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TJ90S04M3L

TOSHIBA · MOSFETs · DPAK

TJ90S04M3L from TOSHIBA, in a DPAK. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Gate input Gate terminal of the P-channel MOSFET, rated for a gate-source voltage (VGSS) of +10/-20 V.
2 Drain (heatsink) passive Drain terminal, electrically connected to the heatsink tab, rated for a drain-source voltage (VDSS) of -40 V.
3 Source passive Source terminal, the reference for the gate-source voltage and the drain current ratings (DC drain current -90 A).

Key specifications

Parameter Value
Manufacturer TOSHIBA
Package DPAK
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-source voltage VDSS -40 V 1
Gate-source voltage VGSS -20 10 V 1
Drain current (DC) ID -90 A 1
Drain current (pulsed) IDP -180 A 1
Power dissipation PD 180 W Tc = 25 °C 1
Single-pulse avalanche energy EAS 156 mJ Note 3: VDD = -25 V, Tch = 25 °C (initial), L = 20 µH, RG = 25 Ω, IAS = -90 A, VG = 0/-15 V 1
Single-pulse avalanche current IAS -90 A 1
Channel temperature Tch 175 °C 1
Storage temperature Tstg -55 175 °C 1
Channel-to-case thermal resistance Rth(ch-c) 0.83 /W 2
Gate leakage current IGSS -1 1 µA VGS = +10/-20 V, VDS = 0 V 3
Drain cut-off current IDSS -10 µA VDS = -40 V, VGS = 0 V 3
Drain-source breakdown voltage V(BR)DSS -40 V ID = -10 mA, VGS = 0 V 3
Drain-source breakdown voltage V(BR)DSX -30 V ID = -10 mA, VGS = 10 V 3
Gate threshold voltage Vth -1 -2 V VDS = -10 V, ID = -1 mA 3
Drain-source on-resistance RDS(ON) 4.3 6 mΩ VGS = -4.5 V, ID = -45 A 3
Drain-source on-resistance RDS(ON) 3.4 4.3 mΩ VGS = -10 V, ID = -45 A 3
Reverse drain current (DC) IDR -90 A 3
Reverse drain current (pulsed) IDRP -180 A 3
Diode forward voltage VDSF 1.2 V IDR = -90 A, VGS = 0 V 3

CAD (KiCad official)

  • Symbol: TJ90S04M3L
  • Footprint: Package_TO_SOT_SMD:TO-252-2
  • 3D model: DPAK (KiCad packages3D, STEP)
  • 3D model files: tj90s04m3l-etched.step / tj90s04m3l-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tj90s04m3l.step / tj90s04m3l.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: TOSHIBA datasheet (10 pp, sha256 ebf557c341f955f8, retrieved 2026-10-19, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF