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TJ7660D

HTC Korea TAEJIN Tech · Charge Pumps · SOIC-8

TJ7660D from HTC Korea TAEJIN Tech, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 NC unconnected No internal connection. Leave floating or tie to a nearby copper pour for mechanical support only.
2 CAP+ passive Positive terminal of the external charge-pump 'flying' capacitor C1 (typ. 10 uF). Alternately switched between V+ and CAP- during the pump cycle to transfer charge to the reservoir capacitor.
3 GND power_in Device ground / 0 V reference for the input supply and the output reservoir capacitor return.
4 CAP- passive Negative terminal of the external charge-pump 'flying' capacitor C1. Alternately switched between GND (charge phase) and VOUT (transfer phase) by the internal N-channel MOS switches.
5 VOUT power_out Inverted supply output; delivers -V+ (approximately -1.5 V to -10 V) into the external reservoir capacitor C2 (typ. 10 uF to GND). Typical output source resistance is 60 Ohm (100 Ohm max) at IOUT = 20 mA, V+ = 5 V.
6 LV input Low-voltage operation mode select. Tie to GND to bypass the internal series regulator and improve operation for V+ in the 1.5 V - 3.5 V range. Must be left floating (open) for V+ >= 3.5 V (up to 10 V) to prevent device latchup. Absolute-max input current 20 uA for V+ > 3.5 V.
7 OSC bidirectional Internal RC-oscillator node. Nominal free-running frequency is ~10 kHz at V+ = 5 V with COSC = 0. Add an external capacitor to GND to lower the frequency, or drive with an external clock to override the internal oscillator.
8 V+ power_in Positive supply input, +1.5 V to +10 V (absolute-max +10.5 V). Also serves as the reference used by the level translator and internal voltage regulator. Typical supply current 100 uA (180 uA max) with no load.

Key specifications

Parameter Value
Manufacturer HTC Korea TAEJIN Tech
Package SOIC-8
Category Power Management (PMIC)
Pins 8

Ordering variants

Same part, different packaging or reel option.

  • TJ7660DD
  • TJ7660DN

CAD (KiCad official)

  • Symbol: TJ7660D
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: tj7660d-etched.step / tj7660d-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tj7660d.step / tj7660d.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HTC Korea TAEJIN Tech datasheet (11 pp, sha256 86054706302dec33, retrieved 2026-08-17, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF