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THS7316DR

Texas Instruments · Video Amplifiers · SOIC-8

THS7316DR from Texas Instruments, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 CH.1 IN input Channel 1 video input. High-impedance input (~800 kΩ) with internal sync-tip clamp / DC-restore path; accepts Y' / G' HDTV component video or similar signals. Input voltage range -0.1 V to (VS+ limited by output).
2 CH.2 IN input Channel 2 video input. High-impedance input (~800 kΩ) with internal sync-tip clamp / DC-restore path; accepts P'B / B' HDTV component video or similar signals.
3 CH.3 IN input Channel 3 video input. High-impedance input (~800 kΩ) with internal sync-tip clamp / DC-restore path; accepts P'R / R' HDTV component video or similar signals.
4 Vs+ power_in Positive power supply pin. Connect to a single 3-V to 5-V rail (absolute max 5.5 V). Total quiescent current is typically 18.3 mA at 3.3 V (19.3 mA at 5 V). Decouple locally to GND.
5 GND power_in Ground pin for all internal circuitry. Connect to the system analog/video ground plane.
6 CH.3 OUT output Channel 3 filtered/amplified video output. 6-dB (2 V/V) gain from CH.3 IN through the 5th-order 36-MHz Butterworth filter. Rail-to-rail output stage swings within ~100 mV of the rails and can drive two 75-Ω video lines per channel.
7 CH.2 OUT output Channel 2 filtered/amplified video output. 6-dB (2 V/V) gain from CH.2 IN through the 5th-order 36-MHz Butterworth filter. Rail-to-rail; drives two 75-Ω lines per channel.
8 CH.1 OUT output Channel 1 filtered/amplified video output. 6-dB (2 V/V) gain from CH.1 IN through the 5th-order 36-MHz Butterworth filter. Rail-to-rail; drives two 75-Ω lines per channel.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package SOIC-8
Category Amplifiers/Comparators
Pins 8

Ordering variants

Same part, different packaging or reel option.

  • THS7316DRD
  • THS7316DR

CAD (KiCad official)

  • Symbol: THS7316DR
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: ths7316dr-etched.step / ths7316dr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ths7316dr.step / ths7316dr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (33 pp, sha256 9cda8c8bbf26aaaa, retrieved 2026-08-17, tier: manufacturer)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF