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docs tlv2316idr: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray 1mo ago
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package.json Publish 0.2.0 · Ray 2mo ago
page.json tlv2316idr: white body in tscircuit (pre-1.8 etch structure under an assembly instance); Ray 2026-10-19: black IC body… · Ray 13d ago
README.md tlv2316idr: laser-etched CAD + chip hero (factory 2.0.0 backfill) · Ray 1mo ago
tlv2316idr-etched.fit.json tlv2316idr: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray 1mo ago
tlv2316idr-etched.glb tlv2316idr: white body in tscircuit (pre-1.8 etch structure under an assembly instance); Ray 2026-10-19: black IC body… · Ray 13d ago
tlv2316idr-etched.step tlv2316idr: white body in tscircuit (pre-1.8 etch structure under an assembly instance); Ray 2026-10-19: black IC body… · Ray 13d ago
tlv2316idr.glb Publish 0.1.0 · Ray 2mo ago
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tlv2316idr.step Publish 0.1.0 · Ray 2mo ago

TLV2316IDR

Texas Instruments · Operational Amplifier · SOIC-8

TLV2316IDR from Texas Instruments, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 OUT A output Output of channel A op-amp. Rail-to-rail output swing up to the V+/V- supplies.
2 -IN A input Inverting input of channel A op-amp. Rail-to-rail input range; ±10 pA typical input bias current.
3 +IN A input Noninverting input of channel A op-amp. Rail-to-rail input range; ±10 pA typical input bias current.
4 V- power_in Negative (lowest) supply rail or ground for single-supply operation. Total supply (V+) - (V-) range 1.8 V to 5.5 V.
5 +IN B input Noninverting input of channel B op-amp. Rail-to-rail input range; ±10 pA typical input bias current.
6 -IN B input Inverting input of channel B op-amp. Rail-to-rail input range; ±10 pA typical input bias current.
7 OUT B output Output of channel B op-amp. Rail-to-rail output swing up to the V+/V- supplies.
8 V+ power_in Positive (highest) supply rail. Operating range 1.8 V to 5.5 V total supply relative to V-.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package SOIC-8
Category Op-amp/Cmp
Pins 8

Ordering variants

Same part, different packaging or reel option.

  • TLV2316IDRD
  • TLV2316IDR
  • TLV2316IDRDGK

CAD (KiCad official)

  • Symbol: TLV2316IDR
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: tlv2316idr-etched.step / tlv2316idr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tlv2316idr.step / tlv2316idr.glb are the bare package body.

3D model downloads

Two STEP files. Same geometry, different body top:

File Size Use it when
tlv2316idr.step 122 KB You want the bare part, or you mark your own boards.
tlv2316idr-etched.step 1.9 MB You want the part with TLV2316IDR already on it.

The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 476 faces against 147 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (43 pp, sha256 b5035b7c544b9599, retrieved 2026-08-17, tier: manufacturer)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF