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Contents

README

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THS7373IPWR

Texas Instruments · Operational Amplifier · TSSOP-14

THS7373IPWR from Texas Instruments, in a TSSOP-14. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 CVBS IN input CVBS filter video input.
2 HD CH.1 IN input HD channel 1 video input.
3 HD CH.2 IN input HD channel 2 video input.
4 HD CH.3 IN input HD channel 3 video input.
5 GND power_in Ground pin for all internal circuitry.
6 DISABLE input Logic high disables the part and logic low enables it; must not be left floating and must be tied to a defined logic state (GND or VS+).
7 NC unconnected No internal connection.
8 NC unconnected No internal connection.
9 HD BYPASS input Logic high bypasses the internal HD low-pass filter and logic low uses the internal filters; must not be left floating and must be tied to a defined logic state (GND or VS+).
10 VS+ power_in Positive power-supply pin; connect to +3 V to +5 V.
11 HD CH3 OUT output HD channel 3 video output.
12 HD CH2 OUT output HD channel 2 video output.
13 HD CH1 OUT output HD channel 1 video output.
14 CVBS OUT output CVBS filter video output.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package TSSOP-14
Category Amplifiers
Pins 14

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage VS+ 3 5.5 V 2
Ambient temperature TA -40 25 85 °C 2
Supply voltage VS+ to GND VS+ 5.5 V 2
Input voltage VI -0.4 V to VS+ upper 2
Output current IO -90 90 mA 2
Maximum junction temperature, any condition TJ 150 °C 2
Maximum junction temperature, continuous operation TJ 125 °C long-term reliability 2
Storage temperature TSTG -60 150 °C 2
ESD HBM 2500 V Human body model 2
ESD CDM 1000 V Charge device model 2
ESD MM 200 V Machine model 2
Thermal resistance junction-to-case θJC 38 °C/W TSSOP-14 (PW) 2
Thermal resistance junction-to-ambient θJA 115 °C/W JEDEC High-K PCB; 130 for low-K 2
CVBS passband bandwidth 7 8.2 10.2 MHz VS+=3.3 V; -1 dB; VO = 0.2 VPP and 2 VPP 3
CVBS bandwidth 7.8 9.5 11.4 MHz VS+=3.3 V; -3 dB; VO = 0.2 VPP and 2 VPP 3
CVBS attenuation at 6.75 MHz -0.9 0.2 1.1 dB VS+=3.3 V; with respect to 500 kHz, f = 6.75 MHz 3
CVBS attenuation at 27 MHz 42 54 dB VS+=3.3 V; with respect to 500 kHz, f = 27 MHz 3
CVBS gain 5.7 6 6.3 dB VS+=3.3 V; TA = +25°C 3
CVBS gain over temperature 5.65 6.35 dB VS+=3.3 V; TA = -40°C to +85°C 3
HD passband bandwidth 27.8 33 38.8 MHz VS+=3.3 V; -1 dB; VO = 0.2 VPP and 2 VPP 3
HD bandwidth 30.3 36 42.5 MHz VS+=3.3 V; -3 dB; VO = 0.2 VPP and 2 VPP 3
HD bypass mode bandwidth 170 350 MHz VS+=3.3 V; -3 dB; VO = 0.2 VPP 3
HD slew rate 400 450 V/μs VS+=3.3 V; Bypass mode; VO = 2 VPP 3
HD attenuation at 27 MHz -1 -0.1 1 dB VS+=3.3 V; with respect to 500 kHz, f = 27 MHz 3
HD attenuation at 74 MHz 34 40 dB VS+=3.3 V; with respect to 500 kHz, f = 74 MHz 3
HD gain 5.7 6 6.3 dB VS+=3.3 V; All channels, TA = +25°C 3
HD gain over temperature 5.65 6.35 dB VS+=3.3 V; All channels, TA = -40°C to +85°C 3
Biased output voltage CVBS 200 300 400 mV VS+=3.3 V; VIN = 0 V, CVBS channel 4
Biased output voltage HD 200 300 400 mV VS+=3.3 V; VIN = 0 V, HD channels 4
Sync-tip clamp charge current CVBS 140 200 μA VS+=3.3 V; VIN = -0.1 V, CVBS channel 4
Sync-tip clamp charge current HD 280 400 μA VS+=3.3 V; VIN = -0.1 V, HD channels 4
High output voltage swing 2.85 3.1 V VS+=3.3 V; RL = 150 Ω to GND 4
Low output voltage swing 0.03 0.1 V VS+=3.3 V; RL = 150 Ω to GND (VIN = -0.2 V) 4
Operating voltage (3.3 V table) 2.6 3.3 5.5 V 4
Total quiescent current, enabled IQ 13.4 16.2 21 mA VS+=3.3 V; VIN = 0 V, all channels on, no load 4
Total quiescent current, disabled IQ 0.1 10 μA VS+=3.3 V; VIN = 0 V, all channels off, VDISABLE = 3 V 4
Logic high threshold VIH 1.8 2 V VS+=3.3 V; Disabled or Bypass mode 4
Logic low threshold VIL 0.65 0.7 V VS+=3.3 V; Enabled or Filter mode 4
CVBS passband bandwidth (5 V) 7 8.2 10.2 MHz VS+=5 V; -1 dB; VO = 0.2 VPP and 2 VPP 5
CVBS bandwidth (5 V) 7.8 9.5 11.4 MHz VS+=5 V; -3 dB; VO = 0.2 VPP and 2 VPP 5
CVBS attenuation at 6.75 MHz (5 V) -0.9 0.2 1.1 dB VS+=5 V; with respect to 500 kHz, f = 6.75 MHz 5
CVBS attenuation at 27 MHz (5 V) 42 54 dB VS+=5 V; with respect to 500 kHz, f = 27 MHz 5
CVBS gain (5 V) 5.7 6 6.3 dB VS+=5 V; TA = +25°C 5
HD bandwidth (5 V) 30.3 36 42.5 MHz VS+=5 V; -3 dB; VO = 0.2 VPP and 2 VPP 5
HD gain (5 V) 5.7 6 6.3 dB VS+=5 V; All channels, TA = +25°C 5
High output voltage swing (5 V) 4.5 4.75 V VS+=5 V; RL = 150 Ω to GND 6
Low output voltage swing (5 V) 0.03 0.1 V VS+=5 V; RL = 150 Ω to GND (VIN = -0.2 V) 6
Operating voltage (5 V table) 2.6 5 5.5 V 6
Total quiescent current, enabled (5 V) IQ 14 16.9 22 mA VS+=5 V; VIN = 0 V, all channels on, no load 6
Total quiescent current, disabled (5 V) IQ 1 10 μA VS+=5 V; VIN = 0 V, all channels off, VDISABLE = 3 V 6
Logic high threshold (5 V) VIH 2.1 2.2 V VS+=5 V; Disabled or Bypass engaged 6
Logic low threshold (5 V) VIL 0.75 0.8 V VS+=5 V; Enabled or Bypass disengaged 6

CAD (KiCad official)

  • Symbol: THS7373IPWR
  • Footprint: Package_SO:TSSOP-14_4.4x5mm_P0.65mm
  • 3D model: TSSOP-14 (KiCad packages3D, STEP)
  • 3D model files: ths7373ipwr-etched.step / ths7373ipwr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ths7373ipwr.step / ths7373ipwr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (55 pp, sha256 1f821299b2fda275, retrieved 2026-10-27, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF