range | 8 | ||
| Input offset current | IIO | 20 | 100 | pA | VIC = VCC/2, RS = 50Ω, TA = 25°C | 8 | |
| Input offset current | IIO | 1000 | pA | VIC = VCC/2, RS = 50Ω, full range | 8 | ||
| Input bias current | IIB | 80 | 250 | pA | VIC = VCC/2, RS = 50Ω, TA = 25°C | 8 | |
| Input bias current | IIB | 1500 | pA | VIC = VCC/2, RS = 50Ω, full range | 8 | ||
| Junction-to-ambient thermal resistance (D, SOIC-8) | RθJA | 116.7 | °C/W | 7 | |||
| Junction-to-case (top) thermal resistance (D, SOIC-8) | RθJC(top) | 59.4 | °C/W | 7 | |||
| Junction-to-board thermal resistance (D, SOIC-8) | RθJB | 60.2 | °C/W | 7 | |||
| Junction-to-top characterization parameter (D, SOIC-8) | ψJT | 14.6 | °C/W | 7 | |||
| Junction-to-board characterization parameter (D, SOIC-8) | ψJB | 59.5 | °C/W | 7 |
CAD (KiCad official)
- Symbol:
TLV3702ID - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files:
tlv3702id-etched.step/tlv3702id-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);tlv3702id.step/tlv3702id.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (43 pp, sha256
82e4a01d5c37ef4d, retrieved 2026-10-10, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).