component
TLE4284DV
Public Made by Adomby adom
Infineon Technologies Voltage Regulators - Linear, Low Drop Out (LDO) Regulators, TO-252. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
| Name | Last updated |
|---|---|
| docs | 23d ago |
| viewers | 23d ago |
| package.json | 23d ago |
| page.json | 23d ago |
| README.md | 23d ago |
| tle4284dv-etched.glb | 23d ago |
| tle4284dv-etched.step | 23d ago |
| tle4284dv-hero.glb | 23d ago |
| tle4284dv-hero.overlay.json | 23d ago |
| tle4284dv.glb | 23d ago |
| tle4284dv.kicad_mod | 23d ago |
| tle4284dv.kicad_sym | 23d ago |
| tle4284dv.lbr | 23d ago |
| tle4284dv.step | 23d ago |
TLE4284DV
Infineon Technologies · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · TO-252
TLE4284DV from Infineon Technologies, in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | ADJ | input | Adjust pin; the output voltage is set by an external voltage divider between Q, ADJ and GND, with the internal reference typically 1.25 V (VREF = VQ - VADJ). |
| 2 | Q | power_out | Output pin, also connected to the heatsink tab; connect to GND via an output capacitor CQ ≥ 10 µF with ESR ≤ 10 Ω. |
| 3 | I | power_in | Input pin; the input voltage must be in the range VQnom + VDR < VI < 40 V, with absolute maximum rating of -0.3 V to 40 V. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Infineon Technologies |
| Package | TO-252 |
| Category | Power Management (PMIC) |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reference voltage | VREF | 1.2 | 1.25 | 1.3 | V | 6 | |
| Line regulation | ∆VQ | 0.5 | 1.5 | % | 3 V ≤ (VI, VQ) ≤ 40 V | 6 | |
| Load regulation | ∆VQ | 0.2 | 0.4 | % | 10 mA ≤ IQ ≤ 800 mA; VI = 3.0 V; VQ = VREF | 6 | |
| Load regulation | ∆VQ | 0.25 | 0.5 | % | 10 mA ≤ IQ ≤ 1.0 A; VI = 3.0 V; VQ = VREF | 6 | |
| Dropout voltage | VDR | 1 | 1.2 | V | IQ = 100 mA | 6 | |
| Dropout voltage | VDR | 1.05 | 1.3 | V | IQ = 500 mA | 6 | |
| Dropout voltage | VDR | 1.1 | 1.35 | V | IQ = 800 mA | 6 | |
| Dropout voltage | VDR | 1.3 | 1.4 | V | IQ = 1.0 A | 6 | |
| Current consumption | Iq | 100 | 120 | µA | IQ = 10 mA | 6 | |
| Adjust current | IADJ | 75 | 120 | µA | IQ = 10 mA | 6 | |
| Adjust current change | ∆IADJ | 2 | 5 | µA | IQ = 10 mA; 3 V ≤ (VI, VQ) ≤ 40 V | 6 | |
| Temperature stability | 0.6 | % | 6 | ||||
| Minimum load current | IQ | 1 | 5 | mA | VI < 40 V; VQ = VREF | 6 | |
| Current limit | IQmax | 1000 | 2200 | mA | 1.4V < VI - VQ < 18V; VQ = Vnom -100 mV | 6 | |
| Current limit | IQmax | 50 | 200 | mA | VI = 40 V; VQ = Vnom -100 mV; Tj = 25 °C | 6 | |
| RMS output noise | 30 | ppm | ppm of VQ; Tj = 25 °C; 10 Hz ≤ f ≤ 10 kHz | 6 | |||
| Power supply ripple rejection | PSRR | 65 | dB | VQ = 10 V, fr = 120 Hz, Vr = 0.5 VPP, CADJ = 0 µF | 7 | ||
| Input - output voltage difference | VI - VQ | -0.3 | 40 | V | 4 | ||
| Input voltage | VI | -0.3 | 40 | V | 4 | ||
| Adjust voltage (variable version only) | VADJ | -0.3 | 40 | V | 4 | ||
| Storage temperature | Tstg | -50 | 150 | °C | 4 | ||
| Junction temperature | Tj | -40 | 150 | °C | 4 | ||
| ESD susceptibility Human Body Model (HBM) | 4 | kV | 4 | ||||
| ESD susceptibility Charged Device Model (CDM) | 1 | kV | 4 | ||||
| Input voltage (operating range) | VI | 40 | V | 5 | |||
| Junction temperature (operating range) | Tj | -40 | 150 | °C | 5 | ||
| Output capacitor | CQ | 10 | µF | 21 | |||
| Output capacitor ESR | ESR | 0.1 | 10 | Ω | 21 | ||
| Output capacitor when CADJ is placed | CQ | 22 | µF | CADJ placed at the adjust pin | 21 | ||
| Junction-ambient thermal resistance (footprint only) | Rthja | 144 | K/W | PG-TO252-3-11 footprint only | 5 | ||
| Junction-ambient thermal resistance (300 mm² heat sink area) | Rthja | 78 | K/W | PG-TO252-3-11, 300 mm² heat sink area | 5 | ||
| Junction-ambient thermal resistance (600 mm² heat sink area) | Rthja | 54 | K/W | PG-TO252-3-11, 600 mm² heat sink area | 5 | ||
| Junction-case thermal resistance | Rthjc | 4 | K/W | 5 |
CAD (KiCad official)
- Symbol:
TLE4284DV - Footprint:
Package_TO_SOT_SMD:TO-252-2 - 3D model: TO-252 (KiCad packages3D, STEP)
- 3D model files:
tle4284dv-etched.step/tle4284dv-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);tle4284dv.step/tle4284dv.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Infineon Technologies datasheet (25 pp, sha256
c9ece05c4b7c663a, retrieved 2026-10-17, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).