# THS3121IDGN

**Texas Instruments** · Operational Amplifier · HVSSOP-8-EP

THS3121IDGN from Texas Instruments, in a HVSSOP-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | NC | unconnected | No internal connection; this pin can be left floating or tied to any potential. |
| 2 | VIN- | power_in | Inverting input of the current-feedback amplifier. |
| 3 | VIN+ | power_in | Noninverting input of the current-feedback amplifier. |
| 4 | VS- | power_in | Negative power supply pin, rated from -5 V to -15 V in dual-supply operation. |
| 5 | NC | unconnected | No internal connection; this pin can be left floating or tied to any potential. |
| 6 | VOUT | output | Amplifier output, capable of driving up to 475 mA into a load. |
| 7 | VS+ | power_in | Positive power supply pin, rated from +5 V to +15 V in dual-supply operation. |
| 8 | NC | unconnected | No internal connection; this pin can be left floating or tied to any potential. |
| 9 | PowerPAD | passive | Exposed thermal pad on the package underside, electrically isolated from the die and all leads; solder to a thermally dissipating copper plane (may be tied to VS- or GND) for proper heat sinking. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | HVSSOP-8-EP |
| Category | Amplifiers/Comparators |
| Pins | 9 |

## CAD (KiCad official)

- Symbol: `THS3121IDGN`
- Footprint: `Package_SO:HVSSOP-8-1EP_3x3mm_P0.65mm_EP1.57x1.89mm`
- 3D model: HVSSOP-8-EP, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 1.0 mm nominal HVSSOP height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
- 3D model files: `ths3121idgn-etched.step` / `ths3121idgn-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `ths3121idgn.step` / `ths3121idgn.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/cn/lit/gpn/ths3120) (41 pp, sha256 `7e1cce918ad705c4`, retrieved 2026-10-01, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.2`, primary `claude-haiku-4-5-20251001` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/ths3121idgn-datasheet.pdf)