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TLP2398

TOSHIBA · Transistor, Photovoltaic Output Optoisolators · SOIC-5

TLP2398 from TOSHIBA, in a SOIC-5. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Anode/Cathode passive Input LED terminal; the two LEDs are connected in reverse parallel so the input can sink or source, with input forward current rated ±20 mA absolute maximum.
3 Cathode/Anode passive Input LED terminal, reverse-parallel with pin 1, so either polarity drives the input, with input forward current rated ±20 mA absolute maximum.
4 GND power_in Ground reference for the detector; a 0.1 µF bypass capacitor must be connected between pin 6 and pin 4.
5 VO output Totem-pole logic inverter output with current sourcing and sinking capability, with output voltage rated -0.5 to 20 V absolute maximum.
6 VCC power_in Supply pin with a 3 to 20 V operating range (absolute maximum -0.5 to 20 V), requiring a 0.1 µF bypass capacitor to pin 4.

Key specifications

Parameter Value
Manufacturer TOSHIBA
Package SOIC-5
Category Optoisolators
Pins 5

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage VCC 3 20 V 3
Operating temperature Topr -40 125 °C 3
Input on-state current pin1→3 IF(ON) pin1→3 10 mA Rise and fall times of input on-current less than 0.5 µs (Note 1) 3
Input on-state current pin3→1 IF(ON) pin3→1 -100 -3 mA Rise and fall times of input on-current less than 0.5 µs (Note 1) 3
Input off-state voltage pin1→3 VF(OFF) pin1→3 0.8 V 3
Input off-state voltage pin3→1 VF(OFF) pin3→1 -0.83 V 3
Input forward current IF -20 20 mA 3
Peak transient input forward current IFPT -1 1 A Pulse width ≤ 1 µs, 300 pps (Note 1) 3
Input power dissipation PD 40 mW Ta ≤ 25 °C 3
Output current IO -15 25 mA 3
Output current (second rating) IO -5 5 mA 3
Output voltage VO -0.5 20 V 3
Supply voltage VCC -0.5 20 V 3
Output power dissipation PO 100 mW 3
Operating temperature Topr -40 125 °C 3
Storage temperature Tstg -55 125 °C 3
Lead soldering temperature Tsol 260 °C 10 s 3
Input forward voltage VF 1.33 1.5 1.63 V IF = 3 mA, Ta = 25 °C 4
Low-level output voltage VOL 0.11 0.6 V IO = 3.5 mA, IF = 5 mA 4
High-level output voltage (VCC = 3 V) VOH 1.78 2.1 V VCC = 3 V, IO = -2.6 mA, VF = 0.8 V 4
High-level output voltage (VCC = 20 V) VOH 17.4 19.1 V VCC = 20 V, IO = -2.6 mA, VF = 0.8 V 4
Low-level supply current (VCC = 3.6 V) ICCL 1.4 3 mA VCC = 3.6 V, IF = 5 mA 4
Low-level supply current (VCC = 20 V) ICCL 1.5 3 mA VCC = 20 V, IF = 5 mA 4
High-level supply current (VCC = 3.6 V) ICCH 1.9 3 mA VCC = 3.6 V, VF = 0 V 4
High-level supply current (VCC = 20 V) ICCH 2 3 mA VCC = 20 V, VF = 0 V 4
Low-level short-circuit output current (VCC = 3.6 V) IOSL 15 100 mA VCC = VO = 3.6 V, IF = 5 mA 4
Low-level short-circuit output current (VCC = 20 V) IOSL 20 130 mA VCC = VO = 20 V, IF = 5 mA 4
High-level short-circuit output current (VCC = 3.6 V) IOSH -14 -5 mA VCC = 3.6 V, VF = 0 V, VO = GND 4
High-level short-circuit output current (VCC = 20 V) IOSH -24 -10 mA VCC = 20 V, VF = 0 V, VO = GND 4
Threshold input current (H/L) IFHL 0.7 2.3 mA IO = 3.5 mA, VO < 0.4 V 4
Threshold input voltage (L/H) VFLH 0.8 V IO = -2.6 mA, VO > 2.4 V 4
Propagation delay time (H/L) tpHL 105 250 ns IF = 0 → 3 mA 5
Propagation delay time (L/H) tpLH 95 250 ns IF = 3 → 0 mA 5
Pulse width distortion /tpHL-tpLH/ 10 80 ns IF = 3 mA 5
Propagation delay skew (device to device) tpsk -130 15 130 ns 5
Rise time tr 12 75 ns IF = 3 → 0 mA, VCC = 5 V 5
Fall time tf 75 ns IF = 0 → 3 mA, VCC = 5 V 5
Common-mode transient immunity at output high CMH 20 kV/µs VCM = 1000 Vp-p, IF = 0 mA, VCC = 20 V, Ta = 25 °C 5
Common-mode transient immunity at output low CML 20 kV/µs VCM = 1000 Vp-p, IF = 5 mA, VCC = 20 V, Ta = 25 °C 5
Isolation voltage BVS 3750 Vrms AC, 60 s 4
Input forward voltage temperature coefficient ∆VF/∆Ta -2 mV/°C IF = 3 mA 4
Input capacitance Ct 90 pF V = 0 V, f = 1 MHz 4

CAD (KiCad official)

  • Symbol: TLP2398
  • Footprint: Package_SO:SOIC-5-6_4.4x3.6mm_P1.27mm
  • 3D model: SOIC-5 (KiCad packages3D, STEP)
  • 3D model files: tlp2398-etched.step / tlp2398-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tlp2398.step / tlp2398.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: TOSHIBA datasheet (18 pp, sha256 0ad9a30099ed8149, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF