component
TK1R5R04PB
Public Made by Adomby adom
TOSHIBA MOSFETs, D2PAK. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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TK1R5R04PB
TOSHIBA · MOSFETs · D2PAK
TK1R5R04PB from TOSHIBA, in a D2PAK. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Gate | input | Gate terminal with gate-source voltage limited to ±20 V and threshold Vth of 2.0 to 3.0 V (VDS = 10 V, ID = 0.5 mA). |
| 2 | Drain | passive | Drain terminal, also the heatsink tab, rated for 40 V drain-source voltage and 160 A DC drain current. |
| 3 | Source | passive | Source terminal of the N-channel MOSFET, with reverse drain current (DC) rated at 160 A. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | TOSHIBA |
| Package | D2PAK |
| Category | Triode/MOS Tube/Transistor |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Gate leakage current | IGSS | -1 | 1 | µA | VGS = ±20 V, VDS = 0 V | 4 | |
| Drain cut-off current | IDSS | 10 | µA | VDS = 40 V, VGS = 0 V | 4 | ||
| Drain-source breakdown voltage | V(BR)DSS | 40 | V | ID = 10 mA, VGS = 0 V | 4 | ||
| Drain-source breakdown voltage | V(BR)DSX | 20 | V | ID = 10 mA, VGS = -20 V | 4 | ||
| Gate threshold voltage | Vth | 2 | 3 | V | VDS = 10 V, ID = 0.5 mA | 4 | |
| Drain-source on-resistance | RDS(ON) | 1.45 | 2.05 | mΩ | VGS = 6 V, ID = 80 A | 4 | |
| Drain-source on-resistance | RDS(ON) | 1.25 | 1.5 | mΩ | VGS = 10 V, ID = 80 A | 4 | |
| Reverse drain current (DC) | IDR | 160 | A | 4 | |||
| Reverse drain current (pulsed) | IDRP | 480 | A | 4 | |||
| Diode forward voltage | VDSF | -1.2 | V | IDR = 160 A, VGS = 0 V | 4 | ||
| Drain-source voltage | VDSS | 40 | V | Ta = 25 | 2 | ||
| Gate-source voltage | VGSS | -20 | 20 | V | Ta = 25 | 2 | |
| Drain current (DC) | ID | 160 | A | Tc = 25 | 2 | ||
| Drain current (pulsed) | IDP | 480 | A | 2 | |||
| Power dissipation | PD | 205 | W | Tc = 25 | 2 | ||
| Single-pulse avalanche energy | EAS | 377 | mJ | VDD = 32 V, Tch = 25 (initial), L = 29 µH, RG = 1 Ω, IAS = 100 A, VGS = +15/0 V | 2 | ||
| Single-pulse avalanche current | IAS | 100 | A | 2 | |||
| Channel temperature | Tch | 175 | °C | 2 | |||
| Storage temperature | Tstg | -55 | 175 | °C | 2 | ||
| Channel-to-case thermal resistance | Rth(ch-c) | 0.73 | °C/W | 3 | |||
| Input capacitance | Ciss | 5500 | pF | VDS = 10 V, VGS = 0 V, f = 300 kHz | 4 | ||
| Reverse transfer capacitance | Crss | 490 | pF | VDS = 10 V, VGS = 0 V, f = 300 kHz | 4 | ||
| Output capacitance | Coss | 3400 | pF | VDS = 10 V, VGS = 0 V, f = 300 kHz | 4 | ||
| Switching time (rise time) | tr | 14 | ns | VDD ≈ 20 V, VGS = 0 V/10 V, ID = 80 A, RL = 0.25 Ω, RG = 4.7 Ω | 4 | ||
| Switching time (turn-on time) | ton | 47 | ns | VDD ≈ 20 V, VGS = 0 V/10 V, ID = 80 A, RL = 0.25 Ω, RG = 4.7 Ω | 4 | ||
| Switching time (fall time) | tf | 23 | ns | VDD ≈ 20 V, VGS = 0 V/10 V, ID = 80 A, RL = 0.25 Ω, RG = 4.7 Ω | 4 | ||
| Switching time (turn-off time) | toff | 82 | ns | VDD ≈ 20 V, VGS = 0 V/10 V, ID = 80 A, RL = 0.25 Ω, RG = 4.7 Ω | 4 | ||
| Total gate charge | Qg | 103 | nC | VDD ≈ 32 V, VGS = 10 V, ID = 160 A | 4 | ||
| Gate-source charge 1 | Qgs1 | 30 | nC | VDD ≈ 32 V, VGS = 10 V, ID = 160 A | 4 | ||
| Gate-drain charge | Qgd | 24 | nC | VDD ≈ 32 V, VGS = 10 V, ID = 160 A | 4 | ||
| Reverse recovery time | trr | 100 | ns | IDR = 160 A, VGS = 0 V, -dIDR/dt = 50 A/µs | 4 | ||
| Reverse recovery charge | Qrr | 100 | nC | IDR = 160 A, VGS = 0 V, -dIDR/dt = 50 A/µs | 4 |
CAD (KiCad official)
- Symbol:
TK1R5R04PB - Footprint:
Package_TO_SOT_SMD:TO-263-2 - 3D model: D2PAK (KiCad packages3D, STEP)
- 3D model files:
tk1r5r04pb-etched.step/tk1r5r04pb-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);tk1r5r04pb.step/tk1r5r04pb.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: TOSHIBA datasheet (11 pp, sha256
bf80fad83619de08, retrieved 2026-10-30, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# TK1R5R04PB
**TOSHIBA** · MOSFETs · D2PAK
TK1R5R04PB from TOSHIBA, in a D2PAK. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Gate | input | Gate terminal with gate-source voltage limited to ±20 V and threshold Vth of 2.0 to 3.0 V (VDS = 10 V, ID = 0.5 mA). |
| 2 | Drain | passive | Drain terminal, also the heatsink tab, rated for 40 V drain-source voltage and 160 A DC drain current. |
| 3 | Source | passive | Source terminal of the N-channel MOSFET, with reverse drain current (DC) rated at 160 A. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | TOSHIBA |
| Package | D2PAK |
| Category | Triode/MOS Tube/Transistor |
| Pins | 3 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Gate leakage current | IGSS | -1 | | 1 | µA | VGS = ±20 V, VDS = 0 V | 4 |
| Drain cut-off current | IDSS | | | 10 | µA | VDS = 40 V, VGS = 0 V | 4 |
| Drain-source breakdown voltage | V(BR)DSS | 40 | | | V | ID = 10 mA, VGS = 0 V | 4 |
| Drain-source breakdown voltage | V(BR)DSX | 20 | | | V | ID = 10 mA, VGS = -20 V | 4 |
| Gate threshold voltage | Vth | 2 | | 3 | V | VDS = 10 V, ID = 0.5 mA | 4 |
| Drain-source on-resistance | RDS(ON) | | 1.45 | 2.05 | mΩ | VGS = 6 V, ID = 80 A | 4 |
| Drain-source on-resistance | RDS(ON) | | 1.25 | 1.5 | mΩ | VGS = 10 V, ID = 80 A | 4 |
| Reverse drain current (DC) | IDR | | | 160 | A | | 4 |
| Reverse drain current (pulsed) | IDRP | | | 480 | A | | 4 |
| Diode forward voltage | VDSF | | | -1.2 | V | IDR = 160 A, VGS = 0 V | 4 |
| Drain-source voltage | VDSS | | | 40 | V | Ta = 25 | 2 |
| Gate-source voltage | VGSS | -20 | | 20 | V | Ta = 25 | 2 |
| Drain current (DC) | ID | | | 160 | A | Tc = 25 | 2 |
| Drain current (pulsed) | IDP | | | 480 | A | | 2 |
| Power dissipation | PD | | | 205 | W | Tc = 25 | 2 |
| Single-pulse avalanche energy | EAS | | | 377 | mJ | VDD = 32 V, Tch = 25 (initial), L = 29 µH, RG = 1 Ω, IAS = 100 A, VGS = +15/0 V | 2 |
| Single-pulse avalanche current | IAS | | | 100 | A | | 2 |
| Channel temperature | Tch | | | 175 | °C | | 2 |
| Storage temperature | Tstg | -55 | | 175 | °C | | 2 |
| Channel-to-case thermal resistance | Rth(ch-c) | | | 0.73 | °C/W | | 3 |
| Input capacitance | Ciss | | 5500 | | pF | VDS = 10 V, VGS = 0 V, f = 300 kHz | 4 |
| Reverse transfer capacitance | Crss | | 490 | | pF | VDS = 10 V, VGS = 0 V, f = 300 kHz | 4 |
| Output capacitance | Coss | | 3400 | | pF | VDS = 10 V, VGS = 0 V, f = 300 kHz | 4 |
| Switching time (rise time) | tr | | 14 | | ns | VDD ≈ 20 V, VGS = 0 V/10 V, ID = 80 A, RL = 0.25 Ω, RG = 4.7 Ω | 4 |
| Switching time (turn-on time) | ton | | 47 | | ns | VDD ≈ 20 V, VGS = 0 V/10 V, ID = 80 A, RL = 0.25 Ω, RG = 4.7 Ω | 4 |
| Switching time (fall time) | tf | | 23 | | ns | VDD ≈ 20 V, VGS = 0 V/10 V, ID = 80 A, RL = 0.25 Ω, RG = 4.7 Ω | 4 |
| Switching time (turn-off time) | toff | | 82 | | ns | VDD ≈ 20 V, VGS = 0 V/10 V, ID = 80 A, RL = 0.25 Ω, RG = 4.7 Ω | 4 |
| Total gate charge | Qg | | 103 | | nC | VDD ≈ 32 V, VGS = 10 V, ID = 160 A | 4 |
| Gate-source charge 1 | Qgs1 | | 30 | | nC | VDD ≈ 32 V, VGS = 10 V, ID = 160 A | 4 |
| Gate-drain charge | Qgd | | 24 | | nC | VDD ≈ 32 V, VGS = 10 V, ID = 160 A | 4 |
| Reverse recovery time | trr | | 100 | | ns | IDR = 160 A, VGS = 0 V, -dIDR/dt = 50 A/µs | 4 |
| Reverse recovery charge | Qrr | | 100 | | nC | IDR = 160 A, VGS = 0 V, -dIDR/dt = 50 A/µs | 4 |
## CAD (KiCad official)
- Symbol: `TK1R5R04PB`
- Footprint: `Package_TO_SOT_SMD:TO-263-2`
- 3D model: D2PAK (KiCad packages3D, STEP)
- 3D model files: `tk1r5r04pb-etched.step` / `tk1r5r04pb-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `tk1r5r04pb.step` / `tk1r5r04pb.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [TOSHIBA datasheet](docs/tk1r5r04pb-datasheet.pdf) (11 pp, sha256 `bf80fad83619de08`, retrieved 2026-10-30, tier: manufacturer)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/tk1r5r04pb-datasheet.pdf)