component
TLV2888DR
Public Made by Adomby adom
Texas Instruments Precision Op Amps, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownTLV2888DR
Texas Instruments · Precision Op Amps · SOIC-8
TLV2888DR from Texas Instruments, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | OUT A | output | Output of channel A. |
| 2 | -IN A | input | Inverting input of channel A. |
| 3 | +IN A | input | Noninverting input of channel A. |
| 4 | V- | power_in | Negative supply; supply range (V+)-(V-) is 4.5V to 36V single supply or ±2.25V to ±18V dual supply. |
| 5 | +IN B | input | Noninverting input of channel B. |
| 6 | -IN B | input | Inverting input of channel B. |
| 7 | OUT B | output | Output of channel B. |
| 8 | V+ | power_in | Positive supply; supply range (V+)-(V-) is 4.5V to 36V single supply, with an absolute maximum of 40V. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SOIC-8 |
| Category | Amplifiers/Comparators |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply voltage (absolute max) | VS | 40 | V | 6 | |||
| Signal input pin common-mode voltage | -0.5 | 0.5 | V | (V-), 0.5 to (V+) + 0.5; values are offsets relative to rails | 6 | ||
| Signal input pin current | -10 | 10 | mA | 6 | |||
| Operating temperature (absolute max) | TA | -55 | 150 | °C | 6 | ||
| Junction temperature | TJ | 150 | °C | 6 | |||
| Storage temperature | Tstg | -65 | 150 | °C | 6 | ||
| ESD HBM | V(ESD) | -4000 | 4000 | V | HBM, ANSI/ESDA/JEDEC JS-001 | 6 | |
| ESD CDM | V(ESD) | -250 | 250 | V | TLV2888D CDM, JS-002 | 6 | |
| Supply voltage, single supply | VS | 4.5 | 36 | V | Single supply | 6 | |
| Supply voltage, dual supply | VS | -2.25 | 18 | V | Dual supply, ±2.25 to ±18 | 6 | |
| Operating temperature | TA | -40 | 125 | °C | 6 | ||
| Input offset voltage | VOS | -15 | 3 | 15 | µV | TA = 25°C | 8 |
| Input offset voltage over temperature | VOS | -20 | 20 | µV | TA = -40°C to +125°C | 8 | |
| Input offset voltage drift | dVOS/dT | -0.05 | 0.01 | 0.05 | µV/°C | TA = -40°C to +125°C | 8 |
| Power-supply rejection ratio | PSRR | 0.03 | 0.5 | µV/V | TA = -40°C to +125°C | 8 | |
| Input bias current | IB | -350 | 50 | 350 | pA | TA = 25°C | 8 |
| Input bias current over temperature | IB | 7 | nA | TA = -40°C to +125°C | 8 | ||
| Input offset current | IOS | -600 | 100 | 600 | pA | TA = 25°C | 8 |
| Input offset current over temperature | IOS | 3 | nA | TA = -40°C to +125°C | 8 | ||
| Common-mode voltage range low | VCM | -0.1 | V | (V-), 0.1; upper limit (V+), 1.7 | 8 | ||
| CMRR, VS = ±2.25V | CMRR | 118 | 135 | dB | (V-), 0.1V ≤ VCM ≤ (V+), 1.7V, VS = ±2.25V | 8 | |
| CMRR, VS = ±18V | CMRR | 140 | 150 | dB | (V-), 0.1V ≤ VCM ≤ (V+), 1.7V, VS = ±18V | 8 | |
| CMRR over temperature, VS = ±2.25V | CMRR | 118 | 130 | dB | TA = -40°C to +125°C, VS = ±2.25V | 8 | |
| CMRR over temperature, VS = ±18V | CMRR | 140 | 150 | dB | TA = -40°C to +125°C, VS = ±18V | 8 | |
| Open-loop voltage gain, RLOAD = 10kΩ | AOL | 130 | 148 | dB | VS = ±15V, (V-) + 0.6V < VO < (V+), 0.6V, RLOAD = 10kΩ | 8 | |
| Open-loop voltage gain, RLOAD = 10kΩ, over temperature | AOL | 130 | dB | TA = -40°C to +125°C | 8 | ||
| Open-loop voltage gain, RLOAD = 2kΩ | AOL | 130 | 144 | dB | VS = ±15V, (V-) + 1.7V < VO < (V+), 1.7V, RLOAD = 2kΩ | 8 | |
| Open-loop voltage gain, RLOAD = 2kΩ, over temperature | AOL | 130 | dB | TA = -40°C to +125°C | 8 | ||
| Output swing from positive rail, no load | VO | 26 | 40 | mV | Positive rail, VS = 30V, no load | 9 | |
| Output swing from positive rail, 10kΩ | VO | 122 | 150 | mV | Positive rail, VS = 30V, RLOAD = 10kΩ | 9 | |
| Output swing from positive rail, 2kΩ | VO | 500 | 575 | mV | Positive rail, VS = 30V, RLOAD = 2kΩ | 9 | |
| Output swing from negative rail, no load | VO | 26 | 40 | mV | Negative rail, VS = 30V, no load | 9 | |
| Output swing from negative rail, 10kΩ | VO | 120 | 135 | mV | Negative rail, VS = 30V, RLOAD = 10kΩ | 9 | |
| Output swing from negative rail, 2kΩ | VO | 515 | 575 | mV | Negative rail, VS = 30V, RLOAD = 2kΩ | 9 | |
| Output swing from rail over temperature | VO | 250 | mV | RLOAD = 10kΩ, TA = -40°C to +125°C, both rails | 9 | ||
| Quiescent current per amplifier, 4.5V | IQ | 1.5 | 1.8 | mA | VS = ±2.25V (VS = 4.5V), IO = 0A | 9 | |
| Quiescent current per amplifier, 4.5V, over temperature | IQ | 1.5 | 1.9 | mA | VS = ±2.25V (VS = 4.5V), IO = 0A, TA = -40°C to +125°C | 9 | |
| Quiescent current per amplifier, 36V | IQ | 1.5 | 1.8 | mA | VS = ±18V (VS = 36V), IO = 0A | 9 | |
| Quiescent current per amplifier, 36V, over temperature | IQ | 1.5 | 1.9 | mA | VS = ±18V (VS = 36V), IO = 0A, TA = -40°C to +125°C | 9 | |
| Short-circuit current | ISC | 42 | mA | ±42 mA typical | 9 | ||
| Gain-bandwidth product | GBW | 14 | MHz | 9 | |||
| Slew rate | SR | 40 | V/µs | Gain = 1, 10V step | 9 | ||
| Input voltage noise 0.1Hz to 10Hz | En | 0.18 | µVPP | f = 0.1Hz to 10Hz | 8 | ||
| Input voltage noise density | en | 7.5 | nV/√Hz | f = 1kHz | 8 | ||
| Junction-to-ambient thermal resistance | RθJA | 132.3 | °C/W | TLV2888 D (SOIC), 8 pins | 7 | ||
| Junction-to-case (top) thermal resistance | RθJC(top) | 72.2 | °C/W | TLV2888 D (SOIC), 8 pins | 7 | ||
| Junction-to-board thermal resistance | RθJB | 81.7 | °C/W | TLV2888 D (SOIC), 8 pins | 7 | ||
| Junction-to-top characterization parameter | ΨJT | 19.6 | °C/W | TLV2888 D (SOIC), 8 pins | 7 | ||
| Junction-to-board characterization parameter | ΨJB | 80.6 | °C/W | TLV2888 D (SOIC), 8 pins | 7 |
CAD (KiCad official)
- Symbol:
TLV2888DR - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files:
tlv2888dr-etched.step/tlv2888dr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);tlv2888dr.step/tlv2888dr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (55 pp, sha256
cfad4277ce2e96a3, retrieved 2026-10-27, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).