component
TK100S04N1L
Public Made by Adomby adom
TOSHIBA MOSFETs, DPAK. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
| Name | Last updated |
|---|---|
| docs | 15d ago |
| viewers | 15d ago |
| package.json | 15d ago |
| page.json | 15d ago |
| README.md | 15d ago |
| tk100s04n1l-etched.glb | 15d ago |
| tk100s04n1l-etched.step | 15d ago |
| tk100s04n1l-hero.glb | 15d ago |
| tk100s04n1l-hero.overlay.json | 15d ago |
| tk100s04n1l.glb | 15d ago |
| tk100s04n1l.kicad_mod | 15d ago |
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| tk100s04n1l.lbr | 15d ago |
| tk100s04n1l.step | 15d ago |
TK100S04N1L
TOSHIBA · MOSFETs · DPAK
TK100S04N1L from TOSHIBA, in a DPAK. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Gate | input | Gate terminal; gate-source voltage limited to ±20 V with threshold Vth of 1.5 to 2.5 V (VDS = 10 V, ID = 0.5 mA). |
| 2 | Drain | passive | Drain terminal, connected to the heatsink tab; drain-source voltage rated 40 V and DC drain current 100 A. |
| 3 | Source | passive | Source terminal of the N-channel MOSFET; reverse drain current (DC) is 100 A max. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | TOSHIBA |
| Package | DPAK |
| Category | Triode/MOS Tube/Transistor |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-source voltage | VDSS | 40 | V | 2 | |||
| Gate-source voltage | VGSS | -20 | 20 | V | 2 | ||
| Drain current (DC) | ID | 100 | A | Tc = 25 | 2 | ||
| Drain current (pulsed) | IDP | 200 | A | 2 | |||
| Power dissipation | PD | 180 | W | Tc = 25 | 2 | ||
| Single-pulse avalanche energy | EAS | 114 | mJ | VDD = 32 V, Tch = 25 (initial), L = 8.8 µH, RG = 1 Ω, IAS = 100 A | 2 | ||
| Single-pulse avalanche current | IAS | 100 | A | 2 | |||
| Channel temperature | Tch | 175 | °C | 2 | |||
| Storage temperature | Tstg | -55 | 175 | °C | 2 | ||
| Channel-to-case thermal resistance | Rth(ch-c) | 0.83 | /W | 2 | |||
| Gate leakage current | IGSS | -1 | 1 | µA | VGS = ±20 V, VDS = 0 V | 3 | |
| Drain cut-off current | IDSS | 10 | µA | VDS = 40 V, VGS = 0 V | 3 | ||
| Drain-source breakdown voltage | V(BR)DSS | 40 | V | ID = 10 mA, VGS = 0 V | 3 | ||
| Drain-source breakdown voltage | V(BR)DSX | 20 | V | ID = 10 mA, VGS = -20 V | 3 | ||
| Gate threshold voltage | Vth | 1.5 | 2.5 | V | VDS = 10 V, ID = 0.5 mA | 3 | |
| Drain-source on-resistance | RDS(ON) | 2.8 | 4.5 | mΩ | VGS = 4.5 V, ID = 50 A | 3 | |
| Drain-source on-resistance | RDS(ON) | 1.9 | 2.3 | mΩ | VGS = 10 V, ID = 50 A | 3 | |
| Reverse drain current (DC) | IDR | 100 | A | 3 | |||
| Reverse drain current (pulsed) | IDRP | 200 | A | 3 | |||
| Diode forward voltage | VDSF | -1.2 | V | IDR = 100 A, VGS = 0 V | 3 | ||
| Input capacitance | Ciss | 5490 | pF | VDS = 10 V, VGS = 0 V, f = 1 MHz | 3 | ||
| Reverse transfer capacitance | Crss | 220 | pF | VDS = 10 V, VGS = 0 V, f = 1 MHz | 3 | ||
| Output capacitance | Coss | 3000 | pF | VDS = 10 V, VGS = 0 V, f = 1 MHz | 3 | ||
| Switching time (rise time) | tr | 8 | ns | See Figure 6.2.1. | 3 | ||
| Switching time (turn-on time) | ton | 23 | ns | See Figure 6.2.1. | 3 | ||
| Switching time (fall time) | tf | 19 | ns | See Figure 6.2.1. | 3 | ||
| Switching time (turn-off time) | toff | 80 | ns | See Figure 6.2.1. | 3 | ||
| Total gate charge | Qg | 76 | nC | VDD ≈ 32 V, VGS = 10 V, ID = 100 A | 3 | ||
| Gate-source charge 1 | Qgs1 | 18 | nC | VDD ≈ 32 V, VGS = 10 V, ID = 100 A | 3 | ||
| Gate-drain charge | Qgd | 11 | nC | VDD ≈ 32 V, VGS = 10 V, ID = 100 A | 3 | ||
| Reverse recovery time | trr | 90 | ns | IDR = 100 A, VGS = 0 V, -dIDR/dt = 50 A/µs | 3 | ||
| Reverse recovery charge | Qrr | 90 | nC | IDR = 100 A, VGS = 0 V, -dIDR/dt = 50 A/µs | 3 |
CAD (KiCad official)
- Symbol:
TK100S04N1L - Footprint:
Package_TO_SOT_SMD:TO-252-2 - 3D model: DPAK (KiCad packages3D, STEP)
- 3D model files:
tk100s04n1l-etched.step/tk100s04n1l-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);tk100s04n1l.step/tk100s04n1l.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: TOSHIBA datasheet (9 pp, sha256
df7c8dcbf3bd96fe, retrieved 2026-10-24, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).