component
TLP2363
Public Made by Adomby adom
TOSHIBA Transistor, Photovoltaic Output Optoisolators, SOIC-5. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownTLP2363
TOSHIBA · Transistor, Photovoltaic Output Optoisolators · SOIC-5
TLP2363 from TOSHIBA, in a SOIC-5. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Anode | passive | LED anode input; the LED turns on with forward current (IF 5 mA max threshold, 25 mA max continuous) and the output goes low. |
| 3 | Cathode | passive | LED cathode input; pins 1 and 3 are treated as a two-terminal input for isolation (3750 Vrms). |
| 4 | GND | power_in | Ground for the detector side; a 0.1 µF ceramic bypass capacitor must be connected between pin 6 and pin 4, placed within 1 cm of the pins. |
| 5 | VO | output | Open-collector inverter-logic output (low when LED on) that sinks 13 mA at VOL 0.6 V max and tolerates -0.5 to 6 V. |
| 6 | VCC | power_in | Supply voltage pin, 2.7 to 5.5 V recommended operating range (absolute maximum -0.5 to 6 V), with a 0.1 µF bypass capacitor to pin 4. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | TOSHIBA |
| Package | SOIC-5 |
| Category | Optoisolators |
| Pins | 5 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Input forward voltage | VF | 1.35 | 1.5 | 1.65 | V | IF = 2.6 mA, Ta = 25 °C | 5 |
| Input reverse current | IR | 10 | µA | VR = 5 V, Ta = 25 °C | 5 | ||
| High-level output current | IOH | 50 | µA | VF = 0.8 V, VO = 5.5 V, VCC = 5.5 V | 5 | ||
| High-level output current (25 °C) | IOH | 10 | µA | VF = 0.8 V, VO = 5.5 V, VCC = 5.5 V, Ta = 25 °C | 5 | ||
| Low-level output voltage | VOL | 0.33 | 0.6 | V | IF = 5 mA, IO = 13 mA (Sinking) | 5 | |
| Low-level supply current | ICCL | 1.8 | 4 | mA | IF = 5 mA | 5 | |
| High-level supply current | ICCH | 1.6 | 4 | mA | IF = 0 mA | 5 | |
| Threshold input current (H/L) | IFHL | 1.25 | 5 | mA | IO = 13 mA (Sinking), VO < 0.6 V | 5 | |
| Threshold input current (H/L) | IFHL | 0.3 | 0.9 | 2.4 | mA | VCC = 3.3 V, RL = 1 kΩ, VO < 0.6 V | 5 |
| Input forward voltage temperature coefficient | ΔVF/ΔTa | -1.5 | mV/°C | IF = 2.6 mA | 5 | ||
| Input capacitance | Ct | 17 | pF | V = 0 V, f = 1 MHz, Ta = 25 °C | 5 | ||
| Total capacitance (input to output) | CS | 0.8 | pF | VS = 0 V, f = 1 MHz | 5 | ||
| Isolation voltage | BVS | 3750 | Vrms | AC, 60 s | 5 | ||
| Propagation delay time (H/L) | tpHL | 44 | 80 | ns | IF = 0 → 7.5 mA, RL = 350 Ω | 6 | |
| Propagation delay time (L/H) | tpLH | 41 | 80 | ns | IF = 7.5 → 0 mA, RL = 350 Ω | 6 | |
| Pulse width distortion | /tpHL - tpLH/ | 3.2 | 35 | ns | IF = 7.5 mA, RL = 350 Ω | 6 | |
| Propagation delay skew (device to device) | tpsk | -40 | 40 | ns | IF = 7.5 mA, RL = 350 Ω | 6 | |
| Fall time | tf | 7 | ns | IF = 0 → 7.5 mA, RL = 350 Ω | 6 | ||
| Rise time | tr | 23 | ns | IF = 7.5 → 0 mA, RL = 350 Ω | 6 | ||
| High-level common-mode transient immunity | CMH | -20 | -40 | kV/µs | VCM = 1000 Vp-p, IF = 0 mA, VCC = 3.3 V / 5 V, Ta = 25 °C | 6 | |
| Low-level common-mode transient immunity | CML | 20 | 40 | kV/µs | VCM = 1000 Vp-p, IF = 7.5 mA, VCC = 3.3 V / 5 V, Ta = 25 °C | 6 | |
| Input forward current | IF | 25 | mA | Ta = 25 °C | 3 | ||
| Input forward current (pulsed) | IFP | 50 | mA | PW ≤ 1 ms, duty = 50 % | 3 | ||
| Peak transient input forward current | IFPT | 1 | A | PW ≤ 1 µs, 300 pps | 3 | ||
| Input power dissipation | PD | 40 | mW | 3 | |||
| Input reverse voltage | VR | 5 | V | 3 | |||
| Output current | IO | 25 | mA | 3 | |||
| Output voltage | VO | -0.5 | 6 | V | 3 | ||
| Supply voltage | VCC | -0.5 | 6 | V | 3 | ||
| Output power dissipation | PO | 60 | mW | 3 | |||
| Operating temperature | Topr | -40 | 105 | °C | 3 | ||
| Storage temperature | Tstg | -55 | 125 | °C | 3 | ||
| Lead soldering temperature | Tsol | 260 | °C | 10 s | 3 | ||
| Isolation voltage | BVS | 3750 | Vrms | AC, 60 s, R.H. ≤ 60 % | 3 | ||
| Supply voltage | VCC | 2.7 | 5.5 | V | typ. 3.3/5 | 4 | |
| Operating temperature | Topr | -40 | 105 | °C | 4 |
CAD (KiCad official)
- Symbol:
TLP2363 - Footprint:
Package_SO:SOIC-5-6_4.4x3.6mm_P1.27mm - 3D model: SOIC-5 (KiCad packages3D, STEP)
- 3D model files:
tlp2363-etched.step/tlp2363-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);tlp2363.step/tlp2363.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: TOSHIBA datasheet (18 pp, sha256
92a52a88bdd908ac, retrieved 2026-10-22, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).