# THS6062IDGNR

**Texas Instruments** · Differential Amplifiers · MSOP-8-EP

THS6062IDGNR from Texas Instruments, in a MSOP-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1OUT | output | Output of receiver channel 1, part of a device specified for 90 mA typical output drive. |
| 2 | 1IN− | input | Inverting input of receiver channel 1. |
| 3 | 1IN+ | input | Non-inverting input of receiver channel 1. |
| 4 | −VCC | power_in | Negative supply rail; the device operates from 5 V single supply or ±5 V to ±15 V split supplies. |
| 5 | 2IN+ | input | Non-inverting input of receiver channel 2. |
| 6 | 2IN− | input | Inverting input of receiver channel 2. |
| 7 | 2OUT | output | Output of receiver channel 2, part of a device specified for 90 mA typical output drive. |
| 8 | VCC+ | power_in | Positive supply rail; the device operates from 5 V single supply or ±5 V to ±15 V split supplies. |
| 9 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | MSOP-8-EP |
| Category | Amplifiers/Comparators |
| Pins | 9 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Dual supply voltage operating range | VCC | 2.25 |  | 16.5 | V | Dual supply, ±VCC | 4 |
| Single supply voltage operating range | VCC | 4.5 |  | 33 | V | Single supply | 4 |
| Supply current (per amplifier) | ICC |  | 8.5 | 10 | mA | VCC = ±15 V, TA = 25°C | 4 |
| Supply current (per amplifier) | ICC |  |  | 11 | mA | VCC = ±15 V, TA = full range | 4 |
| Supply current (per amplifier) | ICC |  | 7.5 | 9 | mA | VCC = ±5 V, TA = 25°C | 4 |
| Supply current (per amplifier) | ICC |  |  | 10.5 | mA | VCC = ±5 V, TA = full range | 4 |
| Supply current (per amplifier) | ICC |  | 7.3 | 9 | mA | VCC = ±2.5 V, TA = 25°C | 4 |
| Input offset voltage | VIO |  | 1.5 | 6 | mV | VCC = ±5 V or VCC = ±15 V, TA = 25°C | 4 |
| Input offset voltage | VIO |  |  | 8 | mV | VCC = ±5 V or VCC = ±15 V, TA = full range | 4 |
| Input bias current | IIB |  | 3 | 6 | μA | VCC = ±5 V or VCC = ±15 V, TA = 25°C | 4 |
| Input bias current | IIB |  |  | 8 | μA | VCC = ±5 V or VCC = ±15 V, TA = full range | 4 |
| Input offset current | IOS |  | 30 | 250 | nA | VCC = ±5 V or VCC = ±15 V, TA = 25°C | 4 |
| Input offset current | IOS |  |  | 400 | nA | VCC = ±5 V or VCC = ±15 V, TA = full range | 4 |
| Recommended dual supply voltage | VCC+ and VCC– | 2.5 |  | 16 | V | Dual supply | 3 |
| Recommended single supply voltage | VCC– | 5 |  | 32 | V | Single supply | 3 |
| Operating free-air temperature (I-suffix) | TA | -40 |  | 85 | °C | I-suffix | 3 |
| Supply voltage VCC+ to VCC– | VCC+ to VCC– |  |  | 33 | V | Absolute maximum | 3 |
| Output current | IO |  |  | 150 | mA | Absolute maximum | 3 |
| Differential input voltage | VIO | -4 |  | 4 | V | Absolute maximum, printed ±4 V | 3 |
| Operating free-air temperature (I-suffix) | TA | -40 |  | 85 | °C | I-suffix | 3 |
| Maximum junction temperature | TJ |  |  | 150 | °C |  | 3 |
| Storage temperature | Tstg | -65 |  | 150 | °C |  | 3 |
| Lead temperature |  |  |  | 300 | °C | 1.6 mm (1/16 inch) from case for 10 seconds | 3 |
| Junction-to-ambient thermal resistance (DGN) | θJA |  | 58.4 |  | °C/W | DGN package, 2 oz trace and copper pad soldered to 3 in × 3 in PC board | 3 |
| Junction-to-case thermal resistance (DGN) | θJC |  | 4.7 |  | °C/W | DGN package | 3 |
| Power rating (DGN) |  |  | 2.14 |  | W | DGN package, TA = 25°C | 3 |

## CAD (KiCad official)

- Symbol: `THS6062IDGNR`
- Footprint: `Package_SO:MSOP-8-1EP_3x3mm_P0.65mm_EP1.5x1.8mm`
- 3D model: MSOP-8-EP (KiCad packages3D, STEP)
- 3D model files: `ths6062idgnr-etched.step` / `ths6062idgnr-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `ths6062idgnr.step` / `ths6062idgnr.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/cn/lit/gpn/ths6062) (39 pp, sha256 `4c796f6a469b3b81`, retrieved 2026-10-08, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/ths6062idgnr-datasheet.pdf)