component
TLP2105
Public Made by Adomby adom
TOSHIBA Logic Output Optoisolators, SO-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownTLP2105
TOSHIBA · Logic Output Optoisolators · SO-8
TLP2105 from TOSHIBA, in a SO-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Anode 1 | input | Anode of input LED1; the LED is driven with a 20 mA absolute maximum input forward current per channel. |
| 2 | Cathode 1 | input | Cathode of input LED1, which turns the channel 1 detector on or off as the input current crosses the 1.6 mA maximum threshold input current. |
| 3 | Cathode 2 | input | Cathode of input LED2, paired with pin 4 as the second isolated input channel. |
| 4 | Anode 2 | input | Anode of input LED2; the LED is driven with a 20 mA absolute maximum input forward current per channel. |
| 5 | GND | power_in | Detector ground reference; a 0.1 µF bypass capacitor must be connected between pin 8 and pin 5, placed within 1 cm of each pin. |
| 6 | VO2 (Output 2) | output | Totem-pole buffer output of detector channel 2 with current sourcing and sinking capability. |
| 7 | VO1 (Output 1) | output | Totem-pole buffer output of detector channel 1 with current sourcing and sinking capability. |
| 8 | VCC | power_in | Detector supply pin, specified for 4.5 to 20 V with absolute maximum -0.5 to 20 V, requiring a 0.1 µF bypass capacitor to pin 5. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | TOSHIBA |
| Package | SO-8 |
| Category | Optoisolators |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply voltage | VCC | 4.5 | 20 | V | 3 | ||
| Operating temperature | Topr | -40 | 100 | °C | 3 | ||
| Input on-state current | IF(ON) | 10 | mA | Each channel (Note 1) | 3 | ||
| Input off-state voltage | VF(OFF) | 0.8 | V | Each channel (Note 1) | 3 | ||
| Input forward current | IF | 20 | mA | Each channel (Note 1) | 3 | ||
| Input forward current derating | ∆IF/∆Ta | -0.48 | mA/°C | Ta ≥ 75 °C (as printed bracket; see review) | 3 | ||
| Peak transient input forward current | IFPT | 1 | A | Pw ≤ 1 µs, 300 pps (Note 2) | 3 | ||
| Input reverse voltage | VR | 5 | V | Each channel (Note 1) | 3 | ||
| Input power dissipation | PD | 40 | mW | Ta ≤ 25 °C (as printed bracket; see review) | 3 | ||
| Input power dissipation derating | ∆PD/∆Ta | -0.8 | mW/°C | Ta ≥ 25 °C (as printed bracket; see review) | 3 | ||
| Output current | IO | -15 | 25 | mA | Each channel (Note 1) | 3 | |
| Output current (second IO row) | IO | -5 | 5 | mA | 3 | ||
| Output voltage | VO | -0.5 | 20 | V | Each channel (Note 1) | 3 | |
| Supply voltage | VCC | -0.5 | 20 | V | 3 | ||
| Output power dissipation | PO | 75 | mW | Each channel (Note 1) | 3 | ||
| Output power dissipation derating | ∆PO/∆Ta | -0.75 | mW/°C | Each channel (Note 1) | 3 | ||
| Operating temperature | Topr | -40 | 100 | °C | 3 | ||
| Storage temperature | Tstg | -55 | 125 | °C | 3 | ||
| Lead soldering temperature | Tsol | 260 | °C | 10 s | 3 | ||
| Input forward voltage | VF | 1.3 | 1.65 | 1.75 | V | IF = 10 mA, Ta = 25 °C | 4 |
| Input reverse current | IR | 10 | µA | VR = 5 V, Ta = 25 °C | 4 | ||
| High-level output voltage | VOH | 2.7 | 4 | V | IOH = -2.6 mA, IF = 5 mA, VCC = 4.5 V (see review) | 4 | |
| Threshold input current (L/H) | IFLH | 0.4 | 1.6 | mA | VCC = 5 V | 4 | |
| Threshold input voltage (H/L) | VFHL | 0.8 | V | 4 | |||
| Isolation voltage | BVS | 2500 | Vrms | AC, 60 s | 4 | ||
| Propagation delay time (L/H) | tpLH | 150 | 250 | ns | IF = 0 → 3 mA | 5 | |
| Propagation delay time (H/L) | tpHL | 150 | 250 | ns | IF = 3 → 0 mA | 5 | |
| High-level common-mode transient immunity | CMH | 10 | kV/µs | VCM = 1000 Vp-p, IF = 5 mA, VCC = 20 V, Ta = 25 °C | 5 | ||
| Low-level common-mode transient immunity | CML | 10 | kV/µs | VCM = 1000 Vp-p, IF = 0 mA, VCC = 20 V, Ta = 25 °C | 5 |
CAD (KiCad official)
- Symbol:
TLP2105 - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SO-8 (KiCad packages3D, STEP)
- 3D model files:
tlp2105-etched.step/tlp2105-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);tlp2105.step/tlp2105.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: TOSHIBA datasheet (15 pp, sha256
b6b937f4a66e0f13, retrieved 2026-10-16, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).