main
History Download
Ray Publish 0.1.0 c615737 7d ago

TLP2962F

TOSHIBA · Transistor, Photovoltaic Output Optoisolators · SO-8

TLP2962F from TOSHIBA, in a SO-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 N.C. unconnected No internal connection; on the input side, shorted with pins 2-4 only for isolation testing.
2 Anode passive LED anode; input forward current IF recommended 6.3 to 15 mA on-state, absolute maximum 20 mA.
3 Cathode passive LED cathode; input off-state voltage VF(OFF) must be 0.8 V max to keep the LED off.
4 N.C. unconnected No internal connection on the input side of the package.
5 GND power_in Detector ground; connect the 0.1 µF bypass capacitor between pin 8 and this pin, within 1 cm.
6 VO (Output) output Open-collector inverting output, sinking 13 mA with VOL 0.6 V max, with output voltage rated up to 5.5 V in test conditions.
7 N.C. unconnected No internal connection on the output side of the package.
8 VCC power_in Supply voltage 2.7 to 5.5 V, with a 0.1 µF ceramic bypass capacitor to pin 5 placed within 1 cm.

Key specifications

Parameter Value
Manufacturer TOSHIBA
Package SO-8
Category Optoisolators
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input on-state current IF(ON) 6.3 15 mA Rise and fall times of input on-current less than 0.5 µs (Note 1) 3
Input off-state voltage VF(OFF) 0.8 V Note 2: denotes operating range, not recommended condition 3
Supply voltage VCC 2.7 5.5 V Note 2: denotes operating range, not recommended condition 3
Operating temperature Topr -40 125 °C 3
Input forward current IF 20 mA 3
Input forward current (pulsed) IFP 40 mA Pulse width ≤ 1 ms, duty = 50% (Note 1) 3
Input power dissipation PD 40 mW 3
Output power dissipation PO 85 mW 3
Operating temperature Topr -40 125 °C 3
Storage temperature Tstg -55 150 °C 3
Lead soldering temperature Tsol 260 °C 10 s 3
Isolation voltage BVS 5000 Vrms AC, 60 s, R.H. ≤ 60 % 3
Input forward voltage VF 1.45 1.55 1.7 V IF = 10 mA, Ta = 25 °C 4
Input reverse current IR 10 µA VR = 5 V, Ta = 25 °C 4
High-level output current IOH 50 µA VF = 0.8 V, VO = 5.5 V, VCC = 5.5 V 4
High-level output current (Ta = 25 °C) IOH 10 µA VF = 0.8 V, VO = 5.5 V, VCC = 5.5 V, Ta = 25 °C 4
Low-level output voltage VOL 0.23 0.6 V IF = 5 mA, IO = 13 mA (Sinking) 4
High-level supply current ICCH 1.6 4 mA IF = 0 mA 4
Low-level supply current ICCL 1.8 4 mA IF = 10 mA 4
Threshold input current (H/L) (Ta = 25 °C) IFHL 1.3 2.8 mA IO = 13 mA (Sinking), VO < 0.6 V, Ta = 25 °C 4
Threshold input current (H/L) IFHL 5 mA IO = 13 mA (Sinking), VO < 0.6 V 4
Common-mode transient immunity at output high CMH 20 kV/µs VCM = 1000 Vp-p, IF = 0 mA, VCC = 3.3 V / 5 V, Ta = 25 °C 5
Common-mode transient immunity at output low CML 20 kV/µs VCM = 1000 Vp-p, IF = 10 mA, VCC = 3.3 V / 5 V, Ta = 25 °C 5
Propagation delay time (H/L) tpHL 35 75 ns IF = 0→7.5 mA, RL = 350 Ω, CL = 15 pF 5
Propagation delay time (L/H) tpLH 75 ns IF = 7.5→0 mA, RL = 350 Ω, CL = 15 pF 5
Pulse width distortion /tpHL - tpLH/ 35 ns IF = 7.5 mA, RL = 350 Ω, CL = 15 pF 5
Propagation delay skew (device to device) tpsk 40 ns 5
Isolation voltage (AC, 60 s) BVS 5000 Vrms AC, 60 s 4
Isolation voltage (AC, 1 s in oil) BVS 10000 Vrms AC, 1 s in oil 4
Isolation voltage (DC, 60 s in oil) BVS 10000 Vdc DC, 60 s in oil 4
Input forward voltage temperature coefficient ΔVF/ΔTa -2 mV/°C IF = 10 mA 4
Input capacitance Ct 60 pF V = 0 V, f = 1 MHz, Ta = 25 °C 4
Total capacitance (input to output) CS 1 pF VS = 0 V, f = 1 MHz 4

CAD (KiCad official)

  • Symbol: TLP2962F
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SO-8 (KiCad packages3D, STEP)
  • 3D model files: tlp2962f-etched.step / tlp2962f-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tlp2962f.step / tlp2962f.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: TOSHIBA datasheet (13 pp, sha256 f3cafc56b6841374, retrieved 2026-10-21, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF