# TLP250H

**TOSHIBA** · Logic Output Optoisolators · DIP-8

TLP250H from TOSHIBA, in a DIP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | N.C. | unconnected | Not internally connected; the datasheet lists this pin as N.C. in the pin assignment. |
| 2 | Anode | input | LED anode input; the LED is driven with an input on-state current of 6.5 to 10 mA and a threshold input current of 5 mA (max). |
| 3 | Cathode | input | LED cathode connection; the absolute maximum input forward current is 20 mA. |
| 4 | N.C. | unconnected | Not internally connected; the datasheet lists this pin as N.C. in the pin assignment. |
| 5 | GND | power_in | Detector ground reference; a 0.1 µF ceramic bypass capacitor must be connected between pin 8 and pin 5, placed within 1 cm of the pins. |
| 6 | VO | output | Totem-pole gate drive output that can both sink and source current, with a peak output current of ±2.5 A (max). |
| 7 | N.C. | unconnected | Not internally connected; the datasheet lists this pin as N.C. in the pin assignment. |
| 8 | VCC | power_in | Detector supply voltage with an operating range of 10 to 30 V, and the rising VCC slope must be 3.0 V/µs or less. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | TOSHIBA |
| Package | DIP-8 |
| Category | Optoisolators |
| Pins | 8 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Input forward current | IF |  |  | 20 | mA |  | 4 |
| Input forward current derating | ΔIF/ΔTa |  |  | -0.54 | mA/°C | Ta ≥ 110 °C | 4 |
| Peak transient input forward current | IFPT |  |  | 1 | A | PW ≤ 1 µs, 300 pps (Note 1) | 4 |
| Input power dissipation | PD |  |  | 40 | mW |  | 4 |
| Input power dissipation derating | ΔPD/ΔTa |  |  | -1 | mW/°C | Ta ≥ 110 °C | 4 |
| Peak high-level output current | IOPH | -2.5 |  |  | A | Exponential, PW ≤ 0.2 µs, f ≤ 15 kHz, VCC = 20 V, Ta = -40 to 125 °C (Note 2) | 4 |
| Peak low-level output current | IOPL |  |  | 2.5 | A | Exponential, PW ≤ 0.2 µs, f ≤ 15 kHz, VCC = 20 V, Ta = -40 to 125 °C (Note 2) | 4 |
| Output voltage | VO |  |  | 35 | V |  | 4 |
| Supply voltage | VCC |  |  | 35 | V |  | 4 |
| Output power dissipation | PO |  |  | 260 | mW |  | 4 |
| Output power dissipation derating | ΔPO/ΔTa |  |  | -2 | mW/°C | Ta ≥ 110 °C | 4 |
| Operating temperature | Topr | -40 |  | 125 | °C |  | 4 |
| Storage temperature | Tstg | -55 |  | 150 | °C |  | 4 |
| Lead soldering temperature | Tsol |  |  | 260 | °C | 10 s | 4 |
| Isolation voltage (absolute maximum) | BVS |  |  | 3750 | Vrms | AC, 60 s, R.H. ≤ 60 % | 4 |
| Input on-state current | IF(ON) | 6.5 |  | 10 | mA | Rise and fall times of input on-current < 0.5 µs (Note 1) | 5 |
| Input off-state voltage | VF(OFF) |  |  | 0.8 | V |  | 5 |
| Supply voltage | VCC | 10 |  | 30 | V |  | 5 |
| Peak high-level output current | IOPH | -2 |  |  | A | Exponential waveform, Ta = 125 °C, VCC = 20 V (Note 3) | 5 |
| Peak low-level output current | IOPL |  |  | 2 | A | Exponential waveform, Ta = 125 °C, VCC = 20 V (Note 3) | 5 |
| Operating frequency | f |  |  | 250 | kHz |  | 5 |
| Input forward voltage | VF | 1.4 | 1.57 | 1.8 | V | IF = 10 mA, Ta = 25 °C | 6 |
| Input reverse current | IR |  |  | 10 | µA | VR = 5 V, Ta = 25 °C | 6 |
| Total capacitance (input to output) | CS |  | 0.35 |  | pF | VS = 0 V, f = 1 MHz | 6 |
| Isolation voltage | BVS | 3750 |  |  | Vrms | AC, 60 s | 6 |
| Propagation delay time (L/H) | tpLH | 100 | 50 | 500 | ns | IF = 0 → 10 mA, VCC = 30 V, Rg = 20 Ω, Cg = 10 nF | 7 |
| Propagation delay time (H/L) | tpHL | 100 | 50 | 500 | ns | IF = 10 → 0 mA, VCC = 30 V, Rg = 20 Ω, Cg = 10 nF | 7 |
| Pulse width distortion | /tpHL-tpLH/ |  |  | 50 | ns | IF = 0 ↔ 10 mA, VCC = 30 V, Rg = 20 Ω, Cg = 10 nF | 7 |
| Propagation delay skew (device to device) | tpsk |  |  | 150 | ns | Worst case between units at same conditions (Note 4) | 7 |
| Common-mode transient immunity at output high | CMH | -40 |  | 40 | kV/µs | VCM = 1000 Vp-p, IF = 10 mA, VCC = 30 V, Ta = 25 °C, VO(min) = 26 V | 7 |
| Common-mode transient immunity at output low | CML | -40 |  | 40 | kV/µs | VCM = 1000 Vp-p, IF = 0 mA, VCC = 30 V, Ta = 25 °C, VO(max) = 1 V | 7 |
| Input forward voltage temperature coefficient | ΔVF/ΔTa |  | -1.8 |  | mV/°C | IF = 10 mA | 6 |
| Input capacitance | Ct |  | 45 |  | pF | V = 0 V, f = 1 MHz, Ta = 25 °C | 6 |
| Peak high-level output current (VCC = 30 V) | IOPH |  | -2.2 |  | A | IF = 5 mA, VCC = 30 V, V8-6 = -3.5 V | 6 |
| Peak high-level output current (VCC = 15 V) | IOPH |  | -3.4 |  | A | IF = 5 mA, VCC = 15 V, V8-6 = -7.0 V | 6 |
| Peak low-level output current (VCC = 30 V) | IOPL |  | 2.4 |  | A | IF = 0 mA, VCC = 30 V, V6-5 = 2.5 V | 6 |
| Peak low-level output current (VCC = 15 V) | IOPL |  | 3.5 |  | A | IF = 0 mA, VCC = 15 V, V6-5 = 7.0 V | 6 |

## CAD (KiCad official)

- Symbol: `TLP250H`
- Footprint: `Package_DIP:DIP-8_W7.62mm`
- 3D model: DIP-8 (KiCad packages3D, STEP)
- 3D model files: `tlp250h-etched.step` / `tlp250h-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `tlp250h.step` / `tlp250h.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [TOSHIBA datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588893758121656320) (16 pp, sha256 `cf7f636a6e2e4ea4`, retrieved 2026-10-18, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/tlp250h-datasheet.pdf)