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TLC6C5912QDWRQ1

Texas Instruments · LED Drivers · SOIC-20-300mil

TLC6C5912QDWRQ1 from Texas Instruments, in a SOIC-20-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VCC power_in Power supply pin for the device, with a recommended supply range of 3 V to 5.5 V; TI recommends a 0.1 µF ceramic capacitor close to the pin.
2 SER IN input Serial-data input that loads into the internal shift register on each rising edge of SRCK.
3 DRAIN0 output Open-drain LED current-sink channel that can withstand up to 40 V LED supply voltage.
4 DRAIN1 output Open-drain LED current-sink channel that can withstand up to 40 V LED supply voltage.
5 DRAIN2 output Open-drain LED current-sink channel that can withstand up to 40 V LED supply voltage.
6 DRAIN3 output Open-drain LED current-sink channel that can withstand up to 40 V LED supply voltage.
7 DRAIN4 output Open-drain LED current-sink channel that can withstand up to 40 V LED supply voltage.
8 DRAIN5 output Open-drain LED current-sink channel that can withstand up to 40 V LED supply voltage.
9 CLR input Active-low shift register clear that clears all registers in the device when driven low; the storage register transfers data to the output buffer when CLR is high.
10 G input Active-low output enable: when low all drain channels are enabled according to the output-latch content, and when high all channels are off.
11 SER OUT output Serial-data output of the 12-bit shift register, shifted out on the falling edge of SRCK for cascading devices.
12 RCK input Storage register clock; data transfers from the shift register to the storage register on its rising edge.
13 DRAIN6 output Open-drain LED current-sink channel that can withstand up to 40 V LED supply voltage.
14 DRAIN7 output Open-drain LED current-sink channel that can withstand up to 40 V LED supply voltage.
15 DRAIN8 output Open-drain LED current-sink channel that can withstand up to 40 V LED supply voltage.
16 DRAIN9 output Open-drain LED current-sink channel that can withstand up to 40 V LED supply voltage.
17 DRAIN10 output Open-drain LED current-sink channel that can withstand up to 40 V LED supply voltage.
18 DRAIN11 output Open-drain LED current-sink channel that can withstand up to 40 V LED supply voltage.
19 SRCK input Serial shift-register clock; data transfers from SER IN into the serial shift register on each rising edge.
20 GND power_in Power ground and reference pin for the device, which must connect to the PCB ground plane.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package SOIC-20-300mil
Category LED Drivers
Pins 20

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Logic supply voltage VCC 8 V 4
Logic input voltage VI -0.3 8 V 4
Power DMOS drain-to-source voltage VDS 42 V 4
Operating ambient temperature Top 125 °C 4
Operating junction temperature TJ -40 150 °C 4
Storage temperature Tstg -55 165 °C 4
Human body model ESD V(ESD) -2000 2000 V HBM, per AEC Q100-002 4
Charged device model ESD V(ESD) -750 750 V CDM, per AEC Q100-011 4
Supply voltage VCC 3 5.5 V 4
High-level input voltage VIH 2.4 V 4
Low-level input voltage VIL 0.7 V 4
Setup time, SER IN high before SRCK↑ tsu 15 ns 4
Hold time, SER IN high after SRCK↑ th 15 ns 4
Pulse duration tw 40 ns 4
Operating case temperature TC -40 125 °C 4
High-level output voltage, SER OUT VOH 4.9 4.99 V IOH = -20 μA, VCC = 5 V 5
High-level output voltage, SER OUT VOH 4.5 4.69 V IOH = -4 mA, VCC = 5 V 5
Low-level output voltage, SER OUT VOL 0.001 0.01 V IOH = 20 μA, VCC = 5 V 5
Low-level output voltage, SER OUT VOL 0.25 0.4 V IOH = 4 mA, VCC = 5 V 5
High-level input current IIH 0.2 μA VCC = 5 V, VI = VCC 5
Low-level input current IIL -0.2 μA VCC = 5 V, VI = 0 5
Logic supply current, all outputs off ICC 0.1 1 μA VCC = 5 V, No clock signal, All outputs off 5
Logic supply current, all outputs on ICC 130 170 μA VCC = 5 V, No clock signal, All outputs on 5
Off-state drain current IDSX 0.15 0.3 μA VDS = 30 V, TC = 125°C, VCC = 5 V 5
Static drain-source on-state resistance rDS(on) 6 7.4 8.6 Ω ID = 20 mA, VCC = 5 V, TA = 25°C, single channel ON 5
Static drain-source on-state resistance rDS(on) 6.7 8.9 9.6 Ω ID = 20 mA, VCC = 5 V, TA = 25°C, all channels ON 5
Static drain-source on-state resistance rDS(on) 7.9 9.3 11.2 Ω ID = 20 mA, VCC = 3.3 V, TA = 25°C, single channel ON 5
Static drain-source on-state resistance rDS(on) 8.7 10.6 12.3 Ω ID = 20 mA, VCC = 3.3 V, TA = 25°C, all channels ON 5
Static drain-source on-state resistance rDS(on) 9.1 11.2 12.9 Ω ID = 20 mA, VCC = 5 V, TA = 125°C, single channel ON 5
Static drain-source on-state resistance rDS(on) 10.3 13 14.5 Ω ID = 20 mA, VCC = 5 V, TA = 125°C, all channels ON 5
Static drain-source on-state resistance rDS(on) 11.6 13.7 16.4 Ω ID = 20 mA, VCC = 3.3 V, TA = 125°C, single channel ON 5
Static drain-source on-state resistance rDS(on) 12.8 15.6 18.2 Ω ID = 20 mA, VCC = 3.3 V, TA = 125°C, all channels ON 5
Thermal shutdown trip point TSHUTDOWN 150 175 200 °C 5
SRCK pulse duration, high TSRCK_WH 30 ns VCC = 5 V, TJ = 25°C 6
SRCK pulse duration, low TSRCK_WL 30 ns VCC = 5 V, TJ = 25°C 6
Junction-to-ambient thermal resistance RθJA 81.2 °C/W DW (SOIC) package 5
Junction-to-case (top) thermal resistance RθJC(top) 45.4 °C/W DW (SOIC) package 5
Junction-to-board thermal resistance RθJB 49.1 °C/W DW (SOIC) package 5
Junction-to-top characterization parameter ψJT 17.5 °C/W DW (SOIC) package 5
Junction-to-board characterization parameter ψJB 48.6 °C/W DW (SOIC) package 5

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts copper bypass capacitors near the corresponding pin. Maximize the copper coverage on the PCB to increase the thermal conductivity of the board. The major heat-flow 15

CAD (KiCad official)

  • Symbol: TLC6C5912QDWRQ1
  • Footprint: Package_SO:SOIC-20W_7.5x12.8mm_P1.27mm
  • 3D model: SOIC-20-300mil (KiCad packages3D, STEP)
  • 3D model files: tlc6c5912qdwrq1-etched.step / tlc6c5912qdwrq1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tlc6c5912qdwrq1.step / tlc6c5912qdwrq1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (27 pp, sha256 3ade8725cefdfc13, retrieved 2026-11-05, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF