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TLV2632IDR

UMW · Operational Amplifier · SOP-8

TLV2632IDR from UMW, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1OUT output Output of amplifier channel 1. Rail-to-rail output; sources ~14 mA (VDD=2.7 V) to ~28 mA (VDD=5 V), short-circuit current 50-95 mA. Output swings within a few mV of GND and within ~100 mV of VDD.
2 1IN- input Inverting input of amplifier channel 1. High-impedance CMOS input (~1000 GΩ differential, ~12 pF common-mode capacitance). Input bias current typ 1 pA. Common-mode range GND to VDD-1 V.
3 1IN+ input Non-inverting input of amplifier channel 1. High-impedance CMOS input with common-mode range that includes ground (GND to VDD-1 V). Absolute input current must be limited to ±10 mA.
4 GND power_in Ground / negative supply rail. Reference for input common-mode range (VICR extends down to GND). In split-supply operation this pin connects to the negative rail (±1.35 V to ±2.75 V).
5 2IN+ input Non-inverting input of amplifier channel 2. High-impedance CMOS input; common-mode range GND to VDD-1 V. Same characteristics as channel 1 non-inverting input.
6 2IN- input Inverting input of amplifier channel 2. High-impedance CMOS input (~1000 GΩ differential). Input bias current typ 1 pA (50 pA max at 25 °C).
7 2OUT output Output of amplifier channel 2. Rail-to-rail output; drives ±40 mA maximum output current (absolute max). Short-circuit output current up to 95 mA at VDD=5 V.
8 VDD power_in Positive supply rail. Single-supply range 2.7 V to 5.5 V (absolute max 6 V). Supply current 730 µA/channel typical. Bypass with a 0.1 µF ceramic capacitor to GND close to the pin.

Key specifications

Parameter Value
Manufacturer UMW
Package SOP-8
Category Op-amp/Cmp
Pins 8

Ordering variants

Same part, different packaging or reel option.

  • TLV2632IDR

CAD (KiCad official)

  • Symbol: TLV2632IDR
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: tlv2632idr-etched.step / tlv2632idr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tlv2632idr.step / tlv2632idr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: UMW datasheet (18 pp, sha256 76cad1ebdacb7637, retrieved 2026-08-17, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF