component
TLV272IDGKR
Public Made by Adomby adom
Texas Instruments Precision OpAmps, VSSOP-8. Pinout extracted from the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownTLV272IDGKR
Texas Instruments · Precision OpAmps · VSSOP-8
TLV272IDGKR from Texas Instruments, in a VSSOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1OUT | output | Output of amplifier channel 1. Rail-to-rail output stage; can swing close to VDD and GND rails driving typical resistive/capacitive loads. |
| 2 | 1IN- | input | Inverting input of amplifier channel 1. CMOS high-impedance input, typical input bias current 1 pA. |
| 3 | 1IN+ | input | Noninverting input of amplifier channel 1. CMOS high-impedance input, typical input bias current 1 pA. |
| 4 | GND | power_in | Negative (lowest) supply or ground for single-supply operation. Also serves as V- rail for split-supply operation. |
| 5 | 2IN+ | input | Noninverting input of amplifier channel 2. CMOS high-impedance input, typical input bias current 1 pA. |
| 6 | 2IN- | input | Inverting input of amplifier channel 2. CMOS high-impedance input, typical input bias current 1 pA. |
| 7 | 2OUT | output | Output of amplifier channel 2. Rail-to-rail output stage; can swing close to VDD and GND rails driving typical resistive/capacitive loads. |
| 8 | VDD | power_in | Positive (highest) supply. Operating range 2.7 V to 16 V single supply (or ±1.35 V to ±8 V split). Decouple to GND with 100-nF ceramic close to the pin. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | VSSOP-8 |
| Category | Op-amp/Cmp |
| Pins | 8 |
Ordering variants
Same part, different packaging or reel option.
TLV272IDGKRTLV272IDGKRIDRTLV272IDGKRIP
CAD (KiCad official)
- Symbol:
TLV272IDGKR - Footprint:
Package_SO:VSSOP-8_2.3x2mm_P0.5mm - 3D model: VSSOP-8 (KiCad packages3D, STEP)
- 3D model files:
tlv272idgkr-etched.step/tlv272idgkr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);tlv272idgkr.step/tlv272idgkr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (42 pp, sha256
a77d37e855d94de5, retrieved 2026-08-17, tier: manufacturer) - Extractor:
ds2sf(Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate. - CAD: KiCad official libraries (CC-BY-SA 4.0).