component
TLC-NSML450
Public Made by Adomby adom
TLC Electronic Resettable Fuses, 1206. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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TLC-NSML450
TLC Electronic · Resettable Fuses · 1206
TLC-NSML450 from TLC Electronic, in a 1206. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Resettable PTC fuse terminal 1 (non-polarized, interchangeable with terminal 2); device is rated Vmax 10Vdc, Imax 50A, I-hold 4.50A and I-trip 9.00A at 25°C. |
| 2 | 2 | passive | Resettable PTC fuse terminal 2 (non-polarized, interchangeable with terminal 1); device is rated Vmax 10Vdc, Imax 50A, I-hold 4.50A and I-trip 9.00A at 25°C. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | TLC Electronic |
| Package | 1206 |
| Category | Circuit Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Hold current (max without trip) | I-hold | 4.5 | A | 25℃ still air | 1 | ||
| Trip current (min to trip) | I-trip | 9 | A | 25℃ still air | 1 | ||
| Hold current (max without trip) | I-hold | 3 | A | 70℃ still air | 1 | ||
| Trip current (min to trip) | I-trip | 6 | A | 70℃ still air | 1 | ||
| Time to trip | 5 | s | 22.5A @ 25℃ | 1 | |||
| Minimum resistance prior to trip | R min | 0.002 | Ω | 25℃ | 1 | ||
| Maximum resistance one hour post reflow | R1max | 0.014 | Ω | 25℃ | 1 | ||
| Rated working power | Pd | 1.5 | W | 1 | |||
| Maximum voltage withstand at rated current | Vmax | 10 | Vdc | at rated current | 1 | ||
| Maximum fault current withstand at rated voltage | Imax | 50 | A | at rated voltage | 1 | ||
| Hold current vs ambient (max without trip) | 6.2 | A | ambient -40℃ | 1 | |||
| Hold current vs ambient (max without trip) | 5.65 | A | ambient -20℃ | 1 | |||
| Hold current vs ambient (max without trip) | 5.25 | A | ambient 0℃ | 1 | |||
| Hold current vs ambient (max without trip) | 4.5 | A | ambient 25℃ | 1 | |||
| Hold current vs ambient (max without trip) | 4.15 | A | ambient 40℃ | 1 | |||
| Hold current vs ambient (max without trip) | 3.45 | A | ambient 50℃ | 1 | |||
| Hold current vs ambient (max without trip) | 3.15 | A | ambient 60℃ | 1 | |||
| Hold current vs ambient (max without trip) | 3 | A | ambient 70℃ | 1 | |||
| Hold current vs ambient (max without trip) | 2.4 | A | ambient 85℃ | 1 | |||
| Hold current vs ambient (max without trip) | 1.35 | A | ambient 105℃ | 1 | |||
| Trip current vs ambient (min to trip) | 12.4 | A | ambient -40℃ | 1 | |||
| Trip current vs ambient (min to trip) | 11.3 | A | ambient -20℃ | 1 | |||
| Trip current vs ambient (min to trip) | 10.5 | A | ambient 0℃ | 1 | |||
| Trip current vs ambient (min to trip) | 9 | A | ambient 25℃ | 1 | |||
| Trip current vs ambient (min to trip) | 8.3 | A | ambient 40℃ | 1 | |||
| Trip current vs ambient (min to trip) | 6.9 | A | ambient 50℃ | 1 | |||
| Trip current vs ambient (min to trip) | 6.3 | A | ambient 60℃ | 1 | |||
| Trip current vs ambient (min to trip) | 6 | A | ambient 70℃ | 1 | |||
| Trip current vs ambient (min to trip) | 4.8 | A | ambient 85℃ | 1 | |||
| Trip current vs ambient (min to trip) | 2.7 | A | ambient 105℃ | 1 | |||
| Peak solder reflow temperature | 260 | ℃ | recommended reflow profile peak | 1 | |||
| Average ramp-up rate | 3 | ℃/second | solder reflow, average | 1 | |||
| Ramp-down rate | 6 | ℃/second | solder reflow | 1 |
CAD (KiCad official)
- Symbol:
TLC-NSML450 - Footprint:
Fuse:Fuse_1206_3216Metric - 3D model: 1206 (KiCad packages3D, STEP)
- 3D model files:
tlc-nsml450-etched.step/tlc-nsml450-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);tlc-nsml450.step/tlc-nsml450.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: TLC Electronic datasheet (2 pp, sha256
3abb3780815ea6a5, retrieved 2026-10-18, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# TLC-NSML450
**TLC Electronic** · Resettable Fuses · 1206
TLC-NSML450 from TLC Electronic, in a 1206. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Resettable PTC fuse terminal 1 (non-polarized, interchangeable with terminal 2); device is rated Vmax 10Vdc, Imax 50A, I-hold 4.50A and I-trip 9.00A at 25°C. |
| 2 | 2 | passive | Resettable PTC fuse terminal 2 (non-polarized, interchangeable with terminal 1); device is rated Vmax 10Vdc, Imax 50A, I-hold 4.50A and I-trip 9.00A at 25°C. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | TLC Electronic |
| Package | 1206 |
| Category | Circuit Protection |
| Pins | 2 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Hold current (max without trip) | I-hold | | | 4.5 | A | 25℃ still air | 1 |
| Trip current (min to trip) | I-trip | 9 | | | A | 25℃ still air | 1 |
| Hold current (max without trip) | I-hold | | | 3 | A | 70℃ still air | 1 |
| Trip current (min to trip) | I-trip | 6 | | | A | 70℃ still air | 1 |
| Time to trip | | | | 5 | s | 22.5A @ 25℃ | 1 |
| Minimum resistance prior to trip | R min | 0.002 | | | Ω | 25℃ | 1 |
| Maximum resistance one hour post reflow | R1max | | | 0.014 | Ω | 25℃ | 1 |
| Rated working power | Pd | | 1.5 | | W | | 1 |
| Maximum voltage withstand at rated current | Vmax | | | 10 | Vdc | at rated current | 1 |
| Maximum fault current withstand at rated voltage | Imax | | | 50 | A | at rated voltage | 1 |
| Hold current vs ambient (max without trip) | | | | 6.2 | A | ambient -40℃ | 1 |
| Hold current vs ambient (max without trip) | | | | 5.65 | A | ambient -20℃ | 1 |
| Hold current vs ambient (max without trip) | | | | 5.25 | A | ambient 0℃ | 1 |
| Hold current vs ambient (max without trip) | | | | 4.5 | A | ambient 25℃ | 1 |
| Hold current vs ambient (max without trip) | | | | 4.15 | A | ambient 40℃ | 1 |
| Hold current vs ambient (max without trip) | | | | 3.45 | A | ambient 50℃ | 1 |
| Hold current vs ambient (max without trip) | | | | 3.15 | A | ambient 60℃ | 1 |
| Hold current vs ambient (max without trip) | | | | 3 | A | ambient 70℃ | 1 |
| Hold current vs ambient (max without trip) | | | | 2.4 | A | ambient 85℃ | 1 |
| Hold current vs ambient (max without trip) | | | | 1.35 | A | ambient 105℃ | 1 |
| Trip current vs ambient (min to trip) | | 12.4 | | | A | ambient -40℃ | 1 |
| Trip current vs ambient (min to trip) | | 11.3 | | | A | ambient -20℃ | 1 |
| Trip current vs ambient (min to trip) | | 10.5 | | | A | ambient 0℃ | 1 |
| Trip current vs ambient (min to trip) | | 9 | | | A | ambient 25℃ | 1 |
| Trip current vs ambient (min to trip) | | 8.3 | | | A | ambient 40℃ | 1 |
| Trip current vs ambient (min to trip) | | 6.9 | | | A | ambient 50℃ | 1 |
| Trip current vs ambient (min to trip) | | 6.3 | | | A | ambient 60℃ | 1 |
| Trip current vs ambient (min to trip) | | 6 | | | A | ambient 70℃ | 1 |
| Trip current vs ambient (min to trip) | | 4.8 | | | A | ambient 85℃ | 1 |
| Trip current vs ambient (min to trip) | | 2.7 | | | A | ambient 105℃ | 1 |
| Peak solder reflow temperature | | | | 260 | ℃ | recommended reflow profile peak | 1 |
| Average ramp-up rate | | | | 3 | ℃/second | solder reflow, average | 1 |
| Ramp-down rate | | | | 6 | ℃/second | solder reflow | 1 |
## CAD (KiCad official)
- Symbol: `TLC-NSML450`
- Footprint: `Fuse:Fuse_1206_3216Metric`
- 3D model: 1206 (KiCad packages3D, STEP)
- 3D model files: `tlc-nsml450-etched.step` / `tlc-nsml450-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `tlc-nsml450.step` / `tlc-nsml450.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [TLC Electronic datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588912611098705920) (2 pp, sha256 `3abb3780815ea6a5`, retrieved 2026-10-18, tier: lcsc)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/tlc-nsml450-datasheet.pdf)