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Contents

README

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TLV2372

Texas Instruments · Operational amplifier · SOIC-8

Dual op-amp with rail-to-rail input and output on a single 2.7 to 5.5 V supply, so both amplifiers swing to within millivolts of the rails. A 3 MHz gain-bandwidth and low supply current suit it to sensor buffering, active filters, and general single-supply analog on a 3.3 or 5 V board. Two amplifiers share the SOIC-8 with the standard dual pinout. A low-cost, general-purpose dual for battery and portable designs.

Pinout

Pin Name Type Function
1 1OUT output Channel 1 op-amp output. Rail-to-rail output stage swings within tens of mV of VDD and GND under light load.
2 1IN- input Channel 1 inverting (negative) input. CMOS high-impedance input, IB ≈ 1 pA typ; common-mode range extends rail-to-rail.
3 1IN+ input Channel 1 noninverting (positive) input. CMOS high-impedance input, IB ≈ 1 pA typ; common-mode range extends rail-to-rail.
4 GND power_in Negative supply / ground reference (V-). Tie to the more-negative rail; for single-supply operation connect to 0 V.
5 2IN+ input Channel 2 noninverting (positive) input. CMOS high-impedance input, IB ≈ 1 pA typ; common-mode range extends rail-to-rail.
6 2IN- input Channel 2 inverting (negative) input. CMOS high-impedance input, IB ≈ 1 pA typ; common-mode range extends rail-to-rail.
7 2OUT output Channel 2 op-amp output. Rail-to-rail output stage swings within tens of mV of VDD and GND under light load.
8 VDD power_in Positive supply. Operates from 2.7 V to 16 V single supply (or split ±1.35 V to ±8 V). Bypass with 0.1 µF close to the pin.

Key specifications

Parameter Value
Type Dual rail-to-rail op-amp
Gain-bandwidth 3 MHz
Supply 2.7-5.5 V (single)
Output Rail-to-rail
Slew rate 2.4 V/us
Input offset 1.5 mV (typ)
Package SOIC-8

Ordering variants

Same part, different packaging or reel option.

  • TLV2372ID (SOIC-8)
  • TLV2372IDR (SOIC-8, tape & reel)
  • TLV2372IP (PDIP-8)

CAD (KiCad official)

  • Symbol: Amplifier_Operational:TLV2372 (KiCad official)
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: tlv2372-etched.step / tlv2372-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tlv2372.step / tlv2372.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (67 pp, sha256 297d1d74e44836c4, retrieved 2026-08-17, tier: manufacturer)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF