component
TLE2024BMDWR
Public Made by Adomby adom
Texas Instruments Precision Op Amps, SOIC-16-300mil. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownTLE2024BMDWR
Texas Instruments · Precision Op Amps · SOIC-16-300mil
TLE2024BMDWR from Texas Instruments, in a SOIC-16-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | OUT A | output | Output of amplifier channel A. |
| 2 | -IN A | input | Inverting input of amplifier channel A. |
| 3 | +IN A | input | Non-inverting input of amplifier channel A. |
| 4 | VCC+ | power_in | Positive (highest) supply rail; recommended VCC is 4 V to 40 V single-supply or ±2 V to ±20 V dual-supply, with absolute maximum VCC+ of 20 V. |
| 5 | +IN B | input | Non-inverting input of amplifier channel B. |
| 6 | -IN B | input | Inverting input of amplifier channel B. |
| 7 | OUT B | output | Output of amplifier channel B. |
| 8 | NC | unconnected | No internal connection on the DW package. |
| 9 | NC | unconnected | No internal connection on the DW package. |
| 10 | OUT C | output | Output of amplifier channel C. |
| 11 | -IN C | input | Inverting input of amplifier channel C. |
| 12 | +IN C | input | Non-inverting input of amplifier channel C. |
| 13 | VCC- | power_in | Negative (lowest) supply rail; absolute maximum VCC- is -20 V, and it is the ground reference for single-supply operation. |
| 14 | +IN D | input | Non-inverting input of amplifier channel D. |
| 15 | -IN D | input | Inverting input of amplifier channel D. |
| 16 | OUT D | output | Output of amplifier channel D. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SOIC-16-300mil |
| Category | Amplifiers/Comparators |
| Pins | 16 |
CAD (KiCad official)
- Symbol:
TLE2024BMDWR - Footprint:
Package_SO:SOIC-16_3.9x9.9mm_P1.27mm - 3D model: SOIC-16-300mil (KiCad packages3D, STEP)
- 3D model files:
tle2024bmdwr-etched.step/tle2024bmdwr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);tle2024bmdwr.step/tle2024bmdwr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (57 pp, sha256
4f1a7bcd56b311a9, retrieved 2026-10-08, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).