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Generated by kicad-footprint-generator · KiCad file format 20260206
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docs tlv2634ipwr: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray
viewers pin 1: carry the footprint's marker into the .lbr, the viewer and page.json (silk-marker, drawn, top-left) · Ray
package.json Publish 0.2.0 · Ray
pads.json pin 1: carry the footprint's marker into the .lbr, the viewer and page.json (silk-marker, drawn, top-left) · Ray
page.json tlv2634ipwr: white body in tscircuit (pre-1.8 etch structure under an assembly instance); Ray 2026-10-19: black IC body… · Ray
README.md tlv2634ipwr: specified limits as data (metadata.characteristics, 13 rows from the datasheet) · Ray
tlv2634ipwr-etched.fit.json tlv2634ipwr: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray
tlv2634ipwr-etched.glb tlv2634ipwr: white body in tscircuit (pre-1.8 etch structure under an assembly instance); Ray 2026-10-19: black IC body… · Ray
tlv2634ipwr-etched.step tlv2634ipwr: white body in tscircuit (pre-1.8 etch structure under an assembly instance); Ray 2026-10-19: black IC body… · Ray
tlv2634ipwr.glb Publish 0.1.0 · Ray
tlv2634ipwr.kicad_mod Publish 0.1.0 · Ray
tlv2634ipwr.kicad_sym Publish 0.1.0 · Ray
tlv2634ipwr.lbr rebuild the library on adom-lbr 2.32.0. The published copy was built by 2.18.0, which imported every KiCad roundrect an… · Ray
tlv2634ipwr.step Publish 0.1.0 · Ray

TLV2634IPWR

UMW · Operational Amplifier · TSSOP-14

TLV2634IPWR from UMW, in a TSSOP-14. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1OUT output Op-amp channel 1 output. Rail-to-rail; sources ~14 mA @ VDD=2.7 V, ~28 mA @ VDD=5 V; short-circuit current ~50-95 mA.
2 1IN- input Op-amp channel 1 inverting input. Input range GND to VDD-1 V; input bias current ~1 pA typ.
3 1IN+ input Op-amp channel 1 non-inverting input. Input range GND to VDD-1 V.
4 VDD power_in Positive supply voltage. Single-supply 2.7 V to 5.5 V (absolute max 6 V); split-supply ±1.35 V to ±2.75 V. Supply current ~730 μA/channel active, ~4 μA/channel in shutdown.
5 2IN+ input Op-amp channel 2 non-inverting input. Input range GND to VDD-1 V.
6 2IN- input Op-amp channel 2 inverting input. Input range GND to VDD-1 V.
7 2OUT output Op-amp channel 2 output. Rail-to-rail; short-circuit current up to ~95 mA @ VDD=5 V.
8 3OUT output Op-amp channel 3 output. Rail-to-rail.
9 3IN- input Op-amp channel 3 inverting input. Input range GND to VDD-1 V.
10 3IN+ input Op-amp channel 3 non-inverting input. Input range GND to VDD-1 V.
11 GND power_in Ground / negative supply reference. Tied to 0 V in single-supply operation or to the negative rail in split-supply operation.
12 4IN+ input Op-amp channel 4 non-inverting input. Input range GND to VDD-1 V.
13 4IN- input Op-amp channel 4 inverting input. Input range GND to VDD-1 V.
14 4OUT output Op-amp channel 4 output. Rail-to-rail.

Key specifications

Parameter Value
Manufacturer UMW
Package TSSOP-14
Category Op-amp/Cmp
Pins 14

Ordering variants

Same part, different packaging or reel option.

  • TLV2634IPWR
  • TLV2634IPWRID
  • TLV2634IPWRIDR

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage, VDD (single supply) VDD 2.7 5.5 V Relative to GND 3
Operating free-air temperature, TA TA -40 125 °C I-suffix 3
VIL VIL 0.4 V 3
VIH VIH 2 V 3
Supply voltage, VDD VDD 6 V 3
Input current, II (any input) II -10 10 mA any input 3
Output current, IO IO -40 40 mA 3
Operating free-air temperature range, TA: l-suffix TA -40 125 °C l-suffix 3
Maximum junction temperature, TJ TJ 150 °C 3
Storage temperature range, TSTG TSTG -65 150 °C 3
Lead temperature 260 °C 1,6 mm (1/16 inch) from case for 10 seconds 3
Supply current (per channel), 25°C IDD 730 1000 μA SHDN=VDD, No load, TA=25°C 6
Supply current (per channel), full range IDD 1350 μA SHDN=VDD, No load, TA=Full range 6

CAD (KiCad official)

  • Symbol: TLV2634IPWR
  • Footprint: Package_SO:TSSOP-14_4.4x5mm_P0.65mm
  • 3D model: TSSOP-14 (KiCad packages3D, STEP)
  • 3D model files: tlv2634ipwr-etched.step / tlv2634ipwr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tlv2634ipwr.step / tlv2634ipwr.glb are the bare package body.

3D model downloads

Two STEP files. Same geometry, different body top:

File Size Use it when
tlv2634ipwr.step 194 KB You want the bare part, or you mark your own boards.
tlv2634ipwr-etched.step 2.3 MB You want the part with TLV2634IPWR already on it.

The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 594 faces against 237 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: UMW datasheet (18 pp, sha256 76cad1ebdacb7637, retrieved 2026-08-17, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF