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TLV0832IDR

Public Made by Adom

by adom

Texas Instruments Analog To Digital Converters (ADC), SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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TLV0832IDR

Texas Instruments · Analog To Digital Converters (ADC) · SOIC-8

TLV0832IDR from Texas Instruments, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 CS input Chip select: setting CS low starts a conversion and it must stay low for the complete conversion process; CS high clears all internal registers and returns DO to high impedance.
2 CH0 input Multiplexed analog input channel 0 (IN+ in differential mode), with the common-mode input voltage range specified as -0.05 V to VCC+0.05 V.
3 CH1 input Multiplexed analog input channel 1 (IN- in differential mode), with the common-mode input voltage range specified as -0.05 V to VCC+0.05 V.
4 GND power_in Network ground terminal, the reference for all voltages on the device.
5 DI input Serial data input that shifts in the start bit and multiplexer assignment word on each low-to-high clock transition; it is only examined during the addressing interval and is disabled for the duration of the conversion.
6 DO tri_state Serial data output that delivers MSB-first conversion data, followed by LSB-first data on the TLV0832, and is in the high-impedance state when CS is high; it may be tied to DI for a single bidirectional wire.
7 CLK input Clock input from the processor, operating at 250 kHz maximum at VCC = 2.7 V and 10 kHz to 600 kHz at VCC = 3.3 V, with a clock duty cycle of 40% to 60%.
8 VCC/REF power_in Positive supply from 2.7 V to 3.6 V that also serves as the reference input; REF is typically set equal to VCC, which is done internally on the TLV0832.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package SOIC-8
Category Data Acquisition
Pins 8

CAD (KiCad official)

  • Symbol: TLV0832IDR
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: tlv0832idr-etched.step / tlv0832idr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tlv0832idr.step / tlv0832idr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (21 pp, sha256 f48a6d70bb8270a4, retrieved 2026-10-12, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF